Product Specifications
Core Architecture & Performance
- Device Family: Virtex-6 SXT (Signal Processing with eXtended Technology)
- Logic Cells: 314,880 system logic cells
- Process Technology: Advanced 40nm CMOS copper process
- Architecture: Third-generation ASMBLโข (Advanced Silicon Modular Block) column-based
- Speed Grade: -1 (standard performance grade)
- Supply Voltage: 1.0V core voltage (VCCINT)
Package & Physical Characteristics
- Package Type: FFG1156 (Flip-Chip Fine-pitch Ball Grid Array)
- Pin Count: 1,156 pins
- Package Size: Industry-standard FC-BGA format
- Temperature Range: Commercial (0ยฐC to +85ยฐC)
- Lead-Free: RoHS compliant, Pb-free package available
Key Technical Features
- Real 6-input Look-Up Tables (LUTs): Enhanced logic density and performance
- Dual LUT5 Option: Flexible 5-input LUT configuration
- Built-in System Blocks: Multiple integrated hard IP blocks for system-level functionality
- Advanced Clock Management: Mixed-Mode Clock Managers (MMCM) with zero-delay buffering
- 36-Kb Block RAM/FIFOs: Dual-port memory blocks with programmable widths up to 36 bits
- DSP48E1 Slices: Dedicated signal processing blocks optimized for high-performance DSP applications
- GTX Transceivers: High-speed serial connectivity for advanced I/O requirements
I/O and Connectivity
- Maximum I/O Pins: Up to 720 user I/O pins (package dependent)
- SelectIO Technology: Configurable I/O supporting multiple standards up to 2.5V
- Serial Transceivers: Integrated GTX transceivers for high-speed serial communication
- PCI Express Support: Integrated blocks for PCIe endpoint and root port implementations
Price Information
The XC6VSX315T-1FFG1156C is available through authorized distributors including:
- DigiKey Electronics: Contact for current pricing and availability
- Mouser Electronics: Request quote for volume pricing
- FPGAkey: Real-time price monitoring from global suppliers
- DEX: Competitive pricing for professional customers
Pricing varies based on:
- Order quantity (volume discounts available)
- Lead time requirements
- Package options (commercial vs. extended temperature)
- Distribution channel
Note: Due to the legacy status of Virtex-6 devices, pricing may vary significantly based on availability. Contact authorized distributors for current quotes.
Documents & Media
Official Documentation
- DS150: Virtex-6 Family Overview Datasheet
- DS152: Virtex-6 FPGA DC and Switching Characteristics
- UG366: Virtex-6 FPGA Configuration User Guide
- UG365: Virtex-6 FPGA Packaging and Pinout Specifications
- UG370: Virtex-6 FPGA System Monitor User Guide
Design Resources
- Product Brief: Virtex-6 SXT family feature summary
- Selection Guide: Device comparison and selection criteria
- PCB Design Guidelines: Layout recommendations for FFG1156 package
- Power Estimation Tools: Xilinx Power Estimator (XPE) spreadsheet
Application Notes
- Signal processing implementation guides
- High-speed design considerations
- Clock management best practices
- Memory interface optimization
Related Resources
Development Tools
- Vivado Design Suite: Modern FPGA design environment (recommended)
- ISE Design Suite: Legacy tool support for Virtex-6 devices
- ChipScope Pro: Real-time verification and debugging
- System Generator: DSP design workflow integration
IP Cores & Libraries
- LogiCORE IP: Pre-verified intellectual property blocks
- DSP Libraries: Optimized signal processing functions
- Connectivity IP: Ethernet, PCIe, and serial protocol stacks
- Memory Controllers: DDR2/DDR3 SDRAM interface solutions
Hardware Platforms
- Evaluation Boards: Third-party development platforms
- Reference Designs: Application-specific starting points
- FMC Modules: FPGA Mezzanine Card compatibility
- Debug Probes: JTAG and configuration hardware
Software Integration
- LabVIEW FPGA: Graphical programming environment
- MATLAB/Simulink: Model-based design workflow
- C/C++ Synthesis: High-level synthesis tools
- Embedded Software: MicroBlaze soft processor support
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Lead-free (Pb-free) package available
- REACH Compliant: EU chemical regulation compliance
- Conflict Minerals: Reporting available per industry standards
- Green Initiative: Part of AMD’s environmental sustainability program
Operating Conditions
- Commercial Temperature: 0ยฐC to +85ยฐC junction temperature
- Extended Temperature: -40ยฐC to +100ยฐC (selected devices)
- Supply Voltage Tolerance: ยฑ5% on all supply rails
- ESD Protection: Class 1C per JEDEC standard
Export Control Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Manufactured in multiple qualified facilities
- Export Restrictions: Subject to applicable export regulations
Quality & Reliability
- Qualification Standards: AEC-Q100 automotive qualification available
- Reliability Testing: HTOL, TC, THB per JEDEC standards
- Quality Management: ISO 9001:2015 certified manufacturing
- Failure Rate: <10 FIT (Failures in Time) at 55ยฐC
Product Lifecycle
- Status: Active product with ongoing support
- Legacy Designation: Not recommended for new designs
- Migration Path: Refer to current Versal or Zynq families for new projects
- Long-term Support: Available through authorized distribution channels
The XC6VSX315T-1FFG1156C represents a mature FPGA solution for signal processing applications requiring proven performance and reliability. While newer device families offer enhanced capabilities, this Virtex-6 SXT device continues to serve existing designs with robust support and documentation.
