Product Specifications
The XC6VSX475T-2FFG1156C incorporates advanced 40nm process technology and features an impressive array of programmable resources. This FPGA contains 475,520 logic cells, providing substantial capacity for complex digital designs. The device includes 2,016 DSP48E1 slices, specifically optimized for high-performance signal processing applications requiring multiply-accumulate operations and digital filtering.
Memory resources include 38,304 Kb of block RAM, distributed across multiple memory blocks to support various data storage and buffering requirements. The XC6VSX475T-2FFG1156C operates with a -2 speed grade, offering balanced performance and power consumption characteristics suitable for most industrial applications.
The device utilizes a 1156-pin Fine-Pitch Ball Grid Array (FFBGA) package, designated as FFG1156C, which provides excellent thermal performance and signal integrity. This packaging solution enables high pin density while maintaining robust electrical characteristics essential for high-speed digital designs.
Key specifications include support for multiple I/O standards, enabling seamless integration with various system architectures. The FPGA supports differential and single-ended signaling, with voltage compatibility ranging from 1.2V to 3.3V across different I/O banks.
Price
Pricing for the XC6VSX475T-2FFG1156C varies based on quantity, supplier, and market conditions. Industrial distributors typically offer volume pricing tiers, with significant cost reductions available for larger quantities. The device is positioned in the premium FPGA segment, reflecting its advanced capabilities and high logic density.
For current pricing information and volume discounts, contact authorized Xilinx distributors or electronic component suppliers. Educational institutions and research organizations may qualify for special academic pricing programs.
Documents & Media
Comprehensive technical documentation supports the XC6VSX475T-2FFG1156C implementation and design process. The Virtex-6 FPGA Data Sheet provides detailed electrical specifications, timing parameters, and DC characteristics essential for system design.
Package and pinout information is available through the official package documentation, including mechanical drawings, pin assignments, and thermal characteristics. The Virtex-6 FPGA User Guide offers detailed architectural information, configuration options, and design guidelines.
Development tools documentation includes ISE Design Suite guides, constraint file templates, and reference designs specifically optimized for the XC6VSX475T-2FFG1156C. These resources accelerate development cycles and ensure optimal performance implementation.
Application notes covering signal processing implementations, memory controller designs, and high-speed I/O configurations provide practical design guidance. Video tutorials and webinar recordings offer additional learning resources for both novice and experienced FPGA developers.
Related Resources
The XC6VSX475T-2FFG1156C ecosystem includes comprehensive development tools and support resources. Xilinx ISE Design Suite provides the primary development environment, featuring synthesis, implementation, and debugging capabilities specifically optimized for Virtex-6 devices.
Development boards and evaluation kits enable rapid prototyping and proof-of-concept development. These platforms include the necessary power supplies, clock sources, and I/O interfaces to begin development immediately.
IP core libraries offer pre-verified functional blocks including DSP functions, communication protocols, and memory controllers. These cores accelerate development while ensuring reliable performance and reduced time-to-market.
Third-party tool integration supports various specialized development flows, including high-level synthesis tools, simulation environments, and specialized debugging solutions. Professional services and training programs provide additional support for complex implementations.
Environmental & Export Classifications
The XC6VSX475T-2FFG1156C meets stringent environmental and reliability standards required for industrial and aerospace applications. The device operates across commercial temperature ranges, typically -40ยฐC to +85ยฐC for the junction temperature, ensuring reliable operation in demanding environmental conditions.
RoHS compliance ensures environmental responsibility by restricting hazardous substances in the manufacturing process. The device meets lead-free soldering requirements and supports environmentally conscious manufacturing processes.
Export classification information indicates any restrictions or licensing requirements for international shipments. The XC6VSX475T-2FFG1156C typically falls under standard commercial export classifications, though specific applications may require additional review.
Reliability testing includes extensive qualification programs covering temperature cycling, humidity exposure, and mechanical stress testing. These qualification standards ensure long-term reliability in mission-critical applications.
The device packaging supports standard SMT assembly processes with appropriate reflow profiles documented for manufacturing integration. Moisture sensitivity level (MSL) ratings provide guidance for storage and handling requirements prior to assembly.
Quality certifications and manufacturing standards compliance information supports integration into quality-managed development processes and regulated industries requiring documented component traceability and reliability data.
