“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC7K325T-1FB676C: High-Performance Kintex-7 FPGA Solution

Original price was: $20.00.Current price is: $19.00.

The XC7K325T-1FB676C is a powerful Kintex-7 FPGA (Field-Programmable Gate Array) from Xilinx, designed to deliver exceptional performance for demanding applications requiring high-speed processing and flexible programmability. This advanced FPGA combines optimal power efficiency with superior processing capabilities, making it an ideal choice for telecommunications, aerospace, defense, and industrial automation systems.

Product Specification

The XC7K325T-1FB676C features robust specifications that make it suitable for complex digital signal processing and high-performance computing applications:

Core Specifications:

  • Logic Cells: 326,080 logic cells providing extensive programmable resources
  • CLB Slices: 50,950 Configurable Logic Block slices for flexible logic implementation
  • Block RAM: 16,020 Kb total block RAM for efficient data storage and buffering
  • DSP Slices: 840 DSP48E1 slices optimized for high-performance arithmetic operations
  • Package Type: FB676 Fine-pitch Ball Grid Array (BGA) package
  • Speed Grade: -1 speed grade ensuring reliable performance across temperature ranges
  • I/O Pins: 400 user I/Os supporting various signaling standards
  • Memory Interface: DDR3-1866 memory controller support for high-bandwidth applications
  • PCI Express: Integrated PCIe Gen2 x8 endpoint and root port capabilities

Operating Conditions:

  • Supply Voltage: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
  • Operating Temperature: Commercial grade (-40ยฐC to +85ยฐC junction temperature)
  • Power Consumption: Optimized for low-power applications with advanced power management

Price

The XC7K325T-1FB676C pricing varies based on quantity, distributor, and current market conditions. For the most competitive pricing and volume discounts:

  • Single Unit Price: Contact authorized distributors for current pricing
  • Volume Pricing: Significant discounts available for quantities over 100 units
  • OEM Pricing: Special pricing programs available for original equipment manufacturers
  • Lead Time: Standard lead times range from 12-16 weeks, with expedited options available

Note: Prices are subject to change based on market conditions and availability. Contact authorized Xilinx distributors for real-time pricing and stock information.

Documents & Media

Comprehensive technical documentation and development resources are available for the XC7K325T-1FB676C:

Technical Documentation:

  • Datasheet: Complete electrical specifications, timing parameters, and package information
  • User Guide: Detailed implementation guidelines and design recommendations
  • Migration Guide: Instructions for upgrading from previous FPGA generations
  • Packaging and Pinout Guide: Comprehensive pin assignment and package specifications

Development Tools:

  • Vivado Design Suite: Latest FPGA design software with synthesis and implementation tools
  • IP Catalog: Pre-verified IP cores including processors, interfaces, and DSP functions
  • Reference Designs: Proven design examples for common applications
  • Application Notes: Technical papers covering specific implementation strategies

Evaluation Resources:

  • Development Boards: KC705 and other evaluation platforms featuring the XC7K325T-1FB676C
  • Demo Designs: Ready-to-run demonstrations showcasing FPGA capabilities
  • Video Tutorials: Step-by-step guides for getting started with Kintex-7 development

Related Resources

The XC7K325T-1FB676C ecosystem includes numerous complementary products and resources:

Compatible Devices:

  • XC7K325T-2FB676C: Higher speed grade variant (-2) for enhanced performance requirements
  • XC7K160T-1FB676C: Lower-density option in the same package for cost-sensitive applications
  • XC7K410T-1FB676C: Higher-capacity device for more complex designs

Development Ecosystem:

  • Zynq-7000 SoCs: ARM processor-based devices for embedded applications
  • Configuration Devices: Quad-SPI and parallel flash memory solutions
  • Power Management: Dedicated PMICs optimized for Kintex-7 FPGAs
  • Clock Generation: Low-jitter clock synthesizers and oscillators

Third-Party Support:

  • EDA Tools: Support for popular third-party design tools and simulation environments
  • IP Providers: Extensive ecosystem of specialized IP core vendors
  • Board Support: Wide range of carrier cards and development platforms
  • Training Resources: Comprehensive educational programs and certification courses

Environmental & Export Classifications

The XC7K325T-1FB676C meets stringent environmental and regulatory requirements for global deployment:

Environmental Compliance:

  • RoHS Compliant: Meets EU Restriction of Hazardous Substances directive requirements
  • REACH Compliant: Complies with European chemical safety regulations
  • Halogen-Free: Environmentally friendly package materials
  • Conflict Minerals: Compliant with conflict minerals reporting requirements

Quality Standards:

  • Automotive Grade: AEC-Q100 qualified versions available for automotive applications
  • Industrial Grade: Extended temperature range options for harsh environments
  • Military/Aerospace: Defense-grade variants meeting MIL-STD specifications
  • ISO Certification: Manufactured in ISO 9001:2015 certified facilities

Export Classifications:

  • ECCN Classification: 3A001.a.7 under U.S. Export Administration Regulations
  • Export Licensing: May require export license for certain destinations
  • ITAR Compliance: Commercial grade devices not subject to ITAR restrictions
  • International Standards: Complies with international trade and safety regulations

Reliability & Testing:

  • MTBF Rating: High reliability ratings based on extensive qualification testing
  • Burn-in Testing: Available with extended burn-in for critical applications
  • Statistical Quality Control: Rigorous quality monitoring throughout production
  • Failure Analysis: Comprehensive failure analysis and corrective action programs

The XC7K325T-1FB676C represents a proven solution for high-performance FPGA applications, backed by comprehensive documentation, robust development tools, and worldwide support infrastructure. Its combination of processing power, flexibility, and reliability makes it an excellent choice for next-generation electronic systems requiring programmable logic solutions.