Product Specifications
The XC6VSX315T-2FF1759I features an impressive array of technical specifications that set it apart in the FPGA market. This device contains 315,000 logic cells with 49,200 configurable logic blocks (CLBs), providing extensive resources for complex digital designs. The FPGA includes 1,344 DSP48E1 slices optimized for high-performance signal processing applications, enabling efficient implementation of digital filters, FFTs, and other mathematical operations.
Memory capabilities of the XC6VSX315T-2FF1759I include 19,080 Kb of block RAM, offering substantial on-chip storage for data buffering and processing. The device operates at a speed grade of -2, supporting high-frequency operations while maintaining signal integrity. The FF1759 package provides 1,759 pins in a fine-pitch ball grid array (BGA) format, offering extensive I/O connectivity options.
Power consumption characteristics make the XC6VSX315T-2FF1759I suitable for power-conscious applications, with advanced power management features including dynamic voltage scaling and clock gating capabilities. The device supports multiple I/O standards including LVDS, SSTL, and HSTL, ensuring compatibility with various system interfaces.
Price Information
Pricing for the XC6VSX315T-2FF1759I varies based on quantity, distributor, and market conditions. As a high-end FPGA device, the XC6VSX315T-2FF1759I typically commands premium pricing reflecting its advanced capabilities and extensive resource allocation. Customers should contact authorized Xilinx distributors for current pricing information, volume discounts, and availability status.
Industrial customers often benefit from long-term supply agreements and custom pricing arrangements when incorporating the XC6VSX315T-2FF1759I into production designs. Educational institutions and research organizations may qualify for academic pricing programs that make this advanced FPGA more accessible for learning and development purposes.
Documents & Media
Comprehensive documentation supports the XC6VSX315T-2FF1759I implementation process, including detailed datasheets, user guides, and application notes. The official Xilinx datasheet provides complete electrical specifications, timing characteristics, and package information essential for proper device selection and board design.
Vivado Design Suite documentation offers extensive guidance for implementing designs targeting the XC6VSX315T-2FF1759I, including synthesis, place-and-route, and timing closure techniques. Reference designs and example projects demonstrate best practices for utilizing the device’s DSP and memory resources effectively.
Technical application notes cover specialized topics such as high-speed I/O design, power estimation, and thermal management specific to the XC6VSX315T-2FF1759I. Video tutorials and webinar recordings provide additional learning resources for engineers working with this advanced FPGA platform.
Related Resources
Development boards featuring the XC6VSX315T-2FF1759I provide hands-on evaluation platforms for prototyping and proof-of-concept development. These boards typically include essential peripherals, debugging interfaces, and expansion connectors to facilitate comprehensive system evaluation.
Xilinx IP cores optimized for Virtex-6 architecture enhance productivity when designing with the XC6VSX315T-2FF1759I. These pre-verified IP blocks include communication protocols, signal processing functions, and interface controllers that accelerate time-to-market for complex designs.
Third-party development tools and debugging solutions complement the standard Xilinx toolchain, offering specialized capabilities for specific application domains. Hardware-in-the-loop simulation platforms and protocol analyzers support comprehensive system validation using the XC6VSX315T-2FF1759I.
Environmental & Export Classifications
The XC6VSX315T-2FF1759I meets stringent environmental and reliability standards required for mission-critical applications. Operating temperature range extends from 0ยฐC to 85ยฐC for commercial grade devices, with industrial and extended temperature variants available for harsh environment applications.
RoHS compliance ensures the XC6VSX315T-2FF1759I meets international environmental regulations regarding hazardous substances in electronic equipment. The device qualifies for lead-free assembly processes while maintaining high reliability standards throughout its operational lifetime.
Export classification information for the XC6VSX315T-2FF1759I is available through official channels, as advanced FPGA devices may be subject to export control regulations depending on the intended application and destination country. Customers should verify export requirements with appropriate authorities before international shipment or deployment.
Quality certifications including ISO 9001 manufacturing standards and automotive-grade qualifications may be available for specific versions of the XC6VSX315T-2FF1759I, depending on target application requirements. Military and aerospace applications can benefit from enhanced screening and qualification testing options that ensure reliable operation in demanding environments.
The XC6VSX315T-2FF1759I represents a pinnacle of FPGA technology, combining exceptional performance capabilities with comprehensive support resources to enable successful implementation of the most demanding digital signal processing and high-speed computing applications.
