Product Specifications
The XC6VLX550T-2FFG1759E features an impressive array of configurable logic resources designed for maximum flexibility and performance. This Virtex-6 device incorporates 550,000 logic cells with 68,800 configurable logic blocks (CLBs), providing extensive programmable logic capacity for complex designs. The FPGA includes 1,064 dedicated DSP48E1 slices optimized for high-performance digital signal processing operations, enabling efficient implementation of multiply-accumulate functions and complex mathematical computations.
Memory resources are abundant in the XC6VLX550T-2FFG1759E, featuring 37,440 Kb of total block RAM distributed across 1,560 36Kb block RAM tiles. This substantial memory capacity supports data-intensive applications requiring high-bandwidth internal storage. The device operates at a -2 speed grade, ensuring reliable performance across industrial temperature ranges while maintaining optimal power efficiency.
The integrated GTX transceivers are a standout feature of the XC6VLX550T-2FFG1759E, providing 36 high-speed serial communication channels capable of operating at data rates up to 6.6 Gbps per channel. These transceivers support various industry-standard protocols including PCIe, Ethernet, and custom high-speed serial interfaces, making this FPGA particularly suitable for communication infrastructure and data center applications.
Pricing Information
Pricing for the XC6VLX550T-2FFG1759E varies based on order quantity, distribution channel, and current market conditions. As a high-end Virtex-6 device, this FPGA typically commands premium pricing reflecting its advanced capabilities and extensive resource count. Volume pricing discounts are generally available for production quantities, and authorized distributors may offer competitive pricing for development and prototyping quantities.
For current pricing information on the XC6VLX550T-2FFG1759E, contact authorized Xilinx distributors or visit official pricing portals. Educational discounts may be available for qualifying academic institutions and research organizations.
Documents & Media
Comprehensive technical documentation is available for the XC6VLX550T-2FFG1759E to support design engineers throughout the development process. The primary datasheet provides detailed electrical specifications, timing parameters, and packaging information essential for system integration. Pin assignment documentation includes complete pinout diagrams and I/O banking information for the FFG1759 package.
Design methodology guides offer best practices for implementing designs targeting the XC6VLX550T-2FFG1759E, covering topics such as clocking strategies, power management, and signal integrity considerations. Application notes demonstrate practical implementation examples for common use cases including high-speed serial communications, DSP algorithm implementation, and memory controller designs.
Software support includes compatibility with Xilinx ISE Design Suite and early support in Vivado Design Suite, providing comprehensive tools for synthesis, implementation, and debugging. Reference designs and IP cores specifically optimized for Virtex-6 devices accelerate development timelines and ensure optimal resource utilization.
Related Resources
The XC6VLX550T-2FFG1759E ecosystem includes various development boards and evaluation platforms that facilitate rapid prototyping and system validation. These platforms typically feature the FPGA along with supporting components such as memory interfaces, communication ports, and expansion connectors for custom hardware integration.
Compatible IP cores from Xilinx and third-party vendors extend the functionality of the XC6VLX550T-2FFG1759E, including soft-core processors, communication protocol stacks, and specialized DSP functions. These pre-verified IP blocks reduce development time and risk while ensuring reliable operation.
Training resources and design services are available through Xilinx partners and authorized training centers, helping engineering teams maximize their productivity with the XC6VLX550T-2FFG1759E. Online communities and technical forums provide additional support for troubleshooting and design optimization.
Environmental & Export Classifications
The XC6VLX550T-2FFG1759E complies with international environmental standards including RoHS (Restriction of Hazardous Substances) directive, ensuring lead-free manufacturing processes and reduced environmental impact. The device meets JEDEC standards for moisture sensitivity and electrostatic discharge protection, supporting reliable manufacturing and handling procedures.
Export classification for the XC6VLX550T-2FFG1759E falls under standard commercial semiconductor regulations, though specific applications may require additional export licensing consideration. The device supports commercial temperature ranges (0ยฐC to +85ยฐC) suitable for most industrial applications, with extended temperature variants available for harsh environment deployments.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade options for safety-critical applications. The XC6VLX550T-2FFG1759E undergoes comprehensive testing and qualification procedures to ensure long-term reliability and performance consistency across production lots.
This high-performance FPGA represents an excellent choice for engineers developing next-generation systems requiring substantial logic resources, high-speed connectivity, and proven reliability. The XC6VLX550T-2FFG1759E delivers the performance and flexibility needed for today’s most demanding applications while providing a clear migration path for future design evolution.
