Product Specifications
Core Architecture
- Family: Xilinx Virtex-6 LX Series
- Logic Cells: 758,784 logic elements
- Process Technology: 40nm state-of-the-art copper CMOS
- Voltage Supply: 0.95V to 1.05V operating range
- Speed Grade: -2 (commercial grade performance)
Physical Characteristics
- Package Type: 1760-pin Fine-pitch Ball Grid Array (FCBGA)
- Package Dimensions: 42.5mm ร 42.5mm
- Mounting Type: Surface Mount Technology (SMT)
- Pin Count: 1760 total pins
- I/O Pins: 1200 user-configurable I/O
Performance Features
- Configurable Logic Blocks (CLBs): 59,280
- Total RAM Bits: 26,542,080
- Operating Temperature Range: 0ยฐC to +85ยฐC (TJ – Junction Temperature)
- Architecture: Third-generation ASMBL (Advanced Silicon Modular Block)
Advanced Capabilities
- MMCM Blocks: Zero-delay buffering, frequency synthesis, clock-phase shifting
- SerDes Support: Data rates up to 480 Mb/s with oversampling
- DSP Slices: Integrated for high-performance signal processing
- Memory Controllers: Built-in support for various memory interfaces
- Connectivity Options: Extensive I/O standards support
Price Information
The XC6VLX760-2FF1760C pricing varies based on quantity, supplier, and market conditions. Current market pricing ranges:
- Single Unit Price: $16,000 – $20,000 USD (estimated retail)
- Volume Pricing: Available upon request for quantities of 25+ units
- Lead Time: 12-16 weeks for standard orders
- Availability: Contact authorized distributors for current stock levels
Note: Prices are subject to change based on market conditions and supplier availability. Contact authorized Xilinx distributors for current pricing and availability.
Documents & Media
Technical Documentation
- Official Datasheet: Virtex-6 Family Data Sheet (DS150)
- User Guide: Virtex-6 FPGA Configuration User Guide
- Package Information: 1760-FCBGA Package Documentation
- Pin-out Diagrams: Complete I/O pin assignments
- Thermal Characteristics: Junction temperature and power specifications
Development Resources
- Design Tools: Xilinx Vivado Design Suite and ISE Design Tools
- Reference Designs: Application-specific implementations
- Evaluation Boards: Virtex-6 FPGA development platforms
- IP Cores: Compatible LogiCORE IP library components
Application Notes
- High-Speed Design Guidelines: Signal integrity considerations
- Power Management: Optimal power consumption strategies
- Thermal Management: Heat dissipation recommendations
- PCB Design Guidelines: Layout considerations for 1760-FCBGA
Related Resources
Compatible Development Platforms
- Virtex-6 FPGA ML605 Evaluation Kit: Complete development environment
- Custom Carrier Boards: Third-party development solutions
- Emulation Platforms: Hardware-in-the-loop testing systems
Software Tools
- Vivado Design Suite: Modern FPGA design environment
- ISE Design Tools: Legacy support for Virtex-6 designs
- SDK: Software development kit for embedded processors
- ChipScope Pro: Real-time debugging and analysis
Alternative Part Numbers
- XC6VLX760-2FFG1760C: Alternative package option
- XC6VLX760-3FF1760C: Higher speed grade variant
- XC6VLX760-1FF1760C: Lower speed grade option
Application Areas
- Telecommunications: Base station processing, network infrastructure
- Aerospace & Defense: Radar processing, secure communications
- High-Performance Computing: Accelerated computing applications
- Industrial Control: Real-time control systems, motor control
- Video Processing: Broadcast equipment, video analytics
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Restriction of Hazardous Substances directive compliant
- WEEE Directive: Waste Electrical and Electronic Equipment compliant
- Lead-Free Package: Environmentally conscious manufacturing
- Halogen-Free: Meets environmental sustainability requirements
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Humidity: Non-condensing environment recommended
- Altitude: Sea level to 2000m operational altitude
- Shock & Vibration: Meets JEDEC standards for handling
Export Control Information
- ECCN Classification: Subject to Export Administration Regulations (EAR)
- Export License: May be required for certain destinations
- HTS Code: Harmonized Tariff Schedule classification available
- Country Restrictions: Consult current export control lists
Quality Standards
- ISO 9001: Manufacturing quality management compliance
- Automotive Grade: AEC-Q100 qualified variants available
- Military Standards: MIL-STD testing for defense applications
- Reliability Testing: Comprehensive qualification testing performed
Packaging & Handling
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- ESD Protection: Electrostatic discharge sensitive device
- Storage Temperature: -55ยฐC to +125ยฐC for long-term storage
- Shelf Life: Standard semiconductor shelf life specifications
The XC6VLX760-2FF1760C delivers unmatched programmable logic performance for applications requiring the highest levels of integration, flexibility, and computational capability. Its advanced architecture and comprehensive feature set make it the preferred choice for engineers developing next-generation systems across multiple industries.
For technical support, pricing inquiries, or application-specific guidance, contact authorized Xilinx distributors or visit the official AMD/Xilinx support portal.
