Product Specifications
The XC6VSX315T-L1FF1156I features an impressive array of configurable logic resources designed for maximum flexibility and performance. This FPGA incorporates 315,000 logic cells with advanced DSP48E1 slices for high-speed mathematical operations. The device includes substantial block RAM resources, providing ample on-chip memory for complex data processing tasks.
Built on Xilinx’s proven 40nm process technology, the XC6VSX315T-L1FF1156I operates reliably across industrial temperature ranges from -40ยฐC to +100ยฐC. The device features a 1156-pin flip-chip fine-pitch BGA package (FF1156), ensuring optimal signal integrity and thermal performance for high-density applications.
Key technical specifications include multiple high-speed transceivers supporting data rates up to 6.6 Gbps, making the XC6VSX315T-L1FF1156I suitable for advanced communication protocols and high-bandwidth applications. The FPGA supports various I/O standards and includes dedicated clock management resources for precise timing control.
Price
Pricing for the XC6VSX315T-L1FF1156I varies based on quantity, delivery requirements, and current market conditions. As a high-performance industrial-grade component, this FPGA typically commands premium pricing reflecting its advanced capabilities and specialized applications. Contact authorized distributors or Xilinx directly for current pricing information, volume discounts, and availability. Many suppliers offer competitive pricing for both prototype quantities and production volumes, with options for scheduled deliveries and inventory management programs.
Documents & Media
Comprehensive technical documentation supports the XC6VSX315T-L1FF1156I throughout the design cycle. The official datasheet provides detailed electrical characteristics, timing specifications, and package information essential for system integration. Xilinx offers extensive user guides covering configuration, programming, and optimization techniques specific to the Virtex-6 SX architecture.
Development resources include reference designs, application notes, and design examples demonstrating best practices for implementing the XC6VSX315T-L1FF1156I in various applications. The Xilinx ISE Design Suite and Vivado Design Suite provide complete development environments with synthesis, implementation, and debugging tools optimized for this FPGA family.
Technical support materials encompass package drawings, thermal models, and IBIS models for signal integrity analysis. Migration guides assist engineers transitioning from other FPGA families, while characterization reports provide detailed performance data across operating conditions.
Related Resources
The XC6VSX315T-L1FF1156I ecosystem includes numerous complementary products and development tools. Evaluation boards and development kits enable rapid prototyping and design validation, featuring the XC6VSX315T-L1FF1156I in representative system configurations. These platforms typically include necessary power supplies, configuration circuits, and I/O interfaces for immediate evaluation.
Software tools supporting the XC6VSX315T-L1FF1156I include IP cores for common functions such as memory controllers, communication protocols, and signal processing algorithms. Third-party development tools and simulation models enhance the design flow, while training materials and workshops provide hands-on experience with advanced FPGA design techniques.
Compatible accessories include programming cables, debugging probes, and high-speed connectors designed for use with the FF1156 package. Socket solutions enable prototyping and testing without permanent device mounting, while thermal management solutions ensure reliable operation in demanding environments.
Environmental & Export Classifications
The XC6VSX315T-L1FF1156I meets stringent environmental and quality standards required for industrial and aerospace applications. The device complies with RoHS directives for lead-free manufacturing and environmental protection. Qualification testing includes temperature cycling, thermal shock, and accelerated aging to ensure long-term reliability.
Export classification for the XC6VSX315T-L1FF1156I follows applicable trade regulations, with specific controls based on performance characteristics and intended applications. Customers should verify current export requirements and obtain necessary licenses for international shipments or applications in restricted markets.
The FPGA’s industrial temperature rating and advanced package technology make it suitable for harsh operating environments while maintaining compliance with relevant electromagnetic compatibility (EMC) standards. Quality certifications support use in applications requiring documented traceability and reliability assurance.
Environmental considerations include power consumption optimization features and thermal management capabilities that support sustainable design practices. The XC6VSX315T-L1FF1156I’s efficient architecture minimizes power requirements while delivering maximum performance for energy-conscious applications.
