Product Specifications
The XC6VSX315T-2FFG1156C features an impressive array of technical specifications designed for mission-critical applications. This Virtex-6 SX FPGA contains 315,000 logic cells, providing extensive programmable logic resources for complex digital designs. The device incorporates 1,344 DSP48E1 slices, enabling efficient implementation of multiply-accumulate operations and advanced digital signal processing algorithms.
Key specifications of the XC6VSX315T-2FFG1156C include:
- Logic Cells: 315,000
- Package Type: FFG1156 (Fine-Pitch Ball Grid Array)
- Speed Grade: -2 (balanced performance and power)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Block RAM: 11,664 Kb total capacity
- DSP Slices: 1,344 DSP48E1 blocks
- GTX Transceivers: 36 channels supporting up to 6.6 Gbps
- I/O Pins: 600 user I/O pins
- Power Supply: Multiple voltage domains (1.0V, 1.8V, 2.5V, 3.3V)
The XC6VSX315T-2FFG1156C utilizes advanced 40nm CMOS technology, delivering superior performance per watt compared to previous generation FPGAs. The device supports various memory interfaces including DDR3, QDR-II+, and RLDRAM-II, ensuring compatibility with high-bandwidth memory systems.
Price
Pricing for the XC6VSX315T-2FFG1156C varies based on quantity, distribution channel, and market conditions. As a high-end Virtex-6 device, the XC6VSX315T-2FFG1156C typically commands premium pricing reflecting its advanced capabilities and extensive logic resources.
For current pricing information on the XC6VSX315T-2FFG1156C:
- Contact authorized Xilinx distributors for volume pricing
- Request quotes through electronic component suppliers
- Consult with Xilinx sales representatives for large-scale deployments
- Consider evaluation boards and development kits for prototyping needs
Market pricing for the XC6VSX315T-2FFG1156C generally reflects its position as a flagship device in the Virtex-6 SX family, with costs varying significantly based on procurement volume and lead times.
Documents & Media
Comprehensive documentation supports successful implementation of the XC6VSX315T-2FFG1156C in your designs. Essential resources include the official Xilinx datasheet providing complete electrical specifications, timing parameters, and packaging information for the XC6VSX315T-2FFG1156C.
Critical documentation for the XC6VSX315T-2FFG1156C includes:
- Product Datasheet: Complete electrical and mechanical specifications
- Configuration User Guide: Programming and configuration procedures
- Packaging and Pinout Documentation: Detailed pin assignments and package dimensions
- Power and Thermal Guidelines: Power consumption analysis and thermal management
- Migration Guides: Transitioning from other FPGA families
- Application Notes: Design best practices and implementation examples
Development tools supporting the XC6VSX315T-2FFG1156C include Xilinx ISE Design Suite and Vivado Design Suite, providing comprehensive synthesis, implementation, and debugging capabilities. Reference designs and IP cores accelerate development cycles when working with the XC6VSX315T-2FFG1156C.
Related Resources
The XC6VSX315T-2FFG1156C ecosystem includes numerous complementary products and resources to support your development efforts. Evaluation boards featuring the XC6VSX315T-2FFG1156C provide immediate access to the device’s capabilities without custom hardware development.
Supporting resources for XC6VSX315T-2FFG1156C development:
- ML605 Evaluation Board: Full-featured development platform
- Development Software: ISE Design Suite and Vivado tools
- IP Core Library: Pre-verified intellectual property blocks
- Reference Designs: Proven implementation examples
- Training Materials: Online courses and documentation
- Community Forums: Technical support and user discussions
Third-party vendors offer additional solutions compatible with the XC6VSX315T-2FFG1156C, including development boards, debugging tools, and specialized IP cores. These resources extend the capabilities of the XC6VSX315T-2FFG1156C for specific application domains.
Environmental & Export Classifications
The XC6VSX315T-2FFG1156C complies with international environmental standards and export regulations governing semiconductor devices. RoHS compliance ensures the device meets European Union restrictions on hazardous substances, while REACH registration addresses chemical safety requirements.
Environmental compliance for the XC6VSX315T-2FFG1156C:
- RoHS Compliant: Meets EU Directive 2011/65/EU requirements
- REACH Registered: Complies with European chemical regulations
- Halogen-Free: Reduced environmental impact
- Lead-Free: Compatible with lead-free assembly processes
- Conflict Minerals: Compliant with Dodd-Frank Act requirements
Export classification of the XC6VSX315T-2FFG1156C falls under standard semiconductor regulations, with specific restrictions potentially applying based on end-user applications and destination countries. The device carries appropriate Export Control Classification Numbers (ECCN) for international trade compliance.
Temperature and reliability specifications for the XC6VSX315T-2FFG1156C ensure operation across commercial temperature ranges with extensive qualification testing validating long-term reliability in demanding applications.
The XC6VSX315T-2FFG1156C delivers unmatched performance and flexibility for advanced FPGA applications, combining substantial logic resources with high-speed connectivity and comprehensive development support. Whether implementing complex DSP algorithms, high-speed communication protocols, or custom computing architectures, the XC6VSX315T-2FFG1156C provides the foundation for innovative electronic designs.
