The XC7K325T-1FB900C represents Xilinx’s premier Kintex-7 FPGA solution, delivering exceptional performance and versatility for demanding applications. This powerful field-programmable gate array combines high logic density with advanced DSP capabilities, making it the ideal choice for telecommunications, aerospace, and high-performance computing applications.
Product Specifications
The XC7K325T-1FB900C features an impressive array of technical specifications that set it apart in the FPGA market:
Logic Resources:
- 326,080 logic cells providing extensive design flexibility
- 407,600 flip-flops for complex sequential logic implementations
- 203,800 6-input LUTs (Look-Up Tables) enabling efficient combinational logic
Memory Architecture:
- 16,020 Kb of block RAM supporting diverse memory requirements
- 1,540 block RAM/FIFO tiles with 36Kb each
- Distributed RAM capability for small, fast memory implementations
DSP Performance:
- 840 DSP48E1 slices delivering superior signal processing performance
- 25×18 multipliers optimized for high-speed arithmetic operations
- Dedicated DSP blocks supporting complex mathematical functions
I/O Capabilities:
- 500 user I/O pins in the FB900 package configuration
- Support for multiple I/O standards including LVDS, SSTL, and HSTL
- High-speed serial transceivers for advanced connectivity
Package Details:
- FB900 Fine-Pitch BGA package measuring 31mm x 31mm
- 900-ball configuration ensuring optimal signal integrity
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- Speed grade -1 providing balanced performance and power consumption
Price Information
The XC7K325T-1FB900C is competitively priced within the high-performance FPGA segment. Pricing varies based on quantity, distribution channel, and current market conditions. For the most accurate and up-to-date pricing information on the XC7K325T-1FB900C, we recommend contacting authorized Xilinx distributors or visiting official pricing portals. Volume discounts are typically available for production quantities, making this FPGA solution cost-effective for both prototyping and mass production applications.
Educational institutions and qualifying research organizations may be eligible for special academic pricing programs. Contact your local Xilinx representative for details on academic discounts and development support programs.
Documents & Media
Comprehensive documentation and media resources are available for the XC7K325T-1FB900C to support your design and implementation process:
Technical Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- Pin-out diagrams and package mechanical drawings
- PCB design guidelines and layout recommendations
- Power consumption analysis and thermal management guides
Development Resources:
- Vivado Design Suite compatibility information
- IP core integration guidelines
- Reference designs and application notes
- Hardware debugging and validation procedures
Software Support:
- Latest Vivado Design Suite versions with full XC7K325T-1FB900C support
- ChipScope Pro compatibility for advanced debugging
- SDK integration for embedded processor implementations
- Simulation models for major EDA tools
Video Resources:
- Technical overview presentations
- Design methodology tutorials
- Application-specific implementation guides
- Troubleshooting and optimization techniques
Related Resources
The XC7K325T-1FB900C ecosystem includes numerous complementary products and resources:
Development Boards:
- Kintex-7 KC705 Evaluation Kit featuring the XC7K325T-1FB900C
- Third-party development platforms optimized for this FPGA
- Custom carrier boards for specific application requirements
IP Portfolio:
- Xilinx LogiCORE IP library with pre-verified components
- DSP-focused IP cores leveraging the 840 DSP48E1 slices
- Memory controller IP for external DDR3/DDR4 interfaces
- High-speed serial protocol IP cores
Design Services:
- Xilinx Alliance Program partners offering design services
- Training courses and certification programs
- Technical support through official channels
- Community forums and knowledge base access
Competitive Analysis:
- Performance comparisons with similar FPGA families
- Migration guides from previous generation devices
- Cost-benefit analysis tools and calculators
Environmental & Export Classifications
The XC7K325T-1FB900C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Conflict minerals reporting program participation
- ISO 14001 environmental management system certification
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive grade versions available (XC7K325T-1FB900I)
- Extended temperature range options for harsh environments
- Comprehensive quality and reliability testing programs
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- Export licensing requirements vary by destination country
- Compliance with U.S. Export Administration Regulations (EAR)
- International Traffic in Arms Regulations (ITAR) considerations for specific applications
Packaging and Shipping:
- Anti-static packaging meeting JEDEC standards
- Moisture sensitivity level (MSL) classification provided
- Traceability documentation for supply chain management
- Environmentally conscious packaging materials
The XC7K325T-1FB900C represents a powerful solution for engineers seeking high-performance FPGA capabilities with comprehensive support resources. Its combination of logic density, DSP performance, and extensive I/O options makes it suitable for the most demanding applications while maintaining cost-effectiveness for volume production. Whether you’re developing next-generation telecommunications equipment, aerospace systems, or high-performance computing solutions, the XC7K325T-1FB900C provides the performance and reliability your project demands.
