The XC73108-10WC84C is a powerful CMOS Erasable Programmable Logic Device (EPLD) from Xilinx’s renowned XC7300 family, designed for engineers and developers who require reliable, high-speed programmable logic solutions. This 84-pin windowed ceramic leaded chip carrier (CLCC) device delivers exceptional performance for critical applications requiring fast pin-to-pin speeds and versatile logic implementation.
1. Product Specifications
Core Technical Specifications
- Part Number: XC73108-10WC84C
- Manufacturer: Xilinx (AMD Xilinx)
- Family: XC7300 CMOS EPLD
- Technology: 0.8ฮผm CMOS EPROM
- Macro Cells: 108 macro cells
- Supply Voltage: 5V
- Package Type: 84-Pin Windowed Ceramic Leaded Chip Carrier (CLCC)
- Speed Grade: -10 (10ns pin-to-pin delay)
Advanced Architecture Features
The XC73108-10WC84C features Xilinx’s innovative Dual-Block Architecture, which combines:
- Fast Function Blocks (FFBs): Optimized for high-speed operations with fast pin-to-pin logic throughput, ideal for critical decoding and ultrafast state machine applications
- High-Density Function Blocks: Provide maximum logic density and system-level features for complex functions with predictable timing
- Universal Interconnect Matrix (UIM): Guarantees 100% interconnect of all internal functions with constant, short interconnect delays
Performance Characteristics
- Pin-to-pin Speed: 10ns (high-performance timing)
- Maximum Clock Frequency: Up to 167 MHz
- Interconnect Delay: Constant short delays through UIM
- Power Management: Programmable power control on individual macrocell basis
- Unused Cell Management: Automatic power-down of unused macrocells
Programming and Development
- Technology: UV-Erasable/One-Time Programmable (OTP)
- Design Tools: Compatible with Xilinx development software
- Input Methods: Schematic entry tools, HDL compilers, equation-based text files
- Programming Platform: PC or workstation-based design mapping
2. Price Information
Competitive Pricing Available
- In Stock: New original, 2769 pcs Stock Available
- Contact authorized distributors for current pricing
- Volume discounts available for bulk orders
- Request quotes through official channels for best pricing
Price Factors:
- Single unit vs. volume pricing
- Lead times and availability
- Package type selection (windowed vs. OTP)
- Regional distributor pricing variations
3. Documents & Media
Technical Documentation
- Official Datasheet: XC73108-10WC84C datasheet PDF available
- Pinout Diagrams: Complete pin configuration documentation
- Programming Guides: Device programming and configuration manuals
- Application Notes: Design implementation guidelines
Development Resources
- Design Software: Xilinx development suite compatibility
- Reference Designs: Example implementations and templates
- Technical Support: Engineering support documentation
- Migration Guides: Upgrade and replacement information
Media Resources
- Product images and package drawings
- Block diagrams and architectural illustrations
- Performance graphs and timing diagrams
- Application circuit examples
4. Related Resources
Compatible Development Tools
- Xilinx Vivado Design Suite: Modern development environment
- ISE Design Tools: Legacy development support
- Third-party Tools: Compatible schematic entry and HDL compilers
Alternative Package Options
- XC73108-15WC84C: 15ns speed grade variant
- XC73108-10PC84C: Plastic PLCC package option
- XC73108-10PQ100C: 100-pin PQFP package alternative
Related Products in XC7300 Family
- XC7354: Lower density option (54 macro cells)
- XC7372: Mid-range option (72 macro cells)
- XC73144: Higher density option (144 macro cells)
Application Areas
- Critical decoding applications
- High-speed state machines
- Arithmetic accelerators and accumulators
- Wide logic functions
- Industrial automation systems
- Telecommunications equipment
5. Environmental & Export Classifications
Environmental Specifications
- Operating Temperature: Commercial grade temperature range
- Storage Temperature: Extended storage temperature specifications
- Humidity: Standard semiconductor humidity ratings
- Lead Compliance: RoHS compliant options available
Package Environmental Details
- Windowed Ceramic Package: Enhanced UV erasability for prototyping
- ESD Protection: Anti-static packaging and handling procedures
- Moisture Sensitivity: Appropriate MSL (Moisture Sensitivity Level) rating
- Thermal Characteristics: Junction temperature specifications
Export and Compliance
- Export Classification: Standard semiconductor export codes
- ECCN Numbers: Export control classification where applicable
- Compliance Standards: Industry standard certifications
- Regional Approvals: Geographic certification requirements
Quality and Reliability
- Quality Grade: Commercial/Industrial grade specifications
- Reliability Testing: Standard semiconductor reliability protocols
- Warranty: Standard manufacturer warranty coverage
- Counterfeit Protection: Authorized distributor verification
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