Product Specifications
Core Features of XC6VLX130T-L1FFG784C
- Logic Cells: 130,760 logic cells providing extensive programmable logic capacity
- Package Type: FFG784 – Fine-pitch Ball Grid Array with 784 pins
- Speed Grade: -L1 Low Power variant optimized for reduced power consumption
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Supply Voltage: 1.0V core voltage with multiple I/O voltage support
Technical Specifications
- CLB Slices: 20,480 slices with advanced 6-input LUT architecture
- Block RAM: 4,824 Kb total block RAM capacity
- DSP Slices: 192 DSP48E1 slices for high-performance signal processing
- GTX Transceivers: 8 integrated 6.5 Gbps GTX transceivers
- I/O Pins: Up to 600 user I/O pins depending on configuration
- Clock Management: 12 Clock Management Tiles (CMTs) with PLLs and DCMs
- Configuration Memory: Flash-based configuration with multiple boot options
Performance Characteristics
The XC6VLX130T-L1FFG784C delivers industry-leading performance with optimized power efficiency. The -L1 speed grade ensures reliable operation while maintaining low power consumption, making it ideal for battery-powered and thermally-constrained applications.
Price Information
Contact authorized Xilinx distributors for current XC6VLX130T-L1FFG784C pricing and availability. Pricing varies based on order quantity, lead times, and specific customer requirements. Volume discounts are typically available for production quantities.
Price Factors:
- Unit quantity and volume tiers
- Lead time requirements
- Package and speed grade specifications
- Regional availability and shipping
Documents & Media
Official Documentation
- Datasheet: Virtex-6 Family Overview (DS150)
- User Guide: Virtex-6 FPGA Configurable Logic Block User Guide
- Package Information: FFG784 Package Specifications and Pin Assignments
- Power Estimation: XPower Analyzer documentation and power reports
- Design Guidelines: PCB design recommendations for FFG784 package
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE 14.7 and earlier versions
- IP Cores: Access to Xilinx LogiCORE IP portfolio
- Reference Designs: Example projects and application notes
- Simulation Models: VHDL and Verilog simulation libraries
Technical Documentation
Complete technical documentation for the XC6VLX130T-L1FFG784C is available through Xilinx documentation portal, including detailed electrical characteristics, timing specifications, and application guidance.
Related Resources
Development Boards and Kits
- ML605 Evaluation Kit: Full-featured development platform for Virtex-6 LXT FPGAs
- Third-party Development Boards: Various commercial and educational development platforms
- Custom PCB Design Resources: Reference schematics and layout guidelines
Software Tools
- Xilinx ISE Design Suite: Complete FPGA design flow from synthesis to implementation
- ChipScope Pro: Integrated logic analyzer for debugging
- CORE Generator: IP core customization and generation tool
- PlanAhead: Advanced floorplanning and analysis tool
Application Areas
The XC6VLX130T-L1FFG784C excels in applications requiring high-speed serial connectivity combined with substantial logic resources, including wireless base stations, medical imaging systems, video processing equipment, and industrial automation controllers.
Technical Support
- Xilinx Support Portal: Access to technical documentation and support resources
- Community Forums: User community discussions and troubleshooting
- Application Engineering: Direct technical support for complex design challenges
- Training Programs: Design methodology and tool training courses
Environmental & Export Classifications
Environmental Compliance
The XC6VLX130T-L1FFG784C meets stringent environmental standards ensuring reliable operation across diverse conditions and regulatory compliance.
RoHS Compliance: Fully compliant with RoHS (Restriction of Hazardous Substances) directives, containing no lead, mercury, cadmium, hexavalent chromium, or restricted flame retardants.
REACH Regulation: Compliant with European REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) requirements for chemical safety.
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 85% relative humidity, non-condensing
- Altitude: Operational up to 2000 meters above sea level
Export Classification
ECCN (Export Control Classification Number): Subject to US export administration regulations. Verify current export classification with official sources before international shipment.
Country of Origin: Manufactured in accordance with Xilinx global manufacturing standards with full traceability.
Quality Standards
- ISO 9001: Manufactured under ISO 9001 quality management systems
- Automotive Grade: Available in automotive-qualified versions for automotive applications
- Reliability Testing: Extensive qualification testing including temperature cycling, thermal shock, and accelerated aging
Package Handling
The FFG784 package requires proper ESD (Electrostatic Discharge) handling procedures and moisture sensitivity level (MSL) precautions during storage and assembly processes.
Keywords: XC6VLX130T-L1FFG784C, Xilinx Virtex-6 FPGA, FFG784 package, low power FPGA, GTX transceivers, programmable logic, high-speed serial communication, embedded processing
