Product Specifications
Core Architecture
The XC6VLX550T-1FF1760C features Xilinx’s advanced 40nm process technology, delivering optimal power efficiency and performance. Key specifications include:
- Logic Cells: 549,888 logic cells providing extensive programmable resources
- CLB Slices: 68,736 configurable logic block slices for flexible design implementation
- Block RAM: 25,920 Kb of block RAM for efficient data storage and buffering
- DSP Slices: 864 DSP48E1 slices optimized for high-performance signal processing
- GTX Transceivers: 36 high-speed serial transceivers supporting up to 6.6 Gbps
- Speed Grade: -1 speed grade ensuring reliable performance across temperature ranges
- Package: FF1760 BGA package with 1760 pins for comprehensive I/O connectivity
Physical Characteristics
- Package Type: Fine-pitch Ball Grid Array (BGA)
- Pin Count: 1760 pins
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Power Supply: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
Price
The XC6VLX550T-1FF1760C pricing varies based on quantity, distributor, and current market conditions. For the most competitive pricing and volume discounts:
- Contact authorized Xilinx distributors for current quotations
- Pricing typically ranges from $2,000 to $4,000 per unit depending on order volume
- Educational and research institutions may qualify for special pricing programs
- Long-term supply agreements available for production quantities
Note: Prices are subject to change based on market conditions and availability.
Documents & Media
Technical Documentation
Essential resources for the XC6VLX550T-1FF1760C include:
Datasheets & Specifications
- Virtex-6 Family Overview (DS150)
- XC6VLX550T Device-specific datasheet
- DC and AC switching characteristics
- Package and pinout specifications
Design Resources
- Vivado Design Suite compatibility guides
- ISE Design Suite 14.7 support documentation
- IP core integration guidelines
- Timing analysis and closure methodologies
Application Notes
- High-speed design best practices
- Power management strategies
- Signal integrity considerations
- PCB layout recommendations for FF1760 package
Development Tools
- Xilinx Vivado Design Suite
- Legacy ISE Design Suite support
- ChipScope Pro analyzer compatibility
- ModelSim simulation support
Related Resources
Development Boards
Several evaluation and development platforms support the XC6VLX550T-1FF1760C:
- Custom development boards from third-party vendors
- Prototype boards for specific application domains
- High-speed connectivity modules
- Memory interface development kits
Software Tools
- Vivado Design Suite: Primary development environment
- SDK (Software Development Kit): For embedded processor designs
- IP Integrator: Streamlined IP core integration
- Timing Analyzer: Advanced timing closure tools
Support Resources
- Xilinx Community Forums for technical discussions
- Application engineering support
- Training courses and webinars
- Design methodology guides
Compatible Components
- High-speed memory interfaces (DDR3, QDR-II+)
- SerDes interface components
- Clock management solutions
- Power management ICs optimized for Virtex-6
Environmental & Export Classifications
Environmental Compliance
The XC6VLX550T-1FF1760C meets stringent environmental standards:
RoHS Compliance
- Fully RoHS compliant (lead-free)
- Halogen-free options available
- REACH regulation compliant
Environmental Certifications
- ISO 14001 environmental management standards
- WEEE directive compliance
- Conflict minerals reporting compliant
Export Classifications
ECCN (Export Control Classification Number)
- Classification: 3A001.a.7
- License requirements vary by destination country
- Consult current export administration regulations
Country-Specific Considerations
- Export license may be required for certain destinations
- Re-export controls apply
- End-user verification may be necessary for sensitive applications
Compliance Notes
- Subject to U.S. Export Administration Regulations (EAR)
- International Traffic in Arms Regulations (ITAR) considerations for defense applications
- Consult with export compliance specialists for specific application requirements
Quality Standards
- Automotive qualification available (XQR designation)
- Industrial temperature range options
- Extended reliability testing and qualification
- Quality management system ISO 9001 certified manufacturing
The XC6VLX550T-1FF1760C represents a powerful solution for applications requiring high logic density, advanced DSP capabilities, and high-speed connectivity. Its comprehensive feature set makes it suitable for telecommunications infrastructure, medical imaging, aerospace systems, and advanced research applications where performance and reliability are paramount.
