Product Specifications
The XC6VSX475T-2FFG1156I features an impressive array of configurable logic blocks and specialized processing elements. This FPGA contains 297,600 logic cells and 2,016 DSP48E1 slices, providing substantial computational power for complex algorithms and signal processing tasks. The device includes 38,304 Kbits of block RAM, offering ample memory resources for buffering and data storage applications.
Built on a 40nm process technology, the XC6VSX475T-2FFG1156I operates with a -2 speed grade, ensuring reliable performance across various operating conditions. The device is housed in a 1156-pin flip-chip fine-pitch ball grid array (FFG1156) package, providing excellent thermal performance and signal integrity. The industrial temperature range (-40ยฐC to +100ยฐC) makes this FPGA suitable for harsh operating environments.
Key connectivity features include multiple high-speed serial transceivers supporting data rates up to 6.6 Gbps, making the XC6VSX475T-2FFG1156I ideal for high-bandwidth applications such as 10 Gigabit Ethernet, PCI Express, and other high-speed protocols. The device also incorporates advanced clocking resources with multiple phase-locked loops (PLLs) and digital clock managers (DCMs) for precise timing control.
Price
Pricing for the XC6VSX475T-2FFG1156I varies based on quantity, distribution channel, and current market conditions. Due to the specialized nature of this high-end FPGA and its industrial-grade specifications, the XC6VSX475T-2FFG1156I typically commands premium pricing compared to commercial-grade alternatives. For current pricing information and volume discounts, customers should contact authorized Xilinx distributors or sales representatives directly.
Factors affecting price include order quantity, delivery requirements, and any additional services such as programming or testing. Long-term supply agreements may offer more favorable pricing for high-volume applications. Given the advanced capabilities of the XC6VSX475T-2FFG1156I, the investment provides excellent value for applications requiring high-performance FPGA solutions.
Documents & Media
Comprehensive technical documentation supports the XC6VSX475T-2FFG1156I implementation and design process. The official Xilinx datasheet provides detailed electrical specifications, timing parameters, and package information essential for system design. Pin-out diagrams and package drawings are available to assist with PCB layout and mechanical design considerations.
Development resources include the Virtex-6 FPGA User Guide, which covers architecture details, configuration options, and design recommendations. Application notes addressing specific implementation topics such as high-speed design techniques, power management, and thermal considerations are available through the Xilinx support portal.
Design tools support includes compatibility with Xilinx ISE Design Suite and Vivado Design Suite, providing complete design entry, synthesis, implementation, and verification capabilities. Reference designs and IP cores are available to accelerate development time for common applications. Hardware development platforms and evaluation boards may be available to support prototyping and validation activities.
Related Resources
The XC6VSX475T-2FFG1156I ecosystem includes various complementary products and resources to support complete system solutions. Related FPGAs in the Virtex-6 family offer different capacity and speed grade options to match specific application requirements. Pin-compatible alternatives may be available for design flexibility and cost optimization.
Supporting components include configuration devices, power management solutions, and high-speed connectors optimized for use with the XC6VSX475T-2FFG1156I. Third-party IP cores and design services are available from Xilinx Alliance Program partners to accelerate time-to-market for complex applications.
Training resources such as online courses, webinars, and technical seminars help engineers maximize the capabilities of the XC6VSX475T-2FFG1156I. Community forums and technical support channels provide ongoing assistance throughout the design process. Design examples and reference implementations demonstrate best practices for common application scenarios.
Environmental & Export Classifications
The XC6VSX475T-2FFG1156I meets stringent environmental and quality standards required for industrial and aerospace applications. The device complies with RoHS (Restriction of Hazardous Substances) regulations, ensuring environmentally responsible manufacturing processes. Moisture sensitivity level and storage requirements are specified to maintain device reliability throughout the supply chain.
Export classification information is critical for international shipments and compliance with trade regulations. The XC6VSX475T-2FFG1156I may be subject to export control regulations due to its advanced capabilities and potential dual-use applications. Customers should verify current export classification and licensing requirements with appropriate regulatory authorities before international shipment or use in controlled applications.
Quality and reliability specifications include operating temperature ranges, power consumption characteristics, and expected device lifetime under various operating conditions. The industrial temperature grade ensures reliable operation in demanding environments where commercial-grade components may not be suitable. Qualification testing data and reliability reports are available to support mission-critical applications requiring high confidence in device performance and longevity.
The XC6VSX475T-2FFG1156I represents a premium FPGA solution combining high performance, industrial-grade reliability, and comprehensive development support for the most demanding applications in aerospace, defense, telecommunications, and high-performance computing markets.
