Product Specifications
The XC6VLX240T-3FF1759C delivers outstanding performance characteristics designed for complex digital signal processing and data-intensive applications. This Virtex-6 LXT FPGA features 241,152 logic cells with 37,680 slices, providing substantial computational resources for parallel processing tasks. The device includes 768 DSP48E1 slices optimized for high-speed arithmetic operations, enabling efficient implementation of digital filters, transforms, and signal processing algorithms.
Memory resources include 14.976 Mb of block RAM distributed across 416 36Kb blocks, supporting large data buffers and complex memory hierarchies. The XC6VLX240T-3FF1759C incorporates 24 GTX transceivers capable of operating at speeds up to 6.6 Gbps, facilitating high-speed serial communication protocols including 10 Gigabit Ethernet, PCI Express, and SATA.
The device operates with a -3 speed grade, ensuring reliable performance across industrial temperature ranges. The FF1759 package provides 1,759 pins in a flip-chip BGA format, offering extensive I/O connectivity with support for various voltage standards. Power consumption is optimized through advanced 40nm process technology, balancing performance with energy efficiency.
Price
Pricing for the XC6VLX240T-3FF1759C varies based on quantity, distribution channel, and market conditions. Contact authorized Xilinx distributors or sales representatives for current pricing information, volume discounts, and availability. The XC6VLX240T-3FF1759C represents a premium FPGA solution with pricing reflecting its advanced capabilities and high-performance specifications.
Documents & Media
Comprehensive technical documentation supports the XC6VLX240T-3FF1759C implementation and design process. The official Xilinx datasheet provides detailed electrical characteristics, timing specifications, and package information essential for system design. Reference manuals include pin-out diagrams, power consumption data, and thermal management guidelines.
Development resources encompass application notes covering design best practices, implementation strategies, and optimization techniques specific to Virtex-6 LXT devices. The Xilinx website provides access to development tools including Vivado Design Suite and ISE Design Suite, along with IP cores and reference designs tailored for the XC6VLX240T-3FF1759C.
Training materials and webinars offer guidance on FPGA design methodologies, timing closure techniques, and advanced features utilization. User guides detail configuration procedures, debugging approaches, and system integration considerations for successful project implementation.
Related Resources
The XC6VLX240T-3FF1759C ecosystem includes development boards, evaluation kits, and reference platforms enabling rapid prototyping and system validation. Xilinx partners offer specialized modules and carrier cards incorporating the XC6VLX240T-3FF1759C for specific application domains.
Software tools support includes synthesis, place-and-route, and verification solutions optimized for Virtex-6 architecture. Third-party IP providers offer pre-verified cores for common functions including networking protocols, video processing, and cryptographic algorithms compatible with the XC6VLX240T-3FF1759C.
Design services and consulting support are available through Xilinx Alliance Partners, providing expertise in FPGA implementation, system optimization, and product development. Online communities and forums facilitate knowledge sharing and technical support among XC6VLX240T-3FF1759C users and developers.
Environmental & Export Classifications
The XC6VLX240T-3FF1759C complies with international environmental standards including RoHS directive requirements for lead-free manufacturing processes. The device meets JEDEC moisture sensitivity level specifications and undergoes qualification testing to automotive and industrial standards where applicable.
Export classification information is available through official Xilinx channels, with appropriate compliance documentation for international shipping and regulatory requirements. The XC6VLX240T-3FF1759C may be subject to export control regulations depending on end-use applications and destination countries.
Environmental operating conditions span commercial and industrial temperature ranges, with detailed specifications provided in official documentation. Proper thermal management and power supply design ensure reliable operation across specified environmental conditions. The device packaging incorporates halogen-free materials supporting green manufacturing initiatives and environmental sustainability requirements.
The XC6VLX240T-3FF1759C represents a sophisticated FPGA solution combining high-performance processing capabilities with comprehensive development support, making it an excellent choice for advanced electronic system designs requiring substantial computational resources and high-speed connectivity.
