Product Specifications
The XC6VLX75T-L1FF784C offers robust specifications that make it ideal for complex digital signal processing and high-performance computing applications:
Core Architecture:
- Logic Cells: 75,840 logic cells providing extensive programmable resources
- CLB Slices: 11,760 configurable logic block slices for flexible design implementation
- Block RAM: 4,824 Kb of dedicated block RAM for efficient data storage
- DSP Slices: 288 DSP48E1 slices optimized for high-speed arithmetic operations
Memory and Processing:
- Distributed RAM: 752 Kb for distributed memory applications
- Maximum User I/O: 480 user I/O pins for comprehensive connectivity
- PCI Express: Integrated PCIe endpoint blocks for high-speed communication
- Gigabit Transceivers: Built-in GTX transceivers supporting multi-gigabit serial communication
Package Details:
- Package Type: FF784 (Flip Chip Fine Pitch BGA)
- Speed Grade: -L1 (Low power variant optimized for reduced power consumption)
- Operating Temperature: Extended commercial temperature range
- Pin Count: 784 pins in BGA configuration
The XC6VLX75T-L1FF784C incorporates advanced 40nm process technology, ensuring optimal power efficiency while maintaining high performance characteristics essential for modern FPGA applications.
Price
Pricing for the XC6VLX75T-L1FF784C varies based on quantity, supplier, and market conditions. The device is typically positioned in the mid-to-high range of Virtex-6 pricing due to its substantial logic capacity and integrated features.
Pricing Considerations:
- Unit pricing decreases significantly with volume purchases
- Available through authorized Xilinx distributors and electronic component suppliers
- Pricing may fluctuate based on market demand and semiconductor supply conditions
- Extended lifecycle support ensures long-term availability for industrial applications
For current XC6VLX75T-L1FF784C pricing and availability, contact authorized distributors or check electronic component marketplaces for real-time quotes.
Documents & Media
Comprehensive documentation supports XC6VLX75T-L1FF784C implementation and development:
Technical Documentation:
- Virtex-6 FPGA Data Sheet (DS150) containing detailed electrical specifications
- Virtex-6 FPGA Configuration User Guide for programming and configuration procedures
- Virtex-6 FPGA Memory Interface Solutions User Guide for memory controller implementation
- Package and Pinout Specifications for PCB design requirements
Development Resources:
- Vivado Design Suite compatibility for modern FPGA development workflows
- ISE Design Suite support for legacy development environments
- Reference designs and application notes specific to Virtex-6 LXT applications
- Simulation models and timing analysis files
Additional Media:
- Product selection guides comparing XC6VLX75T-L1FF784C with other Virtex-6 variants
- Application briefs highlighting key use cases and performance benchmarks
- Training materials and webinars covering Virtex-6 design best practices
Related Resources
The XC6VLX75T-L1FF784C ecosystem includes various supporting components and development tools:
Development Boards:
- Virtex-6 LXT ML605 Evaluation Kit featuring similar device characteristics
- Custom development platforms from third-party vendors
- Prototyping boards optimized for specific application domains
Compatible IP Cores:
- Xilinx LogiCORE IP portfolio supporting the XC6VLX75T-L1FF784C architecture
- Memory controllers for DDR2/DDR3 interfaces
- High-speed communication IP including Ethernet, PCIe, and serial protocols
- DSP and video processing IP cores optimized for Virtex-6 performance
Software Tools:
- Vivado Design Suite for synthesis, implementation, and debugging
- ChipScope Pro for real-time hardware debugging
- System Generator for DSP enabling MATLAB/Simulink integration
- SDK (Software Development Kit) for embedded processor applications
Community Resources:
- Xilinx developer forums with XC6VLX75T-L1FF784C specific discussions
- Application notes and reference designs shared by the development community
- Third-party IP vendors offering compatible solutions
Environmental & Export Classifications
The XC6VLX75T-L1FF784C meets stringent environmental and regulatory requirements:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant ensuring lead-free manufacturing
- REACH regulation compliance for European market requirements
- Conflict minerals reporting in accordance with SEC regulations
- ISO 14001 environmental management system compliance in manufacturing
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC junction temperature
- Extended temperature variants available for industrial applications
- Humidity tolerance meeting JEDEC standards
- ESD protection exceeding industry requirements
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7 under U.S. Export Administration Regulations
- Subject to export licensing requirements for certain international destinations
- Compliance with ITAR (International Traffic in Arms Regulations) where applicable
- Country-specific import/export documentation may be required
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive-grade variants available meeting AEC-Q100 standards
- Military and aerospace grade options for defense applications
- Comprehensive quality assurance testing including burn-in and screening
The XC6VLX75T-L1FF784C represents a mature, well-supported FPGA solution combining proven Virtex-6 architecture with comprehensive development ecosystem support, making it an excellent choice for applications requiring reliable, high-performance programmable logic capabilities.
