1. Product Specifications
Core Architecture
The XC6VHX565T-2FFG1923C features Xilinx’s proven 40nm CMOS technology, providing an optimal balance of performance, power efficiency, and cost-effectiveness. This FPGA incorporates 565,760 logic cells with advanced DSP48E1 slices for high-speed mathematical operations.
Key Technical Specifications:
- Logic Cells: 565,760
- Package Type: FFG1923 (Fine-pitch Ball Grid Array)
- Speed Grade: -2 (standard performance)
- I/O Pins: 1,200+ configurable I/O pins
- Block RAM: 38.304 Mb total block RAM
- DSP Slices: 912 DSP48E1 slices
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Supply Voltage: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
Advanced Features:
- High-speed transceivers supporting up to 11.18 Gbps
- PCIe Gen2 x8 endpoint and root port capability
- Advanced clock management with mixed-mode clock managers
- On-chip PowerPC processors (depending on variant)
- Soft Error Mitigation (SEM) support
2. Pricing Information
The XC6VHX565T-2FFG1923C pricing varies based on quantity, distributor, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities exceeding 100 units.
Factors affecting price:
- Order quantity and lead times
- Geographic region and local distributor
- Custom programming and testing requirements
- Market demand and supply chain conditions
3. Documents & Media
Technical Documentation:
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation guidelines and best practices
- Migration Guide: Upgrade path from previous Virtex generations
- Package Information: Detailed pinout diagrams and mechanical specifications
- Power Consumption Guidelines: Thermal management and power estimation tools
Development Resources:
- Vivado Design Suite: Latest development environment compatibility
- ISE Design Suite: Legacy tool support for existing projects
- IP Core Libraries: Pre-verified intellectual property blocks
- Reference Designs: Application-specific starting templates
- Simulation Models: VHDL/Verilog behavioral and timing models
4. Related Resources
Development Boards:
- ML605 Evaluation Kit: Complete development platform featuring the XC6VHX565T-2FFG1923C
- Custom carrier boards: Third-party solutions for specific applications
- Prototyping accessories: Debug probes, programming cables, and connectors
Compatible IP Cores:
- High-speed communication protocols (Ethernet, PCIe, SATA)
- Digital signal processing functions (FFT, FIR filters, encoders/decoders)
- Memory controllers (DDR3, QDR-II+, RLDRAM-II)
- Video and image processing pipelines
Software Tools:
- ChipScope Pro: Real-time debugging and verification
- System Generator: Model-based design for DSP applications
- EDK (Embedded Development Kit): Processor-centric design flows
- Partial Reconfiguration Tools: Dynamic hardware modification capabilities
5. Environmental & Export Classifications
Environmental Compliance:
The XC6VHX565T-2FFG1923C meets stringent environmental standards for commercial and industrial applications:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Complies with EU chemical safety requirements
- Conflict Minerals: Sourced from verified conflict-free suppliers
- Halogen-Free: Environmentally responsible packaging materials
Export Control Classifications:
- ECCN (Export Control Classification Number): 3A001.a.2
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Manufactured in advanced semiconductor facilities
- Export Licensing: May require export licenses for certain end-use applications and destinations
Quality Standards:
- Automotive Grade: AEC-Q100 qualified variants available
- Military Grade: Extended temperature and screening options
- ISO Certifications: Manufactured under ISO 9001 quality management systems
- Reliability Testing: Comprehensive qualification including thermal cycling, vibration, and shock testing
The XC6VHX565T-2FFG1923C represents the pinnacle of FPGA technology, delivering exceptional performance for next-generation electronic systems requiring high-speed processing, flexible connectivity, and reliable operation in demanding environments.
