The XC7K160T-1FBG676I is a powerful field-programmable gate array (FPGA) from Xilinx’s Kintex-7 family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and industrial automation. This versatile programmable logic device combines high-speed processing capabilities with energy efficiency, making it an ideal choice for complex digital signal processing and embedded system designs.
Product Specifications
The XC7K160T-1FBG676I features robust specifications that enable sophisticated digital implementations:
Core Architecture:
- Logic Cells: 162,240 equivalent logic cells
- Configurable Logic Blocks (CLBs): 25,350 CLBs
- Block RAM: 11,700 Kb total block RAM capacity
- DSP Slices: 600 DSP48E1 slices for high-performance arithmetic operations
Memory and Processing:
- Distributed RAM: 1,188 Kb distributed RAM
- Maximum Memory Interfaces: Multiple high-speed memory controller support
- Processing Speed: Up to 464 MHz internal clock frequency
- I/O Performance: High-speed serial connectivity up to 12.5 Gbps
Package Details:
- Package Type: FBGA (Fine-pitch Ball Grid Array)
- Pin Count: 676 pins
- Package Size: 27mm x 27mm
- Speed Grade: -1 (standard performance grade)
- Operating Temperature: Industrial grade (-40°C to +100°C)
Connectivity Features:
- User I/O Pins: 400 user I/O pins
- High-Performance I/O Banks: Multiple voltage support (1.2V to 3.3V)
- SerDes Transceivers: 8 GTX transceivers
- PCIe Support: PCIe Gen2 x8 endpoint and root port
Price Information
The XC7K160T-1FBG676I pricing varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing information, as costs typically decrease with higher volume orders. Educational institutions and development partners may qualify for special pricing programs.
Documents & Media
Essential Documentation:
- XC7K160T-1FBG676I Product Brief and Datasheet
- Kintex-7 FPGA Data Sheet (DS182)
- Kintex-7 FPGA Configuration User Guide (UG470)
- 7 Series FPGA PCB Design Guide (UG483)
- Vivado Design Suite User Guide
Development Resources:
- Reference designs and application notes
- Power estimation spreadsheets
- Pin-out and packaging information
- Thermal characteristics documentation
- Signal integrity guidelines
Software Tools:
- Vivado Design Suite compatibility information
- IP core documentation
- Debugging and verification guides
Related Resources
Development Boards:
- KC705 Evaluation Board (compatible Kintex-7 development platform)
- Custom carrier boards supporting XC7K160T-1FBG676I
- Evaluation modules for rapid prototyping
Compatible IP Cores:
- Memory controllers (DDR3/DDR4)
- Communication interfaces (Ethernet, USB, PCIe)
- Digital signal processing cores
- Video and imaging processing IP
Design Tools:
- Vivado Design Suite (synthesis, implementation, debugging)
- SDK for embedded software development
- ChipScope Pro for in-system verification
- Power analysis tools
Training and Support:
- Xilinx University Program resources
- Technical documentation library
- Community forums and design hubs
- Professional services and consulting
Environmental & Export Classifications
Environmental Compliance: The XC7K160T-1FBG676I meets stringent environmental standards:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting compliant
- Green packaging standards
Operating Conditions:
- Junction Temperature Range: -40°C to +100°C
- Storage Temperature: -65°C to +150°C
- Humidity: 5% to 85% non-condensing
- Altitude: Up to 3,000 meters operational
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Varies by manufacturing location
- Export licensing requirements may apply for certain destinations
Quality Standards:
- Automotive qualified versions available (XQR7K160T variants)
- ISO 9001 certified manufacturing
- Military temperature grade options
- Extended lifecycle support available
The XC7K160T-1FBG676I represents a powerful solution for engineers developing next-generation electronic systems requiring high-performance programmable logic capabilities. Its combination of processing power, connectivity options, and reliability makes it suitable for applications ranging from wireless infrastructure to advanced driver assistance systems.
