Product Specification
The XC7K325T-1FF676I is a premium field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, engineered to deliver exceptional performance for demanding digital signal processing and embedded system applications. This industrial-grade FPGA combines advanced 28nm technology with robust design capabilities.
Key Technical Specifications:
Logic Resources:
- Logic Cells: 326,080
- Configurable Logic Blocks (CLBs): 50,950
- Flip-Flops: 407,600
- LUT (Look-Up Tables): 203,800
- Block RAM: 16.06 Mb total
- Block RAM Blocks: 890
Memory and DSP Capabilities:
- DSP48E1 Slices: 840
- Maximum Distributed RAM: 6.4 Mb
- Memory Controllers: DDR3-1866 support
- PCI Express: Gen2 x8 lanes
I/O and Connectivity:
- Maximum User I/O: 400 pins
- Package Type: FF676 (Fine-Pitch Ball Grid Array)
- Speed Grade: -1 (standard performance)
- Temperature Grade: Industrial (-40°C to +100°C)
Clock Management:
- Mixed-Mode Clock Managers (MMCMs): 10
- Phase-Locked Loops (PLLs): 6
- Global Clock Buffers: 32
The XC7K325T-1FF676I features Xilinx’s advanced 7-series architecture, providing optimal power efficiency while maintaining high-speed performance for complex digital designs.
Price
The XC7K325T-1FF676I is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and industrial-grade specifications. Contact authorized distributors for current pricing information, as costs vary based on order quantity, packaging options, and regional availability.
Pricing Factors:
- Volume discounts available for bulk orders
- Extended temperature range variants may affect pricing
- Development tools and licensing considerations
- Lead times may impact final cost
For accurate pricing and availability of the XC7K325T-1FF676I, consult with official Xilinx distributors or authorized electronics suppliers.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation guidelines and best practices
- Package Information: Detailed pinout diagrams and mechanical drawings
- Power Consumption Guide: Thermal analysis and power estimation tools
Development Resources
- Vivado Design Suite: Primary development environment for XC7K325T-1FF676I
- Reference Designs: Pre-built examples and application notes
- IP Core Library: Verified intellectual property blocks
- Simulation Models: SPICE and behavioral models for system verification
Support Materials
- Application Notes: Design optimization techniques and troubleshooting guides
- White Papers: Advanced implementation strategies and performance analysis
- Video Tutorials: Step-by-step development workflows
- Community Forums: Peer support and design collaboration
Related Resources
Development Boards
- Kintex-7 FPGA KC705 Evaluation Kit: Full-featured development platform
- Custom carrier boards: Third-party solutions optimized for XC7K325T-1FF676I
- Prototyping modules: Rapid development and testing platforms
Compatible Components
- Power Management ICs: Optimized power supply solutions
- Clock Generation: High-precision oscillators and clock distribution
- Memory Interfaces: DDR3/DDR4 memory modules and controllers
- Connectivity Solutions: PCIe, Ethernet, and high-speed serial interfaces
Software Tools
- Vivado Design Suite: Complete design flow from synthesis to implementation
- SDK (Software Development Kit): Embedded processor development environment
- ChipScope Pro: Real-time debugging and analysis tools
- Power Estimator (XPE): Accurate power consumption analysis
Training and Support
- Technical Training: Comprehensive FPGA design courses
- Design Services: Professional implementation and optimization support
- Online Resources: Extensive documentation and community support
Environmental & Export Classifications
Environmental Compliance
The XC7K325T-1FF676I meets stringent environmental standards ensuring reliable operation across diverse applications:
RoHS Compliance: Fully compliant with Restriction of Hazardous Substances directive REACH Regulation: Complies with European chemical safety requirements Halogen-Free: Environmentally conscious packaging materials Pb-Free: Lead-free soldering and assembly processes
Operating Conditions
- Temperature Range: -40°C to +100°C (Industrial grade)
- Humidity: 5% to 85% relative humidity, non-condensing
- Altitude: Up to 2000 meters above sea level
- Vibration Resistance: IEC 60068-2-6 compliant
- Shock Resistance: IEC 60068-2-27 standards
Export Classifications
ECCN (Export Control Classification Number): 3A001.a.7 HTS (Harmonized Tariff Schedule): 8542.31.0001 Country of Origin: Varies by manufacturing location Export Restrictions: Subject to US export administration regulations
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management standards
- IATF 16949: Automotive quality requirements (where applicable)
- IPC Standards: Electronics assembly and reliability standards
The XC7K325T-1FF676I undergoes rigorous testing and quality assurance processes, ensuring consistent performance and reliability in mission-critical applications across industrial, aerospace, telecommunications, and automotive sectors.
The XC7K325T-1FF676I represents cutting-edge FPGA technology, combining high-performance processing capabilities with industrial-grade reliability for next-generation digital systems.
