The XC7K325T-2FB900I is a powerful Kintex-7 series FPGA (Field-Programmable Gate Array) from AMD Xilinx, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and industrial automation. This versatile programmable logic device combines high logic density with advanced DSP capabilities, making it an ideal choice for complex digital signal processing and high-speed data processing applications.
Product Specifications
Core Architecture
The XC7K325T-2FB900I features AMD Xilinx’s advanced 28nm process technology, providing optimal balance between performance and power consumption. This FPGA incorporates the proven Kintex-7 architecture with enhanced capabilities for modern design requirements.
Key Technical Specifications
- Logic Cells: 325,824 logic cells providing extensive programmable resources
- Look-Up Tables (LUTs): 203,800 6-input LUTs for flexible logic implementation
- Flip-Flops: 407,600 flip-flops for sequential logic operations
- Block RAM: 16,020 Kb total block RAM for efficient data storage
- DSP Slices: 840 DSP48E1 slices optimized for high-performance signal processing
- Package Type: FB900 – 900-pin Flip Chip BGA package
- Speed Grade: -2 speed grade offering balanced performance and power
- Temperature Grade: Industrial temperature range (-40°C to +100°C)
- I/O Pins: 500 user I/O pins supporting various signaling standards
- Memory Interface: Support for DDR3-1866 memory interfaces
- Transceivers: 16 GTX transceivers supporting up to 12.5 Gbps data rates
Performance Characteristics
The XC7K325T-2FB900I delivers exceptional performance metrics with clock frequencies exceeding 400 MHz for typical applications. The integrated DSP blocks support multiply-accumulate operations at up to 741 MHz, enabling high-throughput digital signal processing implementations.
Price Information
Pricing for the XC7K325T-2FB900I varies based on order quantity, delivery requirements, and current market conditions. The device is positioned in the mid-to-high range of the Kintex-7 family, reflecting its substantial logic capacity and advanced features.
For current pricing and availability information:
- Contact authorized AMD Xilinx distributors
- Request quotes through official channel partners
- Volume pricing available for production quantities
- Engineering samples may be available for qualified customers
The XC7K325T-2FB900I represents excellent value considering its comprehensive feature set and proven reliability in demanding applications.
Documents & Media
Technical Documentation
Comprehensive documentation package includes detailed specifications, design guidelines, and implementation resources:
- Product datasheet with complete electrical and timing specifications
- Kintex-7 FPGA User Guide covering architecture details and design considerations
- Package and pinout documentation for FB900 package
- Power estimation and thermal management guidelines
- Configuration and startup sequence documentation
Design Resources
- Reference designs demonstrating key capabilities
- IP core documentation for integrated functions
- Timing analysis and constraint examples
- PCB design guidelines and layout recommendations
- Signal integrity considerations for high-speed interfaces
Software Tools
The XC7K325T-2FB900I is fully supported by AMD Xilinx development tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- IP catalog with pre-verified intellectual property cores
- Simulation libraries and models for design verification
- Programming and configuration utilities
Related Resources
Development Platforms
Several evaluation and development platforms support the XC7K325T-2FB900I, enabling rapid prototyping and system validation:
- Kintex-7 FPGA evaluation boards featuring the XC7K325T-2FB900I
- Third-party development platforms and carrier cards
- Custom evaluation solutions for specific applications
Complementary Products
The XC7K325T-2FB900I integrates seamlessly with other AMD Xilinx products:
- Zynq-7000 SoCs for ARM processor integration
- Spartan-7 FPGAs for cost-optimized companion functions
- Ultrascale+ devices for next-generation system migration
Application Solutions
Industry-specific reference designs and solutions leverage the XC7K325T-2FB900I capabilities:
- Software-defined radio implementations
- Video processing and broadcasting equipment
- High-speed data acquisition systems
- Industrial automation and control applications
- Aerospace and defense signal processing
Technical Support
Comprehensive support resources ensure successful implementation:
- AMD Xilinx technical support portal
- Community forums and knowledge base
- Training courses and certification programs
- Field application engineer assistance
Environmental & Export Classifications
Environmental Compliance
The XC7K325T-2FB900I meets stringent environmental standards and regulations:
- RoHS Compliance: Fully compliant with EU RoHS directive for hazardous substance restrictions
- REACH Registration: Registered under European REACH regulation
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Green Package: Lead-free and halogen-free package options available
Temperature and Operating Conditions
- Operating Temperature: -40°C to +100°C junction temperature (Industrial grade)
- Storage Temperature: -65°C to +150°C
- Humidity: Non-condensing humidity up to 85% RH
- Altitude: Operational up to 2000 meters above sea level
Export Control and Trade Compliance
The XC7K325T-2FB900I is subject to various export control regulations:
- ECCN Classification: Export Control Classification Number as designated by relevant authorities
- Country Restrictions: Compliance with applicable trade sanctions and export restrictions
- End-Use Restrictions: Subject to dual-use technology export controls
- Documentation Requirements: Proper export documentation required for international shipments
Quality and Reliability Standards
- Qualification Standards: Qualified to JEDEC and military standards where applicable
- Quality Management: Manufactured under ISO 9001 quality management systems
- Reliability Testing: Comprehensive reliability qualification including temperature cycling, thermal shock, and life testing
- Traceability: Full manufacturing traceability for quality control and compliance
The XC7K325T-2FB900I represents a mature, well-supported FPGA solution suitable for demanding applications requiring high performance, reliability, and regulatory compliance. Its comprehensive documentation, development ecosystem, and proven track record make it an excellent choice for both new designs and existing system upgrades.
