Product Specifications
The XC6VLX75T-2FFG784I offers comprehensive specifications that make it ideal for telecommunications, aerospace, defense, and high-performance computing applications:
Core Architecture:
- 75,000 logic cells providing extensive programmable logic capacity
- Virtex-6 LXT architecture optimized for high-speed serial connectivity
- Speed grade -2 for balanced performance and power efficiency
- Advanced 40nm process technology for enhanced performance per watt
Memory and DSP Resources:
- Integrated block RAM totaling 4,824 Kb for efficient data storage
- 288 DSP48E1 slices for high-performance signal processing
- Distributed RAM capabilities for flexible memory implementation
- Advanced memory controllers supporting multiple standards
I/O and Connectivity:
- 480 user I/O pins in FFG784 package configuration
- High-speed serial transceivers for multi-gigabit communications
- Support for various I/O standards including LVDS, LVTTL, and differential signaling
- GTX transceivers capable of up to 6.5 Gbps data rates
Package Details:
- FFG784 Fine-Pitch Ball Grid Array package
- Industrial temperature range (-40ยฐC to +100ยฐC)
- RoHS compliant lead-free package
- Optimized thermal characteristics for reliable operation
Price
The XC6VLX75T-2FFG784I pricing varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. Educational and development pricing may be available for qualifying institutions and projects.
Documents & Media
Essential documentation for the XC6VLX75T-2FFG784I includes:
Technical Documentation:
- Virtex-6 FPGA Data Sheet containing detailed electrical specifications
- Virtex-6 FPGA User Guide with comprehensive implementation guidelines
- Package and pinout documentation for FFG784 configuration
- DC and AC switching characteristics specifications
Design Resources:
- Xilinx Vivado Design Suite compatibility information
- ISE Design Suite legacy support documentation
- Application notes for optimal design implementation
- Reference designs and example projects
Development Tools:
- ChipScope Pro debugging capabilities
- ModelSim simulation support
- Synthesis tool compatibility guides
- Timing closure methodologies
Related Resources
Complementary products and resources for XC6VLX75T-2FFG784I development:
Development Boards:
- Xilinx evaluation boards featuring Virtex-6 LXT devices
- Third-party development platforms supporting the XC6VLX75T-2FFG784I
- Custom carrier board reference designs
Software Tools:
- Xilinx Vivado Design Suite for modern FPGA development
- Legacy ISE Design Suite support for established workflows
- IP core libraries and reference implementations
- Debugging and verification tools
Support Resources:
- Xilinx technical support and documentation portal
- Community forums and design examples
- Training materials and webinar series
- Application-specific design guides
Environmental & Export Classifications
The XC6VLX75T-2FFG784I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- REACH regulation compliance for European markets
- Lead-free package construction
- Halogen-free materials where applicable
Operating Conditions:
- Industrial temperature range: -40ยฐC to +100ยฐC junction temperature
- Commercial and industrial grade options available
- Specified voltage tolerances and power requirements
- Electromagnetic compatibility (EMC) standards compliance
Export Classifications:
- Export Control Classification Number (ECCN) as designated by BIS
- International Traffic in Arms Regulations (ITAR) compliance status
- Country-specific import/export requirements
- End-use restrictions and licensing requirements where applicable
Quality Standards:
- ISO 9001 manufacturing quality standards
- Automotive qualification standards where applicable
- Military and aerospace grade variants available
- Comprehensive reliability testing and qualification
The XC6VLX75T-2FFG784I represents a mature, reliable FPGA solution for applications requiring proven performance, extensive connectivity options, and robust environmental capabilities. Its combination of logic capacity, high-speed transceivers, and comprehensive development tool support makes it an excellent choice for demanding embedded applications across multiple industries.
