Product Specifications
The XC6VHX565T-2FF1924E features an impressive array of technical specifications that position it as a leader in high-performance FPGA solutions. This device incorporates 565,760 logic cells, providing extensive programmable logic resources for complex designs. The FPGA includes 1,064 DSP48E1 slices, enabling efficient implementation of digital signal processing algorithms and high-speed arithmetic operations.
Memory resources in the XC6VHX565T-2FF1924E include 38,304 Kb of block RAM, offering substantial on-chip storage capabilities for data buffering and processing. The device supports 1,924 user I/O pins in the FF1924 package, providing extensive connectivity options for interfacing with external components and systems.
Operating at a speed grade of -2, the XC6VHX565T-2FF1924E delivers optimized performance with balanced power consumption. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and differential signaling options, ensuring compatibility with various system architectures and interface requirements.
Key technical specifications include:
- Logic Cells: 565,760
- DSP Slices: 1,064 DSP48E1
- Block RAM: 38,304 Kb
- User I/O: 1,924 pins
- Package: FF1924 (Fine-pitch Ball Grid Array)
- Speed Grade: -2
- Operating Temperature Range: Commercial (0ยฐC to +85ยฐC)
Price
Pricing for the XC6VHX565T-2FF1924E varies depending on order quantity, delivery requirements, and current market conditions. As a high-end FPGA solution, the XC6VHX565T-2FF1924E typically commands premium pricing reflecting its advanced capabilities and extensive feature set.
For current pricing information and volume discounts on the XC6VHX565T-2FF1924E, contact authorized Xilinx distributors or request quotes directly from semiconductor suppliers. Educational institutions and research organizations may qualify for special academic pricing programs.
Factors affecting XC6VHX565T-2FF1924E pricing include global semiconductor market conditions, supply chain availability, and regional distribution channels. Long-term supply agreements and forecast commitments often provide more favorable pricing structures for production applications.
Documents & Media
Comprehensive documentation and technical resources are available for the XC6VHX565T-2FF1924E to support design engineers throughout the development process. Essential documentation includes detailed datasheets, pin-out diagrams, package specifications, and electrical characteristics.
The XC6VHX565T-2FF1924E datasheet provides complete electrical and timing specifications, including DC and AC parameters, power consumption data, and configuration details. Package documentation includes mechanical drawings, pin assignments, and thermal characteristics for the FF1924 package.
Application notes and design guides specific to the XC6VHX565T-2FF1924E offer practical implementation guidance for common use cases including high-speed serial interfaces, memory controllers, and DSP applications. Reference designs and example projects demonstrate optimal utilization of the device’s capabilities.
Additional resources include:
- Product Selection Guide
- Migration and Compatibility Documentation
- Power Estimation Tools and Guidelines
- PCB Design Recommendations
- Thermal Management Guidelines
Related Resources
The XC6VHX565T-2FF1924E integrates seamlessly with Xilinx’s comprehensive development ecosystem, including Vivado Design Suite and legacy ISE tools for design entry, synthesis, and implementation. These professional development environments provide optimized compilation flows specifically tailored for Virtex-6 HXT devices.
IP core libraries and reference designs accelerate development timelines for XC6VHX565T-2FF1924E-based systems. Available IP includes memory controllers, communication interfaces, DSP functions, and protocol stacks optimized for the device architecture.
Development boards and evaluation platforms featuring the XC6VHX565T-2FF1924E enable rapid prototyping and proof-of-concept development. These platforms typically include comprehensive I/O connectivity, power management, and debugging interfaces.
Training resources and technical support services provide additional assistance for XC6VHX565T-2FF1924E implementation, including online tutorials, webinars, and direct engineering support through Xilinx technical support channels.
Environmental & Export Classifications
The XC6VHX565T-2FF1924E meets stringent environmental and regulatory standards required for commercial and industrial applications. The device complies with RoHS (Restriction of Hazardous Substances) directives, ensuring environmentally responsible manufacturing and end-of-life disposal.
Environmental operating conditions for the XC6VHX565T-2FF1924E include commercial temperature range operation from 0ยฐC to +85ยฐC, with extended temperature variants available for specialized applications. The device meets moisture sensitivity level (MSL) requirements for standard assembly processes.
Export classification and trade compliance information for the XC6VHX565T-2FF1924E is available through official export control documentation. The device may be subject to various international trade regulations and export licensing requirements depending on end-use applications and destination countries.
Quality and reliability standards include automotive-qualified variants where applicable, military temperature range options, and extended reliability testing for mission-critical applications. The XC6VHX565T-2FF1924E undergoes comprehensive qualification testing to ensure consistent performance across specified operating conditions.
The XC6VHX565T-2FF1924E represents a pinnacle of FPGA technology, combining massive logic capacity, extensive I/O capabilities, and robust environmental specifications to meet the most demanding application requirements in today’s advanced electronic systems.
