The XC7K160T-1FF676I is a powerful field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding digital signal processing, communications, and embedded processing applications. This advanced FPGA combines high logic density with optimized power consumption, making it ideal for next-generation electronic designs.
Product Specifications
Core Architecture
The XC7K160T-1FF676I features Xilinx’s advanced 28nm CMOS technology, delivering superior performance per watt. Key specifications include:
- Logic Cells: 162,240 logic cells providing extensive design flexibility
- CLB Slices: 25,350 configurable logic block slices for complex digital implementations
- Block RAM: 11,700 Kb of block RAM for efficient data storage and buffering
- DSP Slices: 600 DSP48E1 slices optimized for high-performance signal processing
- Package: FF676 BGA (Ball Grid Array) package with 676 pins
- Speed Grade: -1 speed grade offering balanced performance and power consumption
- Temperature Grade: Industrial temperature range (-40ยฐC to +100ยฐC)
I/O and Connectivity Features
The XC7K160T-1FF676I provides comprehensive connectivity options:
- User I/O: Up to 400 user I/O pins supporting various voltage standards
- Memory Interface: Support for DDR3, DDR3L, and LPDDR2 memory controllers
- High-Speed Serial: Integrated transceivers for high-speed serial communication
- Clock Management: Advanced clocking resources with mixed-mode clock managers (MMCM) and phase-locked loops (PLL)
Pricing Information
The XC7K160T-1FF676I pricing varies based on quantity, distributor, and market conditions. Typical pricing ranges:
- Single Unit: $800 – $1,200 USD
- Volume Pricing (100+ units): Contact authorized distributors for competitive pricing
- Engineering Samples: Available through Xilinx partner programs
Note: Prices are subject to change and may vary by region and supplier. Contact authorized Xilinx distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Product Brief: Comprehensive overview of XC7K160T-1FF676I features and capabilities
- Datasheet: Detailed electrical specifications, timing parameters, and package information
- User Guide: Complete implementation guide with design recommendations
- Package and Pinout Information: FF676 package mechanical drawings and pin assignments
- Power Estimation Tools: Xilinx Power Estimator (XPE) spreadsheets for power analysis
Development Resources
- Vivado Design Suite: Professional FPGA development environment
- Reference Designs: Pre-verified IP cores and example projects
- Application Notes: Design guidelines for optimal XC7K160T-1FF676I implementation
- Video Tutorials: Step-by-step development guidance and best practices
Related Resources
Development Boards and Kits
Several evaluation platforms support the XC7K160T-1FF676I:
- KC705 Evaluation Kit: Professional development platform with comprehensive peripherals
- Custom Carrier Boards: Third-party solutions for specific application domains
- Prototyping Modules: Rapid development solutions for proof-of-concept designs
Compatible IP Cores
The XC7K160T-1FF676I supports extensive IP core libraries:
- Communication Protocols: Ethernet, PCIe, USB, and wireless communication IP
- Signal Processing: FFT, FIR filters, and digital up/down converters
- Video Processing: Video codecs, image processing, and display controllers
- Memory Controllers: DDR3/DDR4 memory interface controllers
Software Tools and Support
- Vivado HLS: High-level synthesis for C/C++ to RTL conversion
- SDK (Software Development Kit): Embedded software development environment
- ChipScope Pro: Real-time debugging and analysis tools
- Technical Support: Comprehensive online resources and community forums
Environmental & Export Classifications
Environmental Compliance
The XC7K160T-1FF676I meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing process meeting EU RoHS directive
- REACH Compliance: Compliant with EU REACH regulation for chemical safety
- Conflict Minerals: Sourced through conflict-free supply chains
- Green Package: Environmentally friendly packaging materials
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% relative humidity (non-condensing)
- Altitude: Up to 3,000 meters operational altitude
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Manufactured in TSMC facilities (Taiwan/China)
- Export Restrictions: Subject to US export administration regulations
Quality and Reliability Standards
The XC7K160T-1FF676I undergoes rigorous testing to ensure reliability:
- Qualification Standards: AEC-Q100 automotive qualification available
- Reliability Testing: Extensive temperature cycling, thermal shock, and life testing
- Quality Management: ISO 9001 certified manufacturing processes
- Failure Rate: Demonstrated low failure rates through accelerated testing
The XC7K160T-1FF676I represents cutting-edge FPGA technology, delivering the performance, flexibility, and reliability required for today’s most demanding applications. Whether you’re developing advanced communication systems, high-performance computing solutions, or next-generation embedded systems, this Kintex-7 FPGA provides the foundation for innovation and success.
