The XC7372TM is a cutting-edge programmable logic device from AMD Xilinx’s XC7300 CMOS EPLD family, designed to deliver exceptional performance for demanding digital applications. This advanced EPLD combines high-speed operation with maximum logic density through its innovative Dual-Block architecture.
1. Product Specifications
Core Features
The XC7372TM incorporates AMD Xilinx’s revolutionary Dual-Block architecture, featuring both Fast Function Blocks (FFBs) and High-Density Function Blocks for optimal performance versatility.
Technical Specifications:
- Macrocells: 72 programmable macrocells
- Function Blocks: 8 high-performance blocks
- Flip-Flops: 126 dedicated flip-flops
- Fast Inputs: 12 high-speed input pins
- Signal Pins: 84 I/O pins
- 22V10 Equivalent: 8 devices
- Pin-to-Pin Speed: 5/7.5 ns on all fast inputs
- Maximum Clock Frequency: Up to 167 MHz
- Technology Node: 0.8µ CMOS EPROM
- Package Type: PLCC (Plastic Leaded Chip Carrier)
Performance Characteristics
- Ultra-Fast Operation: 5-7.5 ns pin-to-pin delays
- High-Speed Arithmetic: 1 ns ripple-carry delay per bit
- 18-bit Accumulators: Operating at 43-61 MHz
- 100% Interconnect Matrix: Universal Interconnect Matrix (UIM) ensures complete connectivity
- Multiple Clock Domains: Independent clock capabilities
Power and Environmental
- Operating Voltage: 3.3V or 5V I/O operation
- JEDEC Compliant: Meets Standard 8-1A for 3.3V ±0.3V
- High Drive Capability: 24 mA output current
- Power Management: Advanced power optimization features
- PCI Compliance: 100% PCI compliant design
2. Price Information
XC7372TM pricing varies based on speed grade, package type, and order quantity. Contact authorized distributors for current pricing:
- Minimum Order Quantity: 1 piece
- Volume Discounts: Available for quantities over 100 units
- Lead Time: 2-4 weeks for standard orders
- Warranty: 365-day manufacturer warranty
Note: Prices subject to change based on market conditions and availability. Contact suppliers for real-time quotes.
3. Documents & Media
Technical Documentation
- XC7372TM Datasheet: Complete electrical specifications and timing parameters
- Application Notes: Design guidelines and best practices
- User Guide: Programming and configuration instructions
- Pin Diagram: Detailed pinout information and signal descriptions
- Package Information: Mechanical drawings and thermal characteristics
Design Resources
- IBIS Models: For signal integrity simulation
- SPICE Models: Circuit simulation models
- CAD Library: Footprints for major EDA tools
- Reference Designs: Sample applications and code examples
- Errata Documents: Known issues and workarounds
Software Tools
- Vivado Design Suite: Primary development environment
- Legacy ISE Tools: For backward compatibility
- Programming Utilities: Device configuration software
4. Related Resources
Development Tools
- XC7300 Evaluation Boards: Complete development platforms
- Programming Cables: USB and JTAG interfaces
- Socket Adapters: For prototyping and testing
- Debug Tools: Logic analyzers and protocol analyzers
Compatible Devices
- XC7354TM: Lower density alternative
- XC73108TM: Higher capacity option
- XC73144TM: Maximum density variant
Application Areas
- 5G Technology: Base station and infrastructure equipment
- Artificial Intelligence: Edge computing and neural networks
- Cloud Computing: Data center acceleration
- Industrial Control: Automation and process control
- Consumer Electronics: High-performance embedded systems
- Wireless Technology: RF processing and protocol handling
- Internet of Things: Smart sensors and connectivity
- Medical Equipment: Diagnostic and monitoring devices
Technical Support
- Online Forums: Community-driven support
- Application Engineers: Direct technical assistance
- Training Materials: Webinars and tutorials
- Design Consulting: Professional services available
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free and environmentally friendly
- REACH Regulation: Complies with EU chemical safety standards
- Conflict Minerals: Sourced from conflict-free suppliers
- Green Package: Halogen-free materials available
Operating Conditions
- Operating Temperature: Commercial (0°C to +70°C), Industrial (-40°C to +85°C)
- Storage Temperature: -65°C to +150°C
- Humidity: 85% relative humidity (non-condensing)
- Altitude: Up to 2000 meters above sea level
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Various (refer to specific part marking)
- Export Restrictions: Subject to U.S. Export Administration Regulations (EAR)
Certifications
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management certified
- IATF 16949: Automotive quality standard (select variants)
- AS9100: Aerospace quality standard (qualified versions)
Packaging and Handling
- ESD Sensitive: Class 1 electrostatic discharge sensitive
- Moisture Sensitivity: Level 3 per J-STD-020
- Package Marking: Laser-etched part numbers and date codes
- Traceability: Full supply chain documentation available
The XC7372TM represents the pinnacle of programmable logic technology, combining exceptional performance with reliable operation for mission-critical applications. Whether you’re designing next-generation 5G infrastructure, AI acceleration systems, or industrial control platforms, the XC7372TM delivers the speed, density, and flexibility needed for success.
Keywords: XC7372TM, Xilinx EPLD, programmable logic device, CMOS EPLD, XC7300 family, high-speed FPGA, digital signal processing, embedded systems
