Product Overview
The XC7K160T-2FBG676C is a high-performance Kintex-7 family Field Programmable Gate Array (FPGA) manufactured by AMD (formerly Xilinx). This advanced 28nm technology FPGA delivers exceptional price-performance optimization with 162,240 logic cells, making it ideal for telecommunications, data processing, industrial automation, and high-performance computing applications.
Built on state-of-the-art 28nm High-K Metal Gate (HKMG) process technology, the XC7K160T-2FBG676C provides up to 50% lower power consumption compared to previous generation devices while delivering superior system performance with 2.9 Tb/s I/O bandwidth and 5.3 TMAC/s DSP capabilities.
1. Product Specifications
Core Technical Specifications
Part Number: XC7K160T-2FBG676C
Manufacturer: AMD (Xilinx)
Product Family: Kintex-7 FPGAs
Package Type: 676-Pin Lidless FCBGA (Fine-Pitch Ball Grid Array)
Technology Node: 28nm HKMG (High-K Metal Gate)
Logic & Memory Resources
- Logic Cells: 162,240 cells
- Configurable Logic Blocks (CLBs): 25,350 CLBs
- Look-Up Tables (LUTs): Advanced 6-input LUT technology
- Flip-Flops: High-density flip-flop array
- Block RAM: 11,700 Kbit total RAM capacity
- DSP Slices: High-performance DSP48E1 slices for signal processing
I/O & Connectivity
- User I/O Pins: 400 configurable I/O pins
- Total Package Pins: 676 pins
- High-Speed Transceivers: Integrated GTP transceivers
- I/O Standards: Support for multiple voltage standards and protocols
- Maximum I/O Bandwidth: 2.9 Tb/s
Performance Characteristics
- Speed Grade: -2 (High performance grade)
- Maximum Operating Frequency: Up to 710 MHz (application dependent)
- DSP Performance: 5.3 TMAC/s (Tera Multiply-Accumulate per second)
- Power Efficiency: 50% reduction vs. previous generation
Electrical Specifications
- Core Voltage (VCCINT): 1.0V ยฑ5% (0.97V to 1.03V)
- I/O Voltage (VCCO): 1.2V to 3.3V (bank dependent)
- Power Consumption: 10W to 20W (design dependent)
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Junction Temperature: -40ยฐC to +100ยฐC
Package Details
- Package Style: FCBGA (Flip Chip Ball Grid Array)
- Package Configuration: Lidless design for improved thermal performance
- Package Dimensions: 27mm x 27mm x 1.84mm
- Ball Pitch: 1.0mm
- Mounting Type: Surface Mount Technology (SMT)
- Moisture Sensitivity Level (MSL): Level 4
- Maximum Reflow Temperature: 250ยฐC
2. Pricing Information
Market Pricing Overview
The XC7K160T-2FBG676C pricing varies based on quantity, supplier, and market conditions. Current market pricing typically ranges from competitive levels for volume purchases to premium pricing for smaller quantities.
Pricing Factors:
- Order quantity (volume discounts available)
- Supplier location and inventory levels
- Lead time requirements
- Market demand fluctuations
Availability Status:
- โ In Stock at major distributors
- โ New Original components available
- โ Factory Fresh with full manufacturer warranty
- โ RoHS Compliant environmental standards
Volume Pricing
For current pricing and volume discounts on the XC7K160T-2FBG676C, contact authorized distributors:
- DigiKey Electronics
- Mouser Electronics
- Avnet
- Arrow Electronics
- Other authorized AMD/Xilinx distributors
Note: Prices are subject to change based on market conditions and availability. Contact suppliers directly for current quotations and lead times.
