“Weโ€™ve trusted Rayming with multiple PCB orders, and theyโ€™ve never disappointed. Their manufacturing process is top-tier, and their team is always helpful. A+ service!”

I have had excellent service from RayMing PCB over 10 years. Your engineers have helped me and saved me many times.

Rayming provides top-notch PCB assembly services at competitive prices. Their customer support is excellent, and they always go the extra mile to ensure satisfaction. A trusted partner!

XC73108TM-70PC68C – High-Performance CMOS EPLD from Xilinx

Original price was: $20.00.Current price is: $19.00.

The XC73108TM-70PC68C is a versatile erasable programmable logic device from Xilinx’s XC7300 CMOS EPLD family, designed to deliver exceptional performance in digital logic applications. This advanced programmable logic solution combines high-speed operation with flexible design capabilities, making it ideal for critical embedded systems and industrial applications.

1. Product Specifications

Core Features

  • Part Number: XC73108TM-70PC68C
  • Manufacturer: Xilinx (now AMD)
  • Product Family: XC7300 CMOS EPLD
  • Logic Capacity: 108 Macro Cells
  • Technology Node: 0.8ยตm CMOS EPROM technology
  • Operating Voltage: 5V nominal supply
  • Speed Grade: -70 (70ns pin-to-pin delay)
  • Package Type: PC68C (68-Pin Plastic Leaded Chip Carrier)
  • Temperature Grade: Commercial (0ยฐC to +70ยฐC)

Advanced Architecture

The XC73108TM-70PC68C employs a unique Dual-Block architecture, which provides high speed operations via Fast Function Blocks and/or high density capability via High Density Function Blocks. Key architectural components include:

  • Fast Function Blocks (FFBs): Provide fast, pin-to-pin speed and logic throughput for critical decoding and ultrafast state machine applications
  • High-Density Function Blocks (FBs): Provide maximum logic density and system-level features to implement complex functions with predictable timing for adders and accumulators, wide functions and state machines requiring large numbers of product terms
  • Universal Interconnect Matrix (UIM): Guarantees 100% interconnect of all internal functions with constant, short interconnect delays for all routing paths

Power Management

All XC7300 EPLDs include programmable power management features to specify high-performance or low-power operation on an individual Macrocell-by-Macrocell basis. Unused Macrocells are automatically turned off to minimize power dissipation.

2. Price

Current Market Pricing

  • Price Range: Contact authorized distributors for current pricing
  • MOQ: Typically 1 piece minimum order quantity
  • Availability: Available through specialized distributors and obsolete parts suppliers
  • Lifecycle Status: End-of-life/Obsolete (factory excess stock available)

Note: Pricing fluctuates based on global electronic component supplier inventory and demand. Historical price data monitoring is available through specialized FPGA distributors.

3. Documents & Media

Technical Documentation

  • Datasheet: XC7300 Family Data Sheet (DS063)
  • User Guide: XC7300 EPLD Design Guide
  • Application Notes: Various application-specific design guides
  • Programming Guide: XEPLD development software documentation

Development Resources

  • Design Software: Xilinx development software supports XC7300 EPLD design using third-party schematic entry tools, HDL compilers, or direct equation-based text files
  • CAD Models: Symbol, footprint, and 3D STEP models available
  • Reference Designs: Sample projects and design templates

4. Related Resources

Development Tools

  • Legacy Software: XEPLD Design Software (obsolete)
  • Modern Alternative: Vivado Design Suite (for newer devices)
  • Programming Hardware: Xilinx programming cables and adapters

Compatible Products

  • XC7300 Family Variants:
    • XC73108TM-15PC84C (15ns, 84-pin PLCC)
    • XC73108-PC84ACK (84-pin ceramic package)
    • XC73108-20PQ100C (100-pin PQFP package)

Application Areas

  • Industrial control systems
  • Telecommunications equipment
  • Automotive electronics
  • Legacy system maintenance and repair
  • Prototype development

Support Services

  • Technical support through authorized distributors
  • Design consultation services
  • Replacement part sourcing
  • End-of-life product management

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Status: Non-RoHS compliant (legacy product)
  • REACH Regulation: Compliant with applicable restrictions
  • Operating Temperature: 0ยฐC to +70ยฐC (Commercial grade)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity: 10% to 90% non-condensing

Export Classifications

  • ECCN: Check current export control classifications
  • HTS Code: Verify current harmonized tariff schedule codes
  • Country of Origin: Manufacturing location varies by production batch

Quality Standards

  • Quality Grade: Commercial grade
  • Reliability: Standard commercial reliability testing
  • Packaging: Available in plastic and ceramic leaded chip carriers, with both windowed ceramic for design prototypes and one-time programmable plastic versions for cost-effective production volume

Disclaimer: The XC73108TM-70PC68C is an end-of-life product. While still available through authorized distributors and specialty suppliers, Xilinx (AMD) recommends migrating to current-generation devices for new designs. Contact authorized distributors for availability, pricing, and migration guidance.