Product Specifications
The XC6VSX315T-1FFG1156I features an impressive array of technical specifications that position it as a leading solution in the FPGA market:
Core Architecture:
- Logic Cells: 315,360 system gates
- Configurable Logic Blocks (CLBs): 49,200
- Slices: 12,300 (4 LUTs and 8 flip-flops per slice)
- Block RAM: 11,664 Kb total capacity
- DSP48E1 Slices: 1,344 for high-performance arithmetic operations
Memory and Processing:
- Distributed RAM: 1,538 Kb
- Maximum user I/O: 600 pins
- PCIe Gen2 x8 endpoint and root port capability
- Integrated Memory Controller for DDR3/DDR2 interfaces
Package and Operating Conditions:
- Package Type: FFG1156 (35mm x 35mm flip-chip fine-pitch BGA)
- Speed Grade: -1 (balanced performance and power consumption)
- Operating Temperature: Industrial range (-40°C to +100°C)
- Supply Voltage: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
Advanced Features:
- Built-in configuration memory
- Clock management tiles with phase-locked loops (PLLs)
- High-speed serial transceivers
- Advanced power management capabilities
- IEEE 1149.1 JTAG boundary scan support
Price
The XC6VSX315T-1FFG1156I is positioned as a premium FPGA solution, with pricing typically reflecting its advanced capabilities and industrial-grade specifications. Pricing varies based on quantity, distribution channel, and current market conditions. For the most accurate and current pricing information for the XC6VSX315T-1FFG1156I, we recommend contacting authorized Xilinx distributors or visiting official pricing portals. Volume discounts are typically available for production quantities, making this FPGA cost-effective for large-scale deployments.
Documents & Media
Comprehensive technical documentation supports the XC6VSX315T-1FFG1156I implementation and design process:
Essential Documentation:
- Virtex-6 FPGA Data Sheet (DS150) – Complete electrical and timing specifications
- Virtex-6 FPGA User Guide (UG360) – Detailed architecture and configuration guidance
- XC6VSX315T-1FFG1156I Package and Pinout specifications
- PCB Design Guidelines for FFG1156 package
- Power estimation and thermal management guidelines
Development Resources:
- Xilinx ISE Design Suite compatibility documentation
- Vivado Design Suite migration guides
- Reference designs and application notes
- Simulation models and timing analysis files
- Programming and configuration guides
Quality and Reliability:
- Military and aerospace qualification reports
- Reliability test reports and MTBF calculations
- Environmental stress screening documentation
- Quality management system certifications
Related Resources
The XC6VSX315T-1FFG1156I ecosystem includes extensive resources to accelerate development and ensure successful implementation:
Development Tools:
- Xilinx Vivado Design Suite (latest versions)
- Legacy ISE Design Suite support
- ChipScope Pro embedded logic analyzer
- System Generator for DSP applications
- SDK (Software Development Kit) for embedded processing
Evaluation and Development Boards:
- Virtex-6 FPGA ML605 Evaluation Kit
- Custom carrier boards supporting FFG1156 package
- Development modules and reference platforms
- Debugging and programming hardware
IP Cores and Libraries:
- LogiCORE IP portfolio compatibility
- DSP and communications IP blocks
- Memory controller and interface IP
- Processor IP cores (MicroBlaze, PowerPC)
- Third-party IP ecosystem support
Community and Support:
- Xilinx Community Forums for XC6VSX315T-1FFG1156I
- Application engineering support
- Training courses and webinars
- Design methodology guides
- Best practices documentation
Environmental & Export Classifications
The XC6VSX315T-1FFG1156I meets stringent environmental and regulatory standards essential for global deployment:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Halogen-free package options available
- Conflict minerals reporting compliance
- ISO 14001 environmental management system certification
Export Control Classifications:
- Export Control Classification Number (ECCN) as per US Commerce Department
- International Traffic in Arms Regulations (ITAR) status
- Wassenaar Arrangement dual-use technology classifications
- Country-specific import/export documentation requirements
- End-user certificate requirements for restricted destinations
Quality and Reliability Standards:
- Automotive Quality Grade (AQG) availability for automotive applications
- Military temperature range qualification (-55°C to +125°C available)
- Space-grade radiation tolerance options
- IPC-A-610 assembly and workmanship standards
- ISO 9001 quality management system compliance
Packaging and Handling:
- Moisture Sensitivity Level (MSL) classification
- Anti-static discharge (ESD) protection requirements
- Lead-free and tin whisker mitigation
- Traceability and lot control documentation
- Long-term availability and obsolescence management
The XC6VSX315T-1FFG1156I represents a pinnacle of FPGA technology, combining high performance, reliability, and comprehensive support resources. Its robust feature set and extensive ecosystem make it an excellent choice for applications requiring the highest levels of processing capability and system integration flexibility.