3. Documents & Media
Official Documentation
Datasheet & Technical References:
- Kintex-7 Family Datasheet (DS182) – Complete electrical and timing specifications
- XC7K160T-2FBG676C Product Brief – Key features and application guidelines
- Package Information – Mechanical drawings and pinout details
- Thermal Design Guidelines – Thermal management recommendations
Design Resources:
- Pinout Documentation – Complete pin assignment and configuration guide
- PCB Layout Guidelines – Best practices for board design
- Signal Integrity Guidelines – High-speed design considerations
- Power Distribution Networks – Power supply design recommendations
Development Tools & Software
Primary Design Software:
- Vivado Design Suite – Complete FPGA development environment
- Synthesis and implementation tools
- Timing analysis and optimization
- IP integration and customization
- Hardware debugging capabilities
Additional Tools:
- Vivado HLS – High-Level Synthesis for C/C++ to RTL conversion
- SDK (Software Development Kit) – Embedded software development
- ModelSim – Third-party simulation tool integration
- Power Estimator Tools – Power consumption analysis
Application Notes & Reference Designs
- High-Speed I/O Design – Guidelines for optimal signal integrity
- Clock Management – PLL and MMCM configuration examples
- DSP Implementation – Signal processing reference designs
- Memory Interface – DDR3/DDR4 controller implementations
- Communication Protocols – PCIe, Ethernet, and serial interface examples
4. Related Resources
Development Boards & Evaluation Kits
Recommended Evaluation Platforms:
- KC705 – Kintex-7 FPGA evaluation board
- AC701 – Artix-7 evaluation board (for comparison)
- Custom Development Boards – Third-party solutions available
Compatible Components
Complementary Products:
- Memory Solutions: DDR3/DDR4 SODIMM modules
- Clock Sources: Low-jitter oscillators and clock generators
- Power Management: Switching regulators and linear regulators
- Connectors: High-speed mezzanine and expansion connectors
Alternative & Related Parts
Kintex-7 Family Alternatives:
- XC7K325T-2FBG676C – Higher logic capacity (325K cells)
- XC7K70T-2FBG676C – Lower cost option (70K cells)
- XC7K410T-2FBG676C – Maximum performance variant
Cross-Family Options:
- Artix-7 Series – Cost-optimized solutions
- Virtex-7 Series – Highest performance applications
- Zynq-7000 Series – ARM processor + FPGA integration
Technical Support Resources
Community & Support:
- AMD Support Forums – Community-driven technical discussions
- Design Hub – Application notes and reference designs
- Training Resources – Online courses and tutorials
- Technical Webinars – Regular technology updates and best practices
Professional Services:
- Design Consulting – Expert design assistance
- IP Licensing – Pre-verified intellectual property cores
- Custom Solutions – Tailored development services
5. Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- โ RoHS 2011/65/EU Compliant – Restriction of Hazardous Substances
- โ Lead-Free Compatible – Suitable for lead-free solder processes
- โ Halogen-Free Option – Environmental-friendly packaging available
Material Composition:
- Solder Ball Material: Tin/Silver/Copper (SAC305: Sn96.5Ag3.0Cu0.5)
- Package Substrate: FR4 with copper traces
- Die Attach: Lead-free materials throughout
- Mold Compound: Halogen-free epoxy resin
Export Control & Trade Classifications
Export Control Classifications:
ECCN (Export Control Classification Number):
- Classification: 3A991.d
- Country Coverage: Standard commercial export controls apply
- License Requirements: Check current regulations for specific destinations
Harmonized Tariff Codes:
United States (USHTS):
- Code: 8542390001
- Description: Electronic integrated circuits, processors and controllers
China (CNHTS):
- Code: 8542399000
- Description: Other electronic integrated circuits
European Union (TARIC):
- Code: 8542399000
- Description: Electronic integrated circuits and microassemblies
Regulatory Certifications
Quality Standards:
- ISO 9001:2015 – Quality management systems
- ISO 14001 – Environmental management compliance
- IATF 16949 – Automotive quality standards (where applicable)
Safety & Reliability:
- IPC Standards – Electronic manufacturing standards compliance
- JEDEC Standards – Semiconductor reliability testing
- AEC-Q100 – Automotive electronics council qualification (specific grades)
Packaging & Shipping
Anti-Static Protection:
- ESD Safe Packaging – Conductive tray and anti-static bag
- Moisture Barrier Bag – MSL-4 compatible moisture protection
- Desiccant Packs – Humidity control during storage and transport
Shipping Classifications:
- UN Classification: Not classified as dangerous goods
- Transport Mode: Air, ground, and sea freight compatible
- Special Handling: ESD precautions required during handling
Applications & Use Cases
The XC7K160T-2FBG676C excels in demanding applications requiring high-performance programmable logic:
Primary Applications:
- Telecommunications Infrastructure – Base stations, routers, switches
- Industrial Automation – Motion control, machine vision, robotics
- Medical Electronics – Imaging systems, diagnostic equipment
- Aerospace & Defense – Radar systems, signal processing, communications
- High-Performance Computing – Acceleration, parallel processing
- Video & Broadcast – 4K/8K video processing, encoding, streaming
Key Benefits:
- High Logic Density – Complex designs in single device
- Low Power Consumption – Extended battery life and reduced cooling
- Superior I/O Performance – High-bandwidth data interfaces
- Flexible Architecture – Adaptable to changing requirements
- Proven Reliability – Industrial-grade quality and testing
For technical support, pricing inquiries, and detailed specifications, contact your local AMD/Xilinx distributor or visit the official AMD FPGA product pages.
