Product Specifications
The XC6VSX315T-2FFG1156I features robust specifications that make it suitable for complex digital designs. This FPGA contains 315,000 logic cells with 49,920 configurable logic blocks (CLBs), providing extensive resources for implementing sophisticated algorithms and data processing functions. The device includes 1,344 DSP48E1 slices, enabling efficient implementation of multiply-accumulate operations and digital filtering applications.
Memory resources include 1,210 block RAM/FIFO blocks totaling 15,552 Kb of dedicated memory, plus additional distributed RAM capabilities. The XC6VSX315T-2FFG1156I supports up to 600 user I/O pins in the FFG1156 package, offering flexible connectivity options for various system interfaces. Operating at speed grade -2, this FPGA delivers balanced performance and power consumption for industrial applications.
The device operates across an industrial temperature range of -40ยฐC to +100ยฐC, ensuring reliable performance in harsh environmental conditions. Power supply requirements include 1.0V core voltage and 2.5V/3.3V I/O voltage support, with comprehensive power management features for optimized energy efficiency.
Price
Pricing for the XC6VSX315T-2FFG1156I varies based on quantity, supplier, and market conditions. As a high-end FPGA from the Virtex-6 family, expect pricing in the premium range typical of advanced programmable logic devices. For current pricing information and volume discounts, contact authorized Xilinx distributors or electronic component suppliers. Pricing considerations should include development tools, licensing costs, and long-term availability when planning projects around the XC6VSX315T-2FFG1156I.
Documents & Media
Comprehensive documentation supports the XC6VSX315T-2FFG1156I development process. The official Virtex-6 FPGA Data Sheet provides detailed electrical specifications, timing parameters, and package information. The Virtex-6 FPGA Configuration User Guide offers essential information for device programming and configuration management.
Design tools include Xilinx ISE Design Suite and Vivado Design Suite, which provide complete development environments for the XC6VSX315T-2FFG1156I. Application notes cover specific implementation topics such as DSP design techniques, high-speed I/O interfacing, and power optimization strategies. Reference designs and example projects demonstrate best practices for utilizing the FPGA’s advanced features.
Package drawings, pin assignment files, and PCB design guidelines ensure proper board-level implementation of the XC6VSX315T-2FFG1156I. Thermal design guidelines help engineers manage heat dissipation in demanding applications.
Related Resources
The XC6VSX315T-2FFG1156I ecosystem includes various development boards and reference platforms. Xilinx ML605 and similar evaluation boards provide hardware platforms for prototyping and validation. Third-party development boards from partners offer additional options for specific application domains.
Software tools complement the hardware, including ChipScope Pro for debugging, System Generator for DSP design, and embedded development kits for processor-based designs. IP cores from Xilinx and third-party vendors accelerate development by providing pre-verified functions for common applications.
Training resources include online courses, webinars, and documentation covering FPGA design methodologies specific to Virtex-6 devices. Community forums and technical support channels provide assistance throughout the development process with the XC6VSX315T-2FFG1156I.
Environmental & Export Classifications
The XC6VSX315T-2FFG1156I meets stringent environmental and regulatory requirements for industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) directive, ensuring environmentally responsible manufacturing and disposal. Lead-free package construction supports green electronics initiatives while maintaining reliability standards.
Export classification falls under specific ECCN (Export Control Classification Number) categories due to the advanced processing capabilities of the XC6VSX315T-2FFG1156I. Compliance with U.S. export administration regulations may be required for international shipments, particularly to certain countries or for specific applications. Users should verify current export requirements with relevant authorities before international distribution.
The FPGA achieves appropriate qualification levels for aerospace and defense applications, including radiation tolerance characterization where applicable. Quality certifications support use in mission-critical systems requiring high reliability and long-term operation stability.
Environmental operating specifications ensure the XC6VSX315T-2FFG1156I performs reliably across industrial temperature ranges while meeting electromagnetic compatibility requirements for various deployment environments.
The XC6VSX315T-2FFG1156I represents proven FPGA technology for applications demanding high performance, reliability, and comprehensive DSP capabilities in industrial environments.
