Product Specification
The XC6VSX475T-1FFG1759I features robust technical specifications that set it apart in the FPGA marketplace:
Core Architecture:
- Part of the Virtex-6 SX series optimized for DSP-intensive applications
- 475,000 logic cells providing extensive programmable resources
- Advanced 40nm CMOS technology for enhanced performance and power efficiency
- Speed grade -1 offering balanced performance and power consumption
Package Details:
- FFG1759 package type in a fine-pitch Ball Grid Array (BGA) format
- 1759-pin configuration ensuring comprehensive I/O connectivity
- Industrial temperature range (-40°C to +100°C) for harsh environment operation
- Compact form factor suitable for space-constrained applications
Memory and Processing:
- Integrated block RAM for high-speed data storage and buffering
- Dedicated DSP48E1 slices for efficient signal processing operations
- Support for various memory interfaces including DDR3, QDR-II+, and RLDRAM
- Built-in configuration memory and security features
Connectivity Features:
- High-speed serial transceivers supporting multiple protocols
- Flexible I/O standards compatibility
- PCIe endpoint and root port capabilities
- Ethernet MAC and other networking protocol support
Price
The XC6VSX475T-1FFG1759I pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. Pricing typically reflects the advanced technology and extensive capabilities of this high-performance FPGA solution.
Documents & Media
Essential documentation and resources for the XC6VSX475T-1FFG1759I include:
Technical Documentation:
- Official Xilinx datasheet with complete electrical and timing specifications
- Virtex-6 FPGA User Guide providing detailed implementation guidance
- Package and pinout documentation for PCB design requirements
- Power consumption and thermal management guidelines
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and application notes
- PCB layout guidelines and design considerations
- Programming and configuration specifications
Software Support:
- Xilinx Vivado Design Suite support information
- IP core compatibility and integration guides
- Simulation models and timing analysis tools
- Hardware debugging and verification resources
Related Resources
The XC6VSX475T-1FFG1759I ecosystem includes numerous supporting components and resources:
Development Tools:
- Xilinx development boards featuring the XC6VSX475T-1FFG1759I
- Evaluation kits and reference designs
- Third-party development platforms and modules
- Programming cables and configuration tools
Software Environment:
- Xilinx ISE Design Suite for legacy support
- Vivado Design Suite for advanced development
- SDK and embedded development tools
- IP catalog and reference designs
Training and Support:
- Xilinx technical documentation and application notes
- Online training courses and webinars
- Community forums and technical support resources
- Professional services and consulting options
Environmental & Export Classifications
The XC6VSX475T-1FFG1759I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package options available
- REACH regulation compliance for European markets
- Conflict minerals reporting and compliance
- Environmental management system certifications
Export Control Information:
- Export Control Classification Number (ECCN) as designated by US Department of Commerce
- International Traffic in Arms Regulations (ITAR) compliance status
- Country-specific import/export requirements and restrictions
- End-use and end-user verification requirements
Quality and Reliability:
- Industrial temperature grade qualification
- Automotive quality standards compliance where applicable
- Long-term availability and lifecycle management
- Quality management system certifications
The XC6VSX475T-1FFG1759I represents a premier FPGA solution for applications requiring high-performance programmable logic, extensive connectivity, and reliable operation in demanding environments. Its comprehensive feature set and robust design make it suitable for next-generation electronic systems across multiple industries.
