Product Specifications
The XC6VLX550T-2FF1760C offers impressive technical capabilities designed for complex digital implementations. This FPGA features 550,000 logic cells with advanced 6-input look-up tables (LUTs) and flip-flops, providing extensive programmable logic resources for sophisticated designs. The device includes 1,064 maximum I/O pins in the FF1760 package, enabling comprehensive connectivity options for various system architectures.
Key specifications of the XC6VLX550T-2FF1760C include dual-port block RAM totaling 25,344 Kb, supporting efficient data storage and buffering operations. The integrated DSP48E1 slices, totaling 864 units, accelerate mathematical computations essential for signal processing applications. The device operates at a -2 speed grade, ensuring reliable performance across industrial temperature ranges while maintaining optimal power efficiency.
The XC6VLX550T-2FF1760C incorporates 36 GTX transceivers capable of operating at speeds up to 6.6 Gbps, facilitating high-bandwidth serial communications. These transceivers support various protocols including PCIe, SATA, and custom high-speed interfaces, making the device suitable for networking, storage, and data acquisition systems.
Price
Pricing for the XC6VLX550T-2FF1760C varies based on quantity, supplier, and market conditions. Enterprise customers typically receive volume discounts, while development quantities are available through authorized distributors. Contact certified Xilinx distributors for current pricing, lead times, and availability information specific to your project requirements.
The XC6VLX550T-2FF1760C represents significant value for applications requiring high logic density combined with integrated transceivers, often eliminating the need for external serializer/deserializer components and reducing overall system costs.
Documents & Media
Comprehensive technical documentation supports XC6VLX550T-2FF1760C implementation and development. The official datasheet provides detailed electrical characteristics, timing specifications, and package information essential for design planning. Xilinx offers extensive application notes covering topics such as clocking strategies, power management, and transceiver configuration.
Development resources include reference designs, IP cores, and example projects specifically optimized for the XC6VLX550T-2FF1760C architecture. The Xilinx ISE Design Suite provides complete development tools, including synthesis, implementation, and debugging capabilities tailored for Virtex-6 devices.
User guides detail best practices for PCB layout, thermal management, and signal integrity considerations when implementing the XC6VLX550T-2FF1760C in high-performance systems. These resources ensure successful project outcomes and optimal device utilization.
Related Resources
The XC6VLX550T-2FF1760C ecosystem includes evaluation boards and development kits that accelerate prototyping and validation phases. These platforms provide immediate access to device capabilities and serve as reference implementations for custom board designs.
Compatible IP cores extend functionality, offering proven solutions for common interface standards, memory controllers, and processing functions. Third-party tools and partners provide additional software solutions, specialized IP, and design services supporting XC6VLX550T-2FF1760C projects.
Training materials, webinars, and technical forums offer ongoing support for developers working with the XC6VLX550T-2FF1760C, ensuring teams can leverage the full potential of this advanced FPGA platform.
Environmental & Export Classifications
The XC6VLX550T-2FF1760C meets stringent environmental standards required for commercial and industrial applications. The device complies with RoHS directives, ensuring lead-free manufacturing processes and environmental responsibility. Operating temperature ranges and reliability specifications support deployment in challenging environmental conditions.
Export classifications for the XC6VLX550T-2FF1760C follow applicable trade regulations and licensing requirements. Customers should verify current export control status and licensing obligations based on their specific application and destination requirements. Xilinx provides guidance on compliance procedures and documentation necessary for international shipments.
The XC6VLX550T-2FF1760C incorporates advanced process technology that balances performance requirements with power efficiency, supporting green design initiatives while maintaining the computational capabilities demanded by modern electronic systems.
The XC6VLX550T-2FF1760C delivers the advanced FPGA capabilities required for next-generation digital systems, combining high logic density, integrated transceivers, and comprehensive development support in a single, powerful device.
