Product Specifications
The XC6VLX550T-1FF1759I features an impressive array of technical specifications that make it ideal for complex digital signal processing and high-speed data applications:
Logic and Memory Resources:
- Logic Cells: 550,153 equivalent logic cells
- Configurable Logic Blocks (CLBs): 8,640 CLBs containing 69,120 slices
- Block RAM: 38,304 Kb total block RAM with 632 36Kb blocks
- Distributed RAM: 1,728 Kb distributed RAM capacity
DSP and Processing:
- DSP48E1 Slices: 864 dedicated DSP slices for high-performance arithmetic operations
- Maximum frequency: Up to 600 MHz performance capability
- Speed Grade: -1 (commercial temperature range)
I/O and Connectivity:
- Package: FF1759 (Fine-Pitch Ball Grid Array)
- Total I/O pins: 1,200 user I/O pins
- High-speed serial transceivers: 36 GTX transceivers supporting up to 6.6 Gbps
- Memory interfaces: Support for DDR3, DDR2, QDRII+, and RLDRAM II
Physical Characteristics:
- Package type: 1759-pin Fine-pitch BGA
- Operating temperature: Commercial (0ยฐC to +85ยฐC)
- Core voltage: 1.0V typical
- Advanced 40nm CMOS process technology
Price
The XC6VLX550T-1FF1759I is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and high logic density. Pricing varies based on order quantity, distribution channel, and current market conditions. For the most current pricing information on the XC6VLX550T-1FF1759I, contact authorized Xilinx distributors or visit official pricing channels. Volume discounts are typically available for large-scale deployments and OEM applications.
Documents & Media
Technical Documentation:
- XC6VLX550T-1FF1759I Datasheet: Complete electrical and timing specifications
- Virtex-6 FPGA User Guide: Comprehensive implementation guidelines
- Package and Pinout Information: Detailed FF1759 package specifications
- AC/DC Switching Characteristics: Timing and power consumption data
Design Resources:
- Vivado Design Suite compatibility information
- ISE Design Suite support documentation
- Reference designs and application notes
- PCB design guidelines for FF1759 package
Software Support:
- Xilinx Vivado Design Suite integration
- IP catalog compatibility
- Simulation model files (VHDL/Verilog)
- Constraint files and example implementations
Related Resources
Development Platforms: The XC6VLX550T-1FF1759I is supported by various development boards and evaluation platforms that enable rapid prototyping and system validation. These platforms provide comprehensive hardware and software ecosystems for accelerated development cycles.
Compatible IP Cores: Extensive library of verified IP cores optimized for the XC6VLX550T-1FF1759I, including networking protocols, signal processing functions, memory controllers, and interface standards. These pre-verified cores significantly reduce development time and ensure reliable implementation.
Design Tools Integration: Full compatibility with Xilinx design tools including Vivado Design Suite, providing advanced synthesis, implementation, and debugging capabilities specifically optimized for Virtex-6 architecture.
Application Examples: The XC6VLX550T-1FF1759I excels in high-bandwidth applications such as 400G networking equipment, advanced radar systems, software-defined radio implementations, and high-performance computing accelerators.
Environmental & Export Classifications
Environmental Compliance: The XC6VLX550T-1FF1759I meets stringent environmental standards including RoHS compliance for lead-free manufacturing processes. The device is manufactured using environmentally responsible processes and materials that comply with international environmental regulations.
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC junction temperature
- Industrial applications: Suitable for controlled environment deployments
- Reliability: MTBF ratings available for mission-critical applications
- ESD protection: Human Body Model (HBM) and Charged Device Model (CDM) certified
Export Classifications: The XC6VLX550T-1FF1759I is subject to U.S. export administration regulations. Export classification details and licensing requirements vary by destination country and end-use application. Customers should verify current export control status and obtain necessary licenses for international shipments.
Quality Standards: Manufactured in ISO 9001 certified facilities with comprehensive quality assurance processes. The XC6VLX550T-1FF1759I undergoes rigorous testing including functional verification, thermal cycling, and long-term reliability assessment to ensure consistent performance across production lots.
Packaging and Handling: Anti-static packaging and handling procedures are required to prevent electrostatic discharge damage. Moisture sensitivity level and storage requirements are specified in the device handling guidelines to maintain product integrity throughout the supply chain.
The XC6VLX550T-1FF1759I represents the pinnacle of Virtex-6 LXT series performance, delivering exceptional logic density, advanced connectivity options, and proven reliability for the most demanding FPGA applications.
