Product Specification
The XC6VLX365T-3FF1759C features a robust architecture built on 40nm technology, offering outstanding performance characteristics for complex digital designs. This FPGA incorporates 365,440 logic cells with 45,900 slices, providing extensive programmable resources for sophisticated applications.
Key specifications of the XC6VLX365T-3FF1759C include 832 user I/O pins in a 1759-pin Flip Chip Ball Grid Array (FCBGA) package. The device operates at a -3 speed grade, ensuring optimal timing performance for high-frequency applications. Memory resources consist of 25,740 Kbits of block RAM and 1,824 Kbits of distributed RAM, supporting complex data processing requirements.
The XC6VLX365T-3FF1759C integrates 576 DSP48E1 slices for efficient digital signal processing operations, making it ideal for applications requiring intensive mathematical computations. The device supports multiple I/O standards including LVDS, SSTL, and HSTL, ensuring compatibility with various system interfaces.
Price
Pricing for the XC6VLX365T-3FF1759C varies based on order quantity, supplier, and market conditions. Commercial distributors typically offer competitive pricing with volume discounts available for bulk purchases. The XC6VLX365T-3FF1759C represents a premium FPGA solution, with pricing reflecting its advanced capabilities and high-performance specifications.
For current XC6VLX365T-3FF1759C pricing information, contact authorized Xilinx distributors or semiconductor suppliers. Many suppliers offer sample quantities and engineering support services alongside competitive pricing structures for production volumes.
Documents & Media
Comprehensive documentation supports the XC6VLX365T-3FF1759C development process, including detailed datasheets, user guides, and application notes. The official Xilinx datasheet provides complete electrical and timing specifications, pinout information, and packaging details for the XC6VLX365T-3FF1759C.
Development resources include reference designs, evaluation boards, and software tools specifically designed for XC6VLX365T-3FF1759C implementation. Xilinx ISE Design Suite and Vivado Design Suite provide complete development environments supporting the XC6VLX365T-3FF1759C throughout the design flow from synthesis to implementation.
Technical documentation covers power management, thermal considerations, and PCB design guidelines essential for successful XC6VLX365T-3FF1759C integration. Application notes demonstrate best practices for utilizing the device’s advanced features and optimizing performance.
Related Resources
The XC6VLX365T-3FF1759C ecosystem includes various development tools, evaluation platforms, and support resources. Xilinx development boards featuring the XC6VLX365T-3FF1759C enable rapid prototyping and system validation, accelerating time-to-market for new designs.
IP cores and reference designs specifically optimized for the XC6VLX365T-3FF1759C are available through Xilinx and third-party providers. These resources include communication protocols, signal processing functions, and interface controllers that leverage the device’s capabilities.
Training materials, webinars, and technical support services help engineers maximize the XC6VLX365T-3FF1759C potential in their applications. Community forums and knowledge bases provide additional resources for troubleshooting and optimization guidance.
Environmental & Export Classifications
The XC6VLX365T-3FF1759C meets stringent environmental and regulatory standards for commercial and industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing processes.
Operating temperature range for the XC6VLX365T-3FF1759C spans commercial (0°C to +85°C) and industrial (-40°C to +100°C) grades, depending on the specific ordering code variant. The device maintains reliable operation across these temperature ranges while meeting specified performance criteria.
Export classification information for the XC6VLX365T-3FF1759C is available through official Xilinx documentation, ensuring compliance with international trade regulations. The device classification supports global distribution while maintaining appropriate security standards for technology exports.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade qualifications where applicable. The XC6VLX365T-3FF1759C undergoes comprehensive testing and validation procedures to ensure consistent performance and reliability across production lots.
The XC6VLX365T-3FF1759C represents a powerful FPGA solution combining high performance, extensive resources, and proven reliability for demanding applications across telecommunications, aerospace, defense, and industrial markets.
