The XC7372TM-12WC84C is a cutting-edge Erasable Programmable Logic Device (EPLD) from Xilinx’s XC7300 CMOS EPLD family, engineered for demanding applications requiring high-speed performance and flexible programmability. This advanced semiconductor component delivers exceptional speed and logic density in an 84-pin windowed ceramic package.
1. Product Specifications
Core Performance Features
- Device Family: XC7300 CMOS EPLD Series
- Part Number: XC7372TM-12WC84C
- Technology: 0.8ฮผm CMOS Process
- Operating Voltage: 5V
- Speed Grade: 12ns propagation delay
- Package Type: 84-Pin Windowed Ceramic Leaded Chip Carrier (WC84)
Logic Architecture
- Macrocells: 72 programmable macrocells
- Flip-Flops: 126 total flip-flops
- Function Blocks: 8 high-density function blocks
- Fast Inputs: 12 dedicated fast input pins
- Signal Pins: 84 user I/O pins
- 22V10 Equivalent: 8 devices
Advanced Architecture Features
The XC7372TM-12WC84C employs Xilinx’s innovative Dual-Block Architecture combining:
- Fast Function Blocks (FFBs): Optimized for ultra-fast pin-to-pin speeds (5-7.5ns) ideal for critical decoding and high-speed state machines
- High-Density Function Blocks: Maximum logic density for complex functions including adders, accumulators, and wide logic functions
- Universal Interconnect Matrix (UIM): Guarantees 100% internal connectivity between all functions
Power Management
- Programmable Power Control: Individual macrocell-level power management
- Automatic Power Down: Unused macrocells automatically power down to minimize consumption
- Selective Performance: Configure speed-critical paths for maximum performance while optimizing power on non-critical paths
2. Price Information
Pricing for XC7372TM-12WC84C varies based on quantity and supplier. Contact authorized distributors for current pricing:
- Small Quantities (1-99 units): Request quote from authorized distributors
- Volume Pricing (100+ units): Significant discounts available
- Engineering Samples: Available for qualified design projects
Note: Prices fluctuate based on market conditions and global component availability. Real-time pricing monitoring services track inventory and historical price trends across multiple suppliers.
3. Documents & Media
Technical Documentation
- XC7372TM-12WC84C Datasheet: Complete electrical specifications and timing parameters
- XC7300 Family User Guide: Comprehensive programming and design guidelines
- Application Notes: Design examples and best practices
- JEDEC Pinout Diagram: Detailed pin configuration and signal assignments
Design Resources
- Reference Designs: Pre-validated design examples and templates
- Evaluation Boards: XC7300 CMOS EPLD development platforms
- Programming Files: Sample JEDEC and configuration files
Software Support
- Xilinx Development Tools: Compatible with legacy ISE design tools
- Third-Party Support: Schematic entry tools, HDL compilers, and equation-based design entry
- Programming Software: Device configuration and verification utilities
4. Related Resources
Development Tools
- Xilinx ISE Design Suite: Legacy development environment for XC7300 series
- Third-Party CAD Tools: Compatible with industry-standard schematic capture and HDL tools
- Programming Hardware: Device programmers and in-system programming solutions
Complementary Products
- XC7336 Series: Lower-density options for cost-sensitive applications
- XC73108 Series: Higher-density alternatives for complex designs
- Evaluation Kits: Complete development platforms for rapid prototyping
Application Areas
- Industrial Control Systems: Motor control, process automation, and safety systems
- Telecommunications: Protocol converters, line cards, and switching equipment
- Automotive Electronics: Engine management, safety systems, and infotainment
- Test and Measurement: High-speed data acquisition and signal processing
Technical Support
- Online Forums: Active community support and design discussions
- Application Engineers: Direct technical assistance for complex designs
- Training Resources: Design tutorials and methodology guides
5. Environmental & Export Classifications
Operating Conditions
- Temperature Range:
- Commercial Grade (C): 0ยฐC to +70ยฐC
- Industrial Grade (I): -40ยฐC to +85ยฐC
- Humidity: 0% to 95% non-condensing
- Storage Temperature: -65ยฐC to +150ยฐC
Package Specifications
- Package Type: 84-Pin Windowed Ceramic Leaded Chip Carrier (CLCC)
- Package Dimensions: Standard JEDEC WC84 footprint
- Lead Finish: Gold-plated for enhanced reliability
- Window Material: Quartz for UV erasability
- Thermal Characteristics: ฮธJA = 35ยฐC/W (typical)
Environmental Compliance
- RoHS Compliant: Lead-free manufacturing process
- REACH Compliant: European chemical safety regulations
- Conflict Minerals: Compliant with Dodd-Frank Act requirements
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.2.a
- HTS Code: 8542.33.0001
- Country of Origin: Manufactured in various global facilities
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
Quality Standards
- Automotive Grade: AEC-Q100 qualified versions available
- Military Grade: MIL-STD-883 compliant options
- Quality Management: ISO 9001 certified manufacturing
- Reliability Testing: JEDEC standards for qualification and ongoing reliability
Contact Information: For technical support, pricing, or availability of the XC7372TM-12WC84C, contact authorized Xilinx distributors or visit official supplier websites for real-time inventory and pricing information.
