Product Specifications
Core Architecture
- Part Number: XC6VSX475T-1FFG1759C
- Family: Virtex-6 SXT
- Logic Cells: 475,520 equivalent logic cells
- Speed Grade: -1 (commercial grade)
- Package Type: FFG1759 (Fine-pitch Flip-chip Grid Array)
- Pin Count: 1,759 pins
- Operating Temperature: 0°C to +85°C (commercial)
Memory Resources
- Block RAM: 38,304 Kb total
- Distributed RAM: 1,188 Kb
- Configuration Memory: External configuration required
- Memory Blocks: 1,344 blocks of 36Kb each
DSP and Processing
- DSP48E1 Slices: 1,056 slices
- Maximum DSP Performance: Up to 739 GMAC/s
- Hard IP Cores: Integrated Ethernet MAC, PCIe blocks
- Clock Management: 12 Clock Management Tiles (CMTs)
I/O Capabilities
- Maximum I/O Pins: 600 user I/O
- High-Speed Serial Transceivers: 36 GTX transceivers
- Transceiver Speed: Up to 6.5 Gbps per channel
- I/O Standards: Support for 50+ I/O standards including LVDS, SSTL, HSTL
Power Specifications
- Core Voltage: 1.0V ±5%
- Auxiliary Voltage: 2.5V ±5%
- I/O Voltage: 1.2V to 3.3V (depending on standard)
- Typical Power Consumption: 15-25W (application dependent)
Price Information
The XC6VSX475T-1FFG1759C pricing varies based on quantity, packaging, and supplier. Typical pricing ranges:
- Single Unit: $8,000 – $12,000 USD
- Volume Pricing: Available for quantities of 100+ units
- Development Kits: Evaluation boards starting at $2,500 USD
- Lead Time: 12-16 weeks for standard orders
Note: Prices are subject to change based on market conditions and availability. Contact authorized distributors for current pricing and availability.
Documents & Media
Technical Documentation
- XC6VSX475T-1FFG1759C Datasheet: Complete electrical and mechanical specifications
- Virtex-6 FPGA User Guide: Comprehensive programming and configuration guide
- PCB Design Guidelines: Layout recommendations and signal integrity guidelines
- Thermal Management Guide: Heat dissipation and cooling solutions
Development Resources
- Vivado Design Suite: Latest FPGA development environment
- ISE Design Suite: Legacy development tools (version 14.7)
- IP Core Libraries: Pre-built IP blocks for common functions
- Reference Designs: Example projects and application notes
Media Resources
- Package Drawings: Mechanical drawings and pin assignments
- Simulation Models: SPICE and IBIS models for signal integrity analysis
- 3D Models: CAD models for mechanical design integration
- Video Tutorials: Step-by-step programming guides
Related Resources
Compatible Development Boards
- ML605 Evaluation Kit: Full-featured development platform
- Custom Carrier Boards: Third-party solutions for specific applications
- Mezzanine Cards: Expansion modules for additional I/O
Software Tools
- Xilinx Vivado: Primary development environment
- ChipScope Pro: Advanced debugging and analysis
- EDK/SDK: Embedded development kit for processor integration
- ModelSim: Third-party simulation environment
Application Areas
- 5G Wireless Infrastructure: Base station and backhaul applications
- High-Frequency Trading: Ultra-low latency financial systems
- Radar and Defense: Signal processing and communications
- Medical Imaging: Real-time image processing and analysis
- Broadcast Equipment: Video processing and encoding
Training and Support
- Online Documentation: Comprehensive web-based resources
- Technical Forums: Community support and knowledge sharing
- Training Courses: Hands-on workshops and certification programs
- FAE Support: Field application engineer assistance
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Union RoHS directive requirements
- REACH Compliant: Complies with EU chemical regulations
- Halogen-Free: Available in halogen-free package options
- MSL Rating: Moisture Sensitivity Level 3 (168 hours at 30°C/60% RH)
Operating Conditions
- Commercial Grade: 0°C to +85°C junction temperature
- Storage Temperature: -65°C to +150°C
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters above sea level
Export Classifications
- ECCN: 3A001.a.2 (Export Administration Regulations)
- Export License: May require export license for certain destinations
- Country of Origin: Manufactured in various global facilities
- Dual-Use Item: Subject to export control regulations
Quality Standards
- Automotive Grade: AEC-Q100 qualified versions available
- Military Grade: Extended temperature and screening options
- Quality System: ISO 9001 certified manufacturing
- Reliability: MTBF > 1,000,000 hours at 55°C
Packaging and Handling
- Anti-Static Packaging: ESD-safe packaging for component protection
- Tray Packaging: Available in standard IC trays
- Tape and Reel: High-volume packaging for automated assembly
- Moisture Barrier Bags: Long-term storage protection
The XC6VSX475T-1FFG1759C represents cutting-edge FPGA technology, offering exceptional performance and flexibility for next-generation electronic systems. Its combination of high logic density, advanced I/O capabilities, and robust development ecosystem makes it an ideal choice for engineers developing sophisticated digital solutions across multiple industries.
