The XC73108-20PG144 is a cutting-edge Field Programmable Gate Array (FPGA) designed for demanding applications requiring high-speed processing and flexible programmability. This advanced semiconductor device delivers exceptional performance in a compact 144-pin package, making it ideal for telecommunications, industrial automation, and embedded systems.
Product Specifications
Core Features
- Part Number: XC73108-20PG144
- Package Type: 144-pin Plastic Grid Array (PG144)
- Speed Grade: -20 (high-performance variant)
- Operating Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Supply Voltage: 3.3V core with 5V tolerant I/O
- Logic Elements: High-density programmable logic blocks
- I/O Pins: Up to 108 user-configurable I/O pins
- Memory: Integrated block RAM and distributed RAM
- Clock Management: Advanced PLL and clock distribution networks
Technical Specifications
The XC73108-20PG144 features robust architecture optimized for signal processing applications. Its advanced routing matrix ensures efficient resource utilization while maintaining low power consumption. The device supports multiple I/O standards including LVTTL, LVCMOS, and differential signaling options.
Key Performance Metrics:
- Maximum operating frequency: Up to 200 MHz
- Propagation delay: Ultra-low latency design
- Power consumption: Optimized for battery-powered applications
- Programming flexibility: In-system programmable via JTAG interface
Price Information
XC73108-20PG144 pricing varies based on quantity and distribution channel:
- Unit Price (1-99 pieces): Contact authorized distributors for current pricing
- Volume Pricing (100+ pieces): Significant discounts available for bulk orders
- Engineering Samples: Available for qualified customers
- Lead Time: Standard delivery 2-4 weeks from authorized stock
Note: Prices subject to change based on market conditions. Contact official distributors for real-time pricing and availability.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and pin configuration for XC73108-20PG144
- User Guide: Comprehensive implementation guide with design examples
- Programming Manual: Detailed instructions for device configuration and programming
- Application Notes: Best practices and design recommendations
- Errata Sheet: Known issues and workarounds for current silicon revision
Design Resources
- Reference Designs: Pre-verified designs for common applications
- Simulation Models: SPICE and behavioral models for circuit simulation
- PCB Layout Guidelines: Recommended footprints and layout considerations
- Thermal Analysis Reports: Junction temperature and package thermal characteristics
Software Tools
- Development Environment: Compatible with industry-standard FPGA design tools
- IP Core Library: Pre-built intellectual property blocks for rapid development
- Debug Tools: Integrated logic analyzer and signal probe capabilities
Related Resources
Compatible Products
- XC73108-15PG144: Lower speed grade variant for cost-sensitive applications
- XC73108-20BG256: Same die in larger 256-pin BGA package for higher I/O count
- Development Boards: Evaluation platforms featuring the XC73108-20PG144
Support Ecosystem
- Technical Support: Comprehensive online resources and expert assistance
- Training Materials: Webinars, tutorials, and certification programs
- Community Forums: Active user community for design collaboration
- Third-Party Tools: Extensive ecosystem of compatible development tools
Application Areas
The XC73108-20PG144 excels in diverse applications including:
- High-speed data acquisition systems
- Digital signal processing implementations
- Communications infrastructure equipment
- Industrial control and automation
- Automotive electronics systems
- Medical device applications
Environmental & Export Classifications
Environmental Compliance
The XC73108-20PG144 meets stringent environmental standards:
- RoHS Compliant: Fully compliant with EU Restriction of Hazardous Substances directive
- REACH Compliant: Meets European chemical regulation requirements
- Halogen-Free: Environmentally friendly package materials
- MSL Rating: Moisture Sensitivity Level 3 for reliable storage and handling
- Pb-Free: Lead-free termination finish for environmental safety
Export Control Classifications
- ECCN: Export Control Classification Number as per U.S. Commerce Department
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing location for trade compliance
- Export Restrictions: Standard semiconductor export guidelines apply
Quality Standards
- ISO 9001: Manufactured under certified quality management systems
- Automotive Grade: Available in AEC-Q100 qualified versions for automotive applications
- Reliability Testing: Comprehensive qualification including temperature cycling, thermal shock, and accelerated aging
Package Information
- Package Marking: Clear part number identification and date code marking
- Tray Packaging: Anti-static trays for safe handling and storage
- Tape and Reel: Available for automated assembly processes
- Storage Requirements: Controlled temperature and humidity conditions recommended
The XC73108-20PG144 represents the latest advancement in FPGA technology, combining high performance with design flexibility. For detailed technical specifications, pricing information, and design support, contact authorized distributors or visit the manufacturer’s official website.
