Product Specifications
Core Architecture
The XC6VSX315T-3FF1759C features a robust architecture built on 40nm process technology, offering optimal balance between performance and power efficiency:
- Logic Cells: 315,360 logic cells providing extensive programmable resources
- DSP Slices: 1,344 DSP48E1 slices for high-performance signal processing
- Block RAM: 11,664 Kb of dedicated block RAM for data storage and buffering
- Package: FF1759 (Fine-Pitch Ball Grid Array) with 1,759 pins
- Speed Grade: -3 (highest performance grade available)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Key Performance Features
The XC6VSX315T-3FF1759C delivers exceptional performance metrics that set it apart in the FPGA market:
- Maximum System Clock: Up to 600 MHz internal clock frequency
- SerDes Transceivers: 36 GTX transceivers supporting up to 6.6 Gbps data rates
- Memory Interface: Support for DDR3-1333, DDR2, QDR II+, and RLDRAM II
- Power Consumption: Optimized power management with multiple voltage domains
- Configuration: Multiple configuration options including JTAG, SelectMAP, and SPI
Connectivity and I/O
- User I/O Pins: 720 user I/O pins with support for multiple voltage standards
- High-Speed Serial: 36 GTX transceivers for high-bandwidth applications
- Memory Controllers: Built-in memory controller blocks for various memory types
- Clock Management: 12 CMTs (Clock Management Tiles) with PLLs and DCMs
Price
Current Market Price: Contact authorized distributors for current XC6VSX315T-3FF1759C pricing
- Pricing varies based on order quantity, lead time, and distribution channel
- Volume discounts available for orders of 100+ units
- Engineering samples may be available for qualified design projects
- Extended temperature and automotive grades available at premium pricing
Note: The XC6VSX315T-3FF1759C is a high-end FPGA with pricing reflecting its advanced capabilities and extensive resources. Contact Xilinx authorized distributors for detailed quotations.
Documents & Media
Technical Documentation
Essential documentation for successful XC6VSX315T-3FF1759C implementation:
- Data Sheet: Complete electrical and timing specifications
- User Guide: Comprehensive implementation and design guidelines
- Package Information: Pin assignment and physical layout details
- Power and Thermal Guidelines: Thermal management and power delivery requirements
- Migration Guide: Guidelines for upgrading from previous Virtex generations
Design Resources
- Reference Designs: Proven design examples and application notes
- IP Core Library: Optimized IP cores specifically validated for XC6VSX315T-3FF1759C
- Evaluation Boards: Development platforms featuring the XC6VSX315T-3FF1759C
- Simulation Models: SPICE and timing models for system-level simulation
Software Tools
- Vivado Design Suite: Latest development environment support
- ISE Design Suite: Legacy tool support for existing projects
- ChipScope Pro: Integrated logic analyzer for debugging
- PlanAhead: Floorplanning and implementation tools
Related Resources
Development Platforms
Several evaluation and development platforms support the XC6VSX315T-3FF1759C:
- ML605 Evaluation Kit: Comprehensive development platform
- Custom Carrier Boards: Third-party boards featuring XC6VSX315T-3FF1759C
- FMC Modules: FPGA Mezzanine Card ecosystem compatibility
- Debug Solutions: JTAG debuggers and programming cables
Compatible Products
- Virtex-6 Family: Other devices in the SXT, LXT, and HXT families
- Memory Solutions: Validated memory modules and controllers
- Power Management: Recommended power supply and regulation circuits
- Cooling Solutions: Thermal management options for high-performance applications
Technical Support
- Online Forums: Community-driven support and knowledge sharing
- Application Engineering: Direct access to Xilinx technical experts
- Training Programs: Comprehensive FPGA design courses and certifications
- Design Services: Professional design and consultation services
Environmental & Export Classifications
Environmental Compliance
The XC6VSX315T-3FF1759C meets stringent environmental and quality standards:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Compliant: Meets European chemical safety regulations
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- ISO Certifications: Manufactured in ISO 9001 and ISO 14001 certified facilities
Export Control Classifications
- ECCN: Export Control Classification Number as per US Commerce Department
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing location and supply chain information
- Export Licensing: Requirements for specific destination countries and applications
Quality and Reliability
- Qualification Standards: MIL-STD and JEDEC qualification testing
- Reliability Data: MTBF and failure rate specifications
- Quality Grade: Commercial, Industrial, and Military temperature grades available
- Traceability: Full manufacturing traceability and lot tracking
Packaging and Handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- ESD Protection: Electrostatic discharge handling requirements
- Storage Conditions: Temperature and humidity specifications for long-term storage
- Shipping: Anti-static packaging and handling procedures
The XC6VSX315T-3FF1759C represents the pinnacle of Virtex-6 SXT FPGA technology, offering unmatched performance for the most demanding signal processing applications. Its combination of high logic density, extensive DSP resources, and high-speed connectivity makes it the preferred choice for next-generation system designs.
