1. Product Specifications
Core Architecture
- Family: Virtex-6 LXT (Logic and Transceiver)
- Logic Elements/Cells: 364,032 cells
- Process Technology: 40nm CMOS copper process
- Advanced Silicon Modular Block (ASMBL): Third-generation column-based architecture
Memory and Logic Resources
- Configurable Logic Blocks (CLBs): 28,440
- Total RAM Bits: 15,335,424 bits
- Block RAM: 14,976 kbit embedded block RAM/FIFOs
- DSP Slices: High-performance DSP48E1 slices for signal processing applications
Input/Output Specifications
- I/O Pins: 600 high-performance I/O
- Package Type: 1156-FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 35mm x 35mm FCBGA
- Pin Count: 1156 pins
Electrical Characteristics
- Core Voltage (VCCINT): 1.0V nominal
- Supply Voltage Range: 0.95V to 1.05V
- Operating Temperature Range: 0°C to +85°C (TJ – Junction Temperature)
- Speed Grade: -3 (Commercial grade)
Connectivity Features
- GTX Transceivers: High-speed serial transceivers up to 6.6 Gb/s data rate
- PCI Express: Integrated PCI Express Base Specification Revision 2.0 support
- Ethernet MAC: Tri-mode Ethernet MAC (TEMAC) blocks for 10/100/1000 Mb/s and 2.5 Gb/s
- Clock Management: Mixed-Mode Clock Manager (MMCM) blocks for advanced clocking
Advanced Features
- SelectIO Technology: Advanced I/O standards support
- Configuration Security: AES encryption capability for bitstream protection
- Partial Reconfiguration: Dynamic reconfiguration support
- Memory Interface: DDR3/DDR2 memory controller support
2. Price
The XC6VLX365T-3FFG1156C pricing varies based on quantity, distributor, and market conditions. Current market information indicates:
- Availability: In stock at multiple authorized distributors
- Packaging: Anti-static tray packaging with ESD protection
- Lead Time: Typically 3-168 hours for immediate stock
- Minimum Order: Contact authorized distributors for specific quantity requirements
For current pricing and volume discounts, please contact authorized AMD Xilinx distributors or electronic component suppliers. Price quotations are typically provided within 24 hours for specific quantity requirements.
3. Documents & Media
Technical Documentation
- Primary Datasheet: Virtex-6 Family Overview (DS150)
- User Guides: Virtex-6 FPGA Configuration Guide
- Application Notes: Virtex-6 FPGA CLB User Guide
- Pin-out Specifications: Virtex-6 FPGA Packaging and Pinout Specifications
Development Tools
- Design Software: AMD Xilinx Vivado Design Suite (recommended)
- Legacy Support: ISE Design Suite compatibility
- IP Cores: Comprehensive IP library including LogiCORE solutions
- Development Kits: Compatible with various Virtex-6 development boards
Support Resources
- Technical Support: AMD Xilinx Technical Information Portal
- Community Forums: Xilinx Developer Community
- Training Materials: Online tutorials and documentation
- Application Examples: Reference designs and implementation guides
4. Related Resources
Compatible Development Platforms
- ZedBoard: Popular Zynq-based development platform
- Nexys4-DDR: Educational FPGA development board
- Custom Carrier Boards: Various third-party development solutions
Software Ecosystem
- Vivado HLS: High-Level Synthesis for C/C++ to RTL conversion
- SDK: Software Development Kit for embedded applications
- PetaLinux: Linux distribution for Xilinx devices
- Third-party Tools: ModelSim, Questa, and other simulation tools
Application Areas
- Telecommunications: Base station processing, network infrastructure
- Aerospace & Defense: Radar systems, signal intelligence, secure communications
- Industrial Automation: High-speed control systems, machine vision
- High-Performance Computing: Acceleration cards, data center applications
- Medical Equipment: Digital signal processing, imaging systems
Alternative Products
- XC6VLX365T-2FFG1156C: Lower speed grade variant
- XC6VLX550T: Higher capacity option within Virtex-6 family
- UltraScale+ Series: Next-generation AMD Xilinx FPGA families
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free and RoHS compliant
- REACH Regulation: Compliant with EU chemical safety standards
- Conflict Minerals: Conflict-free sourcing certification
- ISO Standards: Manufacturing under ISO 9001 quality management
Operating Environment
- Commercial Grade: Suitable for standard commercial applications
- Temperature Rating: 0°C to +85°C junction temperature
- Humidity: Standard commercial humidity specifications
- Altitude: Suitable for standard commercial altitude operations
Export Control Classification
- ECCN: Export Control Classification Number as per US Commerce Department
- Country Restrictions: Subject to US export administration regulations
- End-Use Monitoring: Requires end-use certification for certain applications
- Military Applications: May require additional export licenses
Quality Certifications
- Manufacturing Standards: Built in ISO-certified facilities
- Quality Assurance: Comprehensive testing and validation
- Reliability Standards: Military-grade reliability testing
- Traceability: Full manufacturing traceability and lot control
Packaging and Handling
- ESD Protection: Anti-static packaging with Faraday cage performance
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classified
- Storage Requirements: Controlled temperature and humidity storage
- Shipping: Global express shipping with ESD protection protocols
Manufacturer: AMD Xilinx, Inc.
Part Status: Active production
Product Category: Embedded FPGAs (Field Programmable Gate Array)
Series: Virtex-6 LXT Family
For the most current specifications, pricing, and availability of the XC6VLX365T-3FFG1156C, please consult official AMD Xilinx documentation and authorized distributors.
