Product Specification
The XC6VSX315T-1FFG1759I delivers outstanding performance through its sophisticated architecture and comprehensive feature set. This FPGA incorporates 315,000 logic cells with advanced 6-input lookup tables (LUTs) and flip-flops, providing exceptional logic density for complex digital designs.
Core Specifications:
- Logic Cells: 315,000
- CLB Slices: 49,200
- Block RAM: 11,664 Kb total capacity
- DSP48E1 Slices: 1,344 dedicated multiply-accumulate units
- Package Type: FFG1759 (Fine-pitch Ball Grid Array)
- Speed Grade: -1 (standard performance)
- Operating Temperature: Industrial grade (I suffix)
The XC6VSX315T-1FFG1759I features extensive I/O capabilities with up to 600 user I/O pins, supporting various signaling standards including LVDS, SSTL, and HSTL. The device includes integrated high-speed serial transceivers, memory controllers, and clock management units, enabling seamless integration with modern system architectures.
Memory and Processing Features:
- Distributed RAM and ROM capabilities
- Integrated FIFO support
- Advanced clock domain crossing
- Built-in error correction for enhanced reliability
- Support for partial reconfiguration
Price
The XC6VSX315T-1FFG1759I is competitively priced within the high-end FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For accurate pricing information and volume discounts, contact authorized Xilinx distributors or visit official semiconductor marketplaces.
Pricing Considerations:
- Unit pricing typically decreases with higher quantities
- Long-term supply agreements available for production volumes
- Development kit pricing separate from production units
- Regional pricing variations may apply
Contact certified distributors for current XC6VSX315T-1FFG1759I pricing and availability information.
Documents & Media
Comprehensive technical documentation supports the XC6VSX315T-1FFG1759I throughout the design cycle. Essential resources include detailed datasheets, user guides, and application notes that facilitate successful implementation.
Primary Documentation:
- Virtex-6 FPGA Data Sheet with complete electrical specifications
- XC6VSX315T-1FFG1759I Product Brief and selection guide
- Package and pinout documentation for FFG1759 package
- Power consumption and thermal management guidelines
- PCB design recommendations and reference layouts
Design Tools and Software:
- Xilinx Vivado Design Suite compatibility information
- ISE Design Suite legacy support documentation
- IP core integration guides and libraries
- Simulation models and timing constraints files
Application Resources:
- Reference designs for common applications
- Board support package documentation
- Signal integrity analysis tools and guidelines
- Debug and verification methodologies
Related Resources
The XC6VSX315T-1FFG1759I ecosystem includes development boards, IP cores, and third-party solutions that accelerate time-to-market for embedded system designs.
Development Platforms:
- Xilinx evaluation boards featuring the XC6VSX315T-1FFG1759I
- Third-party development modules and carrier cards
- Custom board design services and reference implementations
- Prototyping and validation platforms
IP Core Library:
- Digital signal processing IP blocks
- Communication protocol implementations
- Memory interface controllers
- Video and image processing accelerators
- Encryption and security IP cores
Training and Support:
- Xilinx University Program resources
- Online training modules and certification programs
- Community forums and technical support channels
- Professional design services and consulting
Compatible Components:
- Memory devices optimized for Virtex-6 interfaces
- Clock generation and distribution solutions
- Power management ICs and modules
- Connector and cable assemblies
Environmental & Export Classifications
The XC6VSX315T-1FFG1759I meets stringent environmental standards and regulatory requirements for global deployment in commercial and industrial applications.
Environmental Compliance:
- RoHS compliant lead-free package construction
- REACH regulation compliance for European markets
- Conflict minerals reporting and supply chain transparency
- ISO 14001 environmental management system compliance
Operating Conditions:
- Industrial temperature range: -40ยฐC to +100ยฐC junction temperature
- Commercial grade variants available for standard temperature ranges
- Humidity resistance per JEDEC standards
- Thermal cycling and shock resistance specifications
Export and Trade Classifications:
- Export Control Classification Number (ECCN) as per US regulations
- Harmonized System (HS) codes for international trade
- Country of origin documentation and certificates
- Compliance with International Traffic in Arms Regulations (ITAR) where applicable
Quality and Reliability:
- Qualification per JEDEC industry standards
- Automotive qualification available for automotive variants
- Extended product lifecycle support
- Comprehensive failure analysis and quality assurance programs
The XC6VSX315T-1FFG1759I represents Xilinx’s commitment to delivering high-performance programmable logic solutions that meet the evolving needs of advanced electronic systems across multiple industries and applications.
