Product Specifications
Core Architecture & Performance
The XC6VLX550T-2FFG1760C features 549,888 cells built on advanced 40nm state-of-the-art copper process technology, making it a programmable alternative to custom ASIC solutions. This FPGA utilizes Xilinx’s third-generation ASMBL (Advanced Silicon Modular Block) column-based architecture for optimal performance and flexibility.
Key Technical Specifications
- Family: Virtex-6 LXT (Low-Power Transceiver)
- Logic Cells: 549,888 cells
- Process Technology: 40nm copper technology
- Operating Voltage: 1V core voltage
- Speed Grade: -2 (commercial grade)
- Package Type: 1760FCBGA (Fine-pitch Ball Grid Array)
- I/O Count: 1200 I/O pins
- Pin Count: 1760-pin FCBGA package
- Operating Temperature: Commercial temperature range (0ยฐC to +85ยฐC)
Advanced Features
The XC6VLX550T-2FFG1760C incorporates multiple system-level blocks that enable logic designers to achieve the highest levels of performance and functionality:
- Mixed-Mode Clock Manager (MMCM): Provides zero-delay buffering, frequency synthesis, clock-phase shifting, input jitter filtering, and phase-matched clock division
- High-Speed Transceivers: Support for various data rates with data rates below 480 Mb/s supported by oversampling in FPGA logic
- DSP Slices: Optimized for high-performance digital signal processing applications
- Block RAM: Configurable memory blocks for data storage and buffering
- Built-in System Blocks: Multiple integrated components for enhanced system-level functionality
Price
Current Market Pricing
The XC6VLX550T-2FFG1760C is available through authorized distributors worldwide. Current pricing starts at $5,774.85 for single unit quantities from select distributors.
Stock Availability
- Micro-Semiconductor.com reports 15 pieces in stock
- Multiple authorized distributors maintain inventory for immediate shipment
- Lead times vary depending on quantity requirements and distributor stock levels
Ordering Information
- Part Number: XC6VLX550T-2FFG1760C
- Manufacturer: Xilinx Inc.
- RoHS Compliance: Yes (lead-free)
- Moisture Sensitivity Level: As per JEDEC standards
Documents & Media
Technical Documentation
Essential documentation for the XC6VLX550T-2FFG1760C includes:
- Datasheet: Complete electrical and mechanical specifications
- Family Overview: Virtex-6 FPGA Family Overview (DS150) covering all LXT, SXT, and HXT sub-families
- Data Sheet: DC and Switching Characteristics (DS152) with detailed electrical parameters
- Packaging Specifications: UG365 Virtex-6 FPGA Packaging and Pinout Specifications
- User Guides: Comprehensive implementation and configuration guides
Development Resources
- Software Tools: Xilinx Vivado Design Suite for synthesis and implementation
- Alternative Tools: ISE design tools for legacy support
- Programming Files: Configuration bitstream generation utilities
- Reference Designs: Application-specific implementation examples
Media Files
- High-resolution product images
- Package diagrams and mechanical drawings
- Pin assignment tables and pinout diagrams
- Block diagrams showing internal architecture
Related Resources
Development Platforms
While the XC6VLX550T-2FFG1760C doesn’t have dedicated development boards, engineers commonly use related platforms for prototyping:
- ZedBoard, Basys 3 board, TinyFPGA BX, Nexys4-DDR
- Terasic DE10-Nano, Digilent Arty S7
- Custom carrier boards for production applications
Technical Support
- FPGA technical engineers provide support for pinout information, replacement options, datasheet assistance, programming tools, and starter kits
- Online community forums for design questions and troubleshooting
- Application notes covering common implementation scenarios
- Training materials and webinars
Compatible Products
Virtex-6 Family Alternatives:
- XC6VLX550T-1FFG1760C (speed grade -1)
- XC6VLX550T-3FFG1760C (speed grade -3, highest performance)
- XC6VLX550T-2FF1759E (different package option)
Software Ecosystem
- LabVIEW FPGA: For graphical programming and system integration
- Vivado HLS: High-level synthesis for C/C++ based designs
- SDK: Software development kit for embedded processor integration
- ChipScope Pro: For in-system debugging and verification
Environmental & Export Classifications
Environmental Specifications
The XC6VLX550T-2FFG1760C meets stringent environmental and reliability standards:
Temperature Ranges:
- Commercial: 0ยฐC to +85ยฐC junction temperature
- Storage: -65ยฐC to +150ยฐC
- Operating Humidity: 5% to 95% non-condensing
Power Specifications:
- Core voltage (VCCINT): 0.95V to 1.05V for standard devices
- Auxiliary voltage (VCCAUX): 2.375V to 2.625V
- I/O voltage (VCCO): Variable based on I/O standard
Reliability Standards:
- RoHS compliant (lead-free manufacturing)
- JEDEC moisture sensitivity level classification
- Electrostatic discharge (ESD) protection
- Latch-up immunity per JEDEC standards
Export Classification
Trade Compliance:
- Export Control Classification Number (ECCN): Check current export control lists
- Bureau of Industry and Security (BIS) regulations apply
- International Traffic in Arms Regulations (ITAR): Not applicable for commercial variants
- Country-specific import/export restrictions may apply
Shipping & Handling:
- Anti-static packaging for ESD protection
- Dry pack shipping for moisture-sensitive devices
- Temperature-controlled shipping when required
- Full traceability documentation included
Quality Certifications:
- ISO 9001 manufacturing quality standards
- Xilinx quality assurance protocols
- Component authenticity verification
- Supply chain security compliance
The XC6VLX550T-2FFG1760C represents the pinnacle of FPGA technology, combining high-performance processing capabilities with versatile I/O options in a robust, industry-standard package. Its advanced 40nm process technology and comprehensive feature set make it ideal for demanding applications in telecommunications, aerospace, defense, industrial automation, and high-performance computing systems.
