Product Specifications
Core Features of XC6VSX315T-L1FF1759I
Logic Resources:
- Logic Cells: 315,000
- Configurable Logic Blocks (CLBs): 49,200
- Block RAM: 11,664 Kb total
- DSP48E1 Slices: 1,344 slices for high-performance signal processing
Memory Architecture:
- Block RAM Blocks: 324 blocks
- Maximum Distributed RAM: 1,232 Kb
- Built-in FIFO support for data buffering
I/O and Connectivity:
- Maximum User I/O: 600 pins
- Package: FF1759 (Fine-pitch Ball Grid Array)
- High-speed serial transceivers for advanced connectivity
- Support for multiple I/O standards including LVDS, SSTL, HSTL
Performance Specifications:
- Speed Grade: -1L (Low Power variant)
- Operating temperature range: Industrial grade
- Power-optimized design for extended operation
- Maximum operating frequency: Up to 600 MHz
Package Details:
- Package Type: FF1759 (1759-pin Fine-pitch BGA)
- Pin Count: 1,759 pins
- Package Size: 42.5mm x 42.5mm
- Ball Pitch: 1.0mm
Pricing Information
The XC6VSX315T-L1FF1759I pricing varies based on quantity, distribution channel, and market conditions. For current pricing and availability:
- Sample Quantities: Contact authorized distributors for evaluation pricing
- Production Volumes: Volume discounts available for quantities over 100 units
- Lead Time: Typically 12-16 weeks for standard orders
- Authorized Distributors: Available through Digi-Key, Mouser, Arrow Electronics, and Avnet
Note: Pricing is subject to change based on market conditions and availability. Contact your preferred distributor for real-time quotes.
Documents & Media
Technical Documentation for XC6VSX315T-L1FF1759I
Datasheets:
- Virtex-6 Family Overview (DS150)
- Virtex-6 FPGA Data Sheet: DC and AC Switching Characteristics (DS152)
- Virtex-6 FPGA Configuration User Guide (UG360)
Design Resources:
- Package and Pinout Specifications
- PCB Design Guidelines for FF1759 package
- Thermal Design Considerations
- Power Estimation Spreadsheets
Software Support:
- Compatible with Xilinx Vivado Design Suite
- ISE Design Suite support (legacy)
- IP Core library access
- Reference designs and application notes
Quality Documentation:
- Quality and Reliability Reports
- Qualification Test Reports
- Environmental Test Data
- RoHS Compliance Certificates
Related Resources
Development Tools and Support
Development Kits:
- Virtex-6 FPGA ML605 Evaluation Kit
- Custom development boards featuring XC6VSX315T-L1FF1759I
- Prototyping platforms for rapid development
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio
- DSP-focused IP cores for signal processing
- Connectivity IP for high-speed interfaces
- Memory controller IP cores
Design Services:
- Xilinx Alliance Program partners
- Custom design consultation services
- Training and certification programs
- Technical support and documentation
Application Areas:
- Software-defined radio (SDR) systems
- High-performance computing accelerators
- Video processing and broadcast equipment
- Aerospace and defense applications
- Medical imaging systems
- Test and measurement equipment
Environmental & Export Classifications
Environmental Compliance
RoHS Compliance:
- The XC6VSX315T-L1FF1759I meets RoHS 2011/65/EU requirements
- Lead-free package and assembly process
- Halogen-free package materials available
Environmental Certifications:
- ISO 14001 compliant manufacturing
- REACH regulation compliance
- Conflict minerals reporting available
Operating Conditions:
- Operating Temperature: -40°C to +100°C (Industrial grade)
- Storage Temperature: -65°C to +150°C
- Humidity: 10% to 90% non-condensing
- Altitude: Up to 2000 meters
Export Classifications
Export Control Information:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Manufactured in various Xilinx facilities
- Export License: May require export license for certain destinations
Compliance Standards:
- US Export Administration Regulations (EAR)
- International Traffic in Arms Regulations (ITAR) – Not applicable
- European Union Dual-Use Regulation compliance
Important Note: Export regulations are subject to change. Consult current regulations and legal counsel before international shipment of XC6VSX315T-L1FF1759I products.
The XC6VSX315T-L1FF1759I represents cutting-edge FPGA technology, combining high performance with power efficiency for the most demanding applications. Contact your local Xilinx representative or authorized distributor for detailed specifications, pricing, and availability information.
