Product Specification
The XC6VLX130T-2FFG484C features impressive technical specifications that make it suitable for complex digital designs. This FPGA contains 130,760 logic cells with 20,480 CLB slices, providing substantial processing capability for parallel operations. The device includes 264 dedicated DSP48E1 slices optimized for high-performance arithmetic operations and digital signal processing tasks.
Memory resources include 4,824 Kb of block RAM distributed across 201 36Kb blocks, offering flexible data storage options. The XC6VLX130T-2FFG484C supports up to 12 GTX transceivers capable of operating at speeds up to 6.6 Gbps, enabling high-speed serial communication protocols. The device operates with a -2 speed grade, indicating commercial temperature range operation from 0°C to +85°C.
The FFG484 package provides 484 pins in a fine-pitch BGA format, measuring 23mm x 23mm with a 1.0mm ball pitch. This compact footprint allows for efficient board layout while maintaining excellent thermal characteristics. The XC6VLX130T-2FFG484C supports multiple I/O standards including LVDS, LVTTL, and high-speed differential signaling.
Price
The XC6VLX130T-2FFG484C pricing varies based on quantity, supplier, and market conditions. Typical unit pricing ranges from $400 to $800 for single quantities, with significant volume discounts available for production orders. Educational institutions and development projects may qualify for special pricing through Xilinx University Program partnerships.
Authorized distributors often provide competitive pricing along with technical support and rapid delivery options. The XC6VLX130T-2FFG484C remains competitively priced within the high-performance FPGA market segment, offering excellent price-to-performance ratio for demanding applications requiring both logic density and high-speed connectivity.
Documents & Media
Comprehensive documentation supports the XC6VLX130T-2FFG484C development process. The primary datasheet provides detailed electrical specifications, timing parameters, and package information essential for design implementation. Pin-out diagrams and package drawings facilitate PCB layout and mechanical design considerations.
The Virtex-6 FPGA Configuration User Guide offers step-by-step instructions for device programming and configuration management. Memory interface solutions guides provide detailed implementation guidance for DDR3, QDR-II+, and other high-speed memory interfaces. Application notes cover specific design techniques, power management strategies, and signal integrity considerations.
Xilinx provides reference designs and example projects demonstrating optimal use of the XC6VLX130T-2FFG484C capabilities. Video tutorials and webinar recordings offer additional learning resources for engineers new to Virtex-6 architecture. The complete documentation package ensures successful project implementation from concept through production.
Related Resources
The XC6VLX130T-2FFG484C ecosystem includes comprehensive development tools and support resources. Xilinx Vivado Design Suite provides integrated synthesis, implementation, and debugging capabilities optimized for Virtex-6 devices. ChipScope Pro analyzer enables real-time debugging and verification of FPGA designs.
Evaluation boards and development kits accelerate prototype development and proof-of-concept validation. The ML605 evaluation platform specifically supports Virtex-6 LXT devices, providing ready-to-use hardware for immediate development. Reference clock sources, power supplies, and interface circuits simplify system integration.
Third-party IP cores expand functionality with pre-verified communications protocols, processing algorithms, and interface controllers. Memory controllers, PCIe endpoints, and Ethernet MAC implementations reduce development time and ensure reliable operation. Community forums and technical support channels provide ongoing assistance throughout the development lifecycle.
Environmental & Export Classifications
The XC6VLX130T-2FFG484C meets stringent environmental and regulatory requirements for commercial and industrial applications. RoHS compliance ensures lead-free manufacturing processes and environmental responsibility. The device operates reliably across commercial temperature ranges with proper thermal management.
Export classification follows standard semiconductor regulations with specific attention to high-performance computing capabilities. The XC6VLX130T-2FFG484C falls under standard commercial export categories for most applications, though specific end-use restrictions may apply for defense or dual-use applications.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade quality processes. The device undergoes comprehensive testing including temperature cycling, humidity exposure, and mechanical stress validation. Reliability data supports mean time between failure calculations for mission-critical applications.
Environmental impact considerations include packaging materials selection and end-of-life recycling programs. The XC6VLX130T-2FFG484C packaging uses recyclable materials where possible, supporting sustainable electronics design practices. Proper disposal procedures ensure responsible handling of electronic components at end-of-life.
The XC6VLX130T-2FFG484C represents a proven solution for high-performance FPGA applications requiring both processing power and connectivity. Its combination of logic density, DSP resources, and integrated transceivers makes it an excellent choice for next-generation digital systems.
