Product Specifications
The XC6VSX315T-1FF1759I offers impressive technical capabilities designed for complex digital signal processing tasks:
Core Architecture Features:
- 315,000 logic cells providing extensive programmable resources
- 1,344 DSP48E1 slices for high-performance mathematical operations
- 19,080 Kb of block RAM for efficient data storage and buffering
- Advanced 40nm CMOS process technology ensuring optimal power efficiency
Package and Interface Details:
- FF1759 package type in a robust 1759-pin Fine-Pitch Ball Grid Array (FBGA)
- Speed grade -1 offering balanced performance and power consumption
- Industrial temperature range operation (-40ยฐC to +100ยฐC)
- Multiple high-speed I/O standards support including LVDS, DDR3, and PCIe
Performance Characteristics:
- Maximum operating frequency up to 600 MHz for demanding real-time applications
- Low-power design with multiple power management features
- High-speed serial connectivity options for modern communication protocols
- Integrated memory controllers for seamless external memory interfacing
Price
The XC6VSX315T-1FF1759I is positioned as a premium FPGA solution, with pricing typically reflecting its advanced capabilities and extensive feature set. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing may vary based on order quantity, delivery requirements, and regional market conditions.
For budget planning purposes, consider factors such as development tools licensing, supporting components, and long-term availability when evaluating the total cost of ownership for the XC6VSX315T-1FF1759I.
Documents & Media
Essential documentation and resources for the XC6VSX315T-1FF1759I include:
Technical Documentation:
- Official Xilinx datasheet containing detailed electrical specifications and timing parameters
- Virtex-6 FPGA User Guide with comprehensive implementation guidelines
- Package and pinout documentation for PCB design considerations
- Power estimation and thermal management guides
Development Resources:
- Vivado Design Suite compatibility information and optimization guidelines
- Reference designs and application notes for common use cases
- IP core integration documentation for accelerated development
- Debug and verification methodologies specific to Virtex-6 architecture
Design Files:
- IBIS models for signal integrity analysis
- Package mechanical drawings and 3D models for mechanical design
- Constraint files and board design guidelines
- Example projects demonstrating key features and capabilities
Related Resources
The XC6VSX315T-1FF1759I ecosystem includes various supporting products and resources:
Development Tools:
- Xilinx Vivado Design Suite for design entry, synthesis, and implementation
- ChipScope Pro for real-time hardware debugging and analysis
- System Generator for DSP enabling MATLAB/Simulink integration
- SDK (Software Development Kit) for embedded processor development
Companion Products:
- Compatible memory solutions including DDR3 SDRAM and QDR SRAM
- Clock generation and distribution devices for system synchronization
- Power management ICs optimized for FPGA applications
- High-speed connectors and interface components
Training and Support:
- Xilinx University Program resources for educational applications
- Technical support through authorized channels and community forums
- Training courses covering FPGA design methodologies and best practices
- Application engineering support for complex implementation challenges
Environmental & Export Classifications
The XC6VSX315T-1FF1759I meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant manufacturing
- REACH regulation compliance for European market requirements
- Conflict minerals reporting in accordance with SEC regulations
- ISO 14001 certified manufacturing processes ensuring environmental responsibility
Export and Trade Classifications:
- Export Control Classification Number (ECCN) designation for international trade compliance
- Country of origin marking for customs and regulatory purposes
- Dual-use technology classifications where applicable
- Specific licensing requirements for certain end-use applications and destinations
Quality and Reliability Standards:
- Automotive qualification levels for harsh environment applications
- Military and aerospace grade options available for defense applications
- Extended temperature range testing and qualification
- Long-term product availability commitments for critical applications
The XC6VSX315T-1FF1759I represents a sophisticated FPGA solution that combines high performance, flexibility, and reliability for next-generation electronic systems. Its comprehensive feature set and robust support ecosystem make it an excellent choice for engineers developing advanced signal processing, communications, and computing applications.
