Product Specifications
The XC6VSX475T-2FF1759E offers industry-leading specifications designed for complex digital applications:
Core Architecture:
- Logic Cells: 475,520 logic cells providing extensive programmable logic resources
- Configurable Logic Blocks (CLBs): 59,440 CLBs for flexible logic implementation
- Slice Configuration: 237,760 slices with advanced 6-input LUT architecture
- Block RAM: 38,304 Kb of total block RAM for high-speed data storage
DSP Performance:
- DSP48E1 Slices: 2,016 dedicated DSP slices for high-performance arithmetic operations
- Multiply-Accumulate Operations: Optimized for signal processing applications
- Precision: Support for 25×18 and 18×25 multiplications
Connectivity Features:
- Package Type: FF1759 (Fine-Pitch Ball Grid Array)
- I/O Pins: 1200 user I/Os for extensive connectivity options
- Speed Grade: -2 speed grade ensuring reliable high-frequency operation
- Operating Temperature: Extended commercial temperature range
Memory and Storage:
- Distributed RAM: 7,400 Kb of distributed RAM
- FIFO Capability: Built-in FIFO support for data buffering
- Memory Controllers: Integrated memory interface blocks
Price
The XC6VSX475T-2FF1759E pricing varies based on quantity, lead time, and supplier. Contact authorized Xilinx distributors for current pricing information. Volume discounts are typically available for production quantities. Consider factors such as:
- Unit price for prototype quantities
- Volume pricing tiers for production runs
- Lead time requirements affecting cost
- Regional pricing variations
- Support and warranty options
For the most competitive XC6VSX475T-2FF1759E pricing, request quotes from multiple authorized distributors and consider long-term supply agreements for production applications.
Documents & Media
Essential documentation and resources for the XC6VSX475T-2FF1759E include:
Technical Documentation:
- Virtex-6 FPGA Data Sheet: Complete electrical and timing specifications
- XC6VSX475T-2FF1759E Product Brief: Key features and application guidelines
- Packaging and Pinout Documentation: Detailed pin assignments and mechanical specifications
- Power Consumption Guidelines: Thermal management and power estimation tools
Design Resources:
- Vivado Design Suite: Latest development environment and tools
- IP Core Libraries: Pre-verified intellectual property blocks
- Reference Designs: Application-specific design examples
- Migration Guides: Upgrade paths from previous FPGA generations
Application Notes:
- High-Speed Design Techniques: Signal integrity and timing optimization
- DSP Implementation Guides: Efficient algorithm implementation strategies
- Power Management: Optimization techniques for power-sensitive applications
Related Resources
The XC6VSX475T-2FF1759E ecosystem includes comprehensive development and support resources:
Development Tools:
- Xilinx Vivado Design Suite: Complete FPGA design flow
- System Generator for DSP: MATLAB/Simulink integration
- SDK (Software Development Kit): Embedded processor development
- ChipScope Pro: Real-time debugging and analysis
Evaluation Platforms:
- Virtex-6 SX475T Development Kit: Complete evaluation platform
- FMC (FPGA Mezzanine Card) modules: Expandable I/O options
- Reference designs and demonstrations
Support Resources:
- Xilinx Forums: Community-driven technical support
- Application Engineering: Direct technical assistance
- Training and Workshops: Hands-on learning opportunities
- Documentation Portal: Comprehensive technical library
Compatible Products:
- Zynq UltraScale+ alternatives for newer designs
- Kintex series for cost-optimized implementations
- Spartan series for lower-complexity applications
Environmental & Export Classifications
The XC6VSX475T-2FF1759E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Regulation: Compliance with European chemical safety standards
- Conflict Minerals: Responsible sourcing certification
- ISO 14001: Environmental management system compliance
Export Control Classifications:
- ECCN (Export Control Classification Number): Specific classification for international trade
- HTS (Harmonized Tariff Schedule): Customs classification code
- Country of Origin: Manufacturing location details
- Export License Requirements: Jurisdiction-specific regulations
Quality Standards:
- Automotive Grade Options: AEC-Q100 qualified variants available
- Industrial Temperature Range: Extended operating conditions
- Quality Management: ISO 9001 certified manufacturing
- Reliability Testing: Comprehensive qualification programs
Packaging and Handling:
- Moisture Sensitivity Level (MSL): Proper storage and handling requirements
- ESD Protection: Electrostatic discharge prevention guidelines
- Thermal Management: Operating temperature specifications
- Mechanical Specifications: Package dimensions and tolerances
The XC6VSX475T-2FF1759E represents the pinnacle of FPGA technology, offering unmatched performance, flexibility, and reliability for the most demanding applications. Its comprehensive feature set, robust development ecosystem, and proven track record make it the preferred choice for engineers developing next-generation digital systems.
