Product Specifications
The XC6VSX315T-1FF1759C features an impressive array of technical specifications that position it as a premium solution in the FPGA market:
Core Architecture:
- Logic Cells: 315,000 equivalent logic cells
- Configurable Logic Blocks (CLBs): 49,200
- Block RAM: 19,008 Kb total memory
- DSP48E1 Slices: 1,344 dedicated DSP blocks
- I/O Pins: 1,200 user I/O pins
Performance Characteristics:
- Speed Grade: -1 (standard performance)
- Package Type: FF1759 (Fine-Pitch BGA)
- Commercial temperature range: 0°C to +85°C
- Advanced 40nm process technology
- Maximum operating frequency up to 600 MHz
Connectivity Features:
- High-speed serial transceivers
- PCIe Gen2 interface support
- Ethernet MAC support
- Advanced clock management tiles
The XC6VSX315T-1FF1759C incorporates Xilinx’s innovative architecture optimizations, including enhanced DSP capabilities and improved power efficiency, making it suitable for bandwidth-intensive applications requiring real-time processing.
Price
Pricing for the XC6VSX315T-1FF1759C varies based on order quantity, distribution channel, and current market conditions. As a high-end Virtex-6 device, this FPGA typically falls into the premium pricing tier within Xilinx’s product portfolio.
For accurate pricing information on the XC6VSX315T-1FF1759C, customers should contact authorized Xilinx distributors or sales representatives. Volume pricing discounts are commonly available for production quantities, and engineering samples may be available for qualified development projects.
Educational institutions and research organizations may be eligible for special academic pricing programs that can significantly reduce the cost of the XC6VSX315T-1FF1759C for qualifying projects.
Documents & Media
Comprehensive technical documentation supports the XC6VSX315T-1FF1759C throughout the design and implementation process:
Essential Documentation:
- Product datasheet with complete electrical specifications
- Package and pinout documentation for FF1759 BGA
- DC and switching characteristics
- Configuration and programming guides
- Power consumption analysis and thermal guidelines
Design Resources:
- Reference designs and application notes
- Vivado Design Suite compatibility information
- IP core integration guides
- Signal integrity analysis tools
- Layout and routing recommendations
Development Tools:
- Xilinx ISE Design Suite support
- ChipScope Pro analyzer compatibility
- Hardware debugging utilities
- Simulation models and libraries
The XC6VSX315T-1FF1759C documentation package includes detailed timing analysis, power estimation worksheets, and best practices for achieving optimal performance in target applications.
Related Resources
The XC6VSX315T-1FF1759C ecosystem includes numerous complementary products and resources:
Development Platforms:
- Virtex-6 FPGA ML605 Evaluation Kit
- Custom carrier boards and modules
- High-speed connector solutions
- Power supply reference designs
Software Tools:
- Xilinx Vivado Design Suite
- SDK (Software Development Kit)
- IP Catalog with pre-verified cores
- System Generator for DSP applications
Technical Support:
- Xilinx community forums and knowledge base
- Application engineering support
- Training courses and webinars
- Third-party design services and consulting
Compatible Products:
- Other Virtex-6 family devices for scalability
- Zynq SoC alternatives for ARM processing needs
- Memory interfaces and controllers
- High-speed analog-to-digital converters
The XC6VSX315T-1FF1759C benefits from extensive third-party IP availability and proven reference designs across multiple application domains.
Environmental & Export Classifications
The XC6VSX315T-1FF1759C meets stringent environmental and regulatory requirements for global deployment:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance
- Halogen-free package materials available
- JEDEC moisture sensitivity level classification
- Lead-free soldering process compatibility
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive qualification available (selected grades)
- Military temperature range options
- Extended reliability testing and validation
Export Classifications:
- Export Control Classification Number (ECCN) designation
- International Traffic in Arms Regulations (ITAR) status
- Country-specific import/export requirements
- End-use and end-user restrictions may apply
Packaging and Handling:
- Anti-static packaging for ESD protection
- Moisture barrier bags with humidity indicator cards
- Detailed handling and storage instructions
- Traceability documentation for quality control
The XC6VSX315T-1FF1759C manufacturing process incorporates comprehensive quality assurance measures and environmental controls to ensure consistent performance and reliability across all production units.
Understanding the export classification and environmental specifications of the XC6VSX315T-1FF1759C is essential for international projects and applications requiring specific compliance certifications. Customers should verify current regulatory status and any applicable restrictions before finalizing design decisions or placing orders for this advanced FPGA device.
