Product Specification
The XC6VSX475T-1FF1759C features an impressive array of technical specifications that make it ideal for complex digital signal processing tasks. This FPGA incorporates 475,520 logic cells with 2,970 configurable logic blocks (CLBs), providing extensive processing power for sophisticated algorithms and data manipulation.
Key Technical Features:
- Logic Cells: 475,520 system gates
- Package Type: FF1759 (1759-pin Fine-Pitch BGA)
- Speed Grade: -1 (standard performance)
- Operating Temperature: Commercial grade (0°C to +85°C)
- DSP48E1 Slices: 2,016 dedicated multiply-accumulate blocks
- Block RAM: 38,304 Kb total memory
- I/O Pins: Up to 720 user I/O pins
- Clock Management: 32 clock management tiles (CMTs)
- Transceivers: 36 GTX transceivers supporting up to 6.6 Gbps
- Power Supply: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
The XC6VSX475T-1FF1759C utilizes advanced 40nm CMOS technology, ensuring optimal power efficiency while maintaining high performance. The integrated SerDes transceivers support various high-speed protocols including PCIe, SATA, and custom communication standards.
Price
Pricing for the XC6VSX475T-1FF1759C varies based on quantity, supplier, and market conditions. This premium FPGA typically ranges from $8,000 to $15,000 per unit for small quantities, with significant volume discounts available for production orders. Enterprise customers and OEMs can negotiate custom pricing arrangements through authorized distributors.
Pricing Considerations:
- Unit pricing decreases substantially with volume orders (100+ units)
- Extended temperature variants command premium pricing
- Lead times may affect pricing during supply constraints
- Development kits and evaluation boards available separately
- Support packages and software licensing may apply additional costs
For current XC6VSX475T-1FF1759C pricing and availability, consult authorized Xilinx distributors or contact AMD directly for enterprise quotes.
Documents & Media
Comprehensive documentation and resources support the XC6VSX475T-1FF1759C implementation and development process. Essential documentation includes detailed datasheets, application notes, and reference designs that accelerate time-to-market for development teams.
Essential Documentation:
- Product Datasheet: Complete electrical specifications, timing parameters, and package information
- User Guide: Detailed implementation guidelines and best practices
- Package and Pinout Specifications: Mechanical drawings and pin assignments
- Power Estimation Spreadsheets: Tools for accurate power consumption analysis
- Application Notes: Specific implementation examples and optimization techniques
- Errata Documents: Known issues and workarounds for design consideration
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs for common applications
- Simulation models and timing constraints
- Board design guidelines and layout recommendations
- Signal integrity analysis tools and methodologies
All documentation for the XC6VSX475T-1FF1759C is available through AMD’s official documentation portal and partner resources.
Related Resources
The XC6VSX475T-1FF1759C ecosystem includes extensive development tools, evaluation platforms, and third-party solutions that enhance the design experience and reduce development time.
Development Tools:
- Vivado Design Suite: Comprehensive FPGA development environment
- ISE Design Suite: Legacy tool support for Virtex-6 devices
- ChipScope Pro: Real-time debugging and analysis
- System Generator: MATLAB/Simulink integration for DSP applications
- SDK (Software Development Kit): Embedded processor development tools
Evaluation Platforms:
- ML605 Evaluation Kit featuring the XC6VSX475T-1FF1759C
- Custom carrier boards from third-party vendors
- FMC (FPGA Mezzanine Card) compatible modules
- High-speed connector breakout boards
- Protocol-specific evaluation modules
Third-Party Resources:
- IP core libraries from multiple vendors
- Development services and consulting partners
- Training programs and certification courses
- Online communities and technical forums
- Application-specific reference designs
Environmental & Export Classifications
The XC6VSX475T-1FF1759C complies with international environmental standards and export regulations, ensuring global deployment capability while maintaining environmental responsibility.
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Sourced from conflict-free suppliers
- ISO 14001: Manufactured in certified environmental management facilities
- Green Packaging: Recyclable materials and reduced packaging waste
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various global manufacturing locations
- License Requirements: May require export licenses for certain destinations
- End-Use Restrictions: Subject to dual-use technology regulations
Operating Environmental Specifications:
- Commercial Temperature Range: 0°C to +85°C junction temperature
- Storage Temperature: -65°C to +150°C
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2,000 meters operational
- Shock and Vibration: Meets JEDEC standards for electronic components
The XC6VSX475T-1FF1759C represents the pinnacle of Virtex-6 FPGA technology, delivering exceptional performance, comprehensive development support, and global compliance standards for mission-critical applications across diverse industries.
