Product Specifications
The XC6VHX565T-2FF1923C delivers outstanding performance through its comprehensive feature set:
Core Architecture:
- Logic Cells: 566,784 logic cells providing extensive programmable logic capacity
- Look-Up Tables (LUTs): 88,560 6-input LUTs for complex combinational logic
- Flip-Flops: 177,120 flip-flops for robust sequential logic implementation
- Block RAM: 38,304 Kb total block RAM for high-speed data storage
- DSP Slices: 864 DSP48E1 slices optimized for digital signal processing
High-Speed Connectivity:
- GTX Transceivers: 48 GTX transceivers supporting data rates up to 6.6 Gbps
- PCIe Blocks: 4 integrated PCIe blocks for direct system connectivity
- Ethernet MAC: 4 tri-mode Ethernet MAC blocks for network applications
Package and Environmental Specifications:
- Package Type: FF1923 (Fine-pitch Ball Grid Array)
- Speed Grade: -2 (commercial temperature range)
- Operating Temperature: 0°C to +85°C
- Power Supply: Multiple voltage domains (1.0V, 1.8V, 2.5V, 3.3V)
Price
The XC6VHX565T-2FF1923C pricing varies based on quantity, lead time, and supplier. For current pricing information and volume discounts, contact authorized Xilinx distributors or visit official semiconductor marketplaces. Pricing typically reflects the device’s position as a premium FPGA solution with extensive resources and high-speed capabilities.
Documents & Media
Technical Documentation:
- XC6VHX565T-2FF1923C Datasheet: Complete electrical and timing specifications
- Virtex-6 Family Overview: Architecture guide and feature descriptions
- PCB Design Guidelines: Layout recommendations and signal integrity considerations
- Power Management Guide: Power supply design and thermal management
Development Resources:
- Vivado Design Suite: Comprehensive FPGA development environment
- IP Core Library: Pre-verified intellectual property blocks
- Reference Designs: Application-specific implementation examples
- Hardware Debug Tools: ChipScope Pro and integrated logic analyzer
Application Notes:
- High-Speed Serial I/O implementation guides
- DDR3 memory interface design
- Clock management and distribution strategies
- Power optimization techniques
Related Resources
Development Platforms:
- ML605 Evaluation Kit: Complete development platform for Virtex-6 HXT devices
- KC705 Evaluation Kit: Alternative development solution with extensive connectivity
- Custom carrier boards: Third-party solutions for specific applications
Software Tools:
- ISE Design Suite: Legacy development environment with full XC6VHX565T-2FF1923C support
- Vivado Design Suite: Next-generation FPGA development platform
- SDK (Software Development Kit): Embedded software development tools
- ChipScope Pro: Real-time hardware debugging and analysis
IP Cores and Libraries:
- Memory controllers for DDR3, DDR2, and QDR memory interfaces
- Communication protocols including PCIe, Ethernet, and USB
- Digital signal processing libraries and video processing cores
- Cryptographic and security IP blocks
Environmental & Export Classifications
Environmental Compliance: The XC6VHX565T-2FF1923C meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device operates reliably across commercial temperature ranges and maintains performance specifications under various environmental conditions.
Export Classifications:
- ECCN (Export Control Classification Number): Classified under US Department of Commerce regulations
- RoHS Compliant: Meets European Union restrictions on hazardous substances
- REACH Compliant: Conforms to European chemical safety regulations
- Conflict Minerals: Compliant with conflict minerals reporting requirements
Quality and Reliability:
- Automotive Grade: Available in automotive-qualified variants for harsh environment applications
- Military Grade: Extended temperature and radiation-hardened versions available
- Industrial Grade: Enhanced reliability for industrial automation and control systems
The XC6VHX565T-2FF1923C stands as a premier FPGA solution combining high logic density, advanced connectivity, and robust performance characteristics. Its comprehensive feature set and extensive development ecosystem make it an excellent choice for next-generation electronic systems requiring maximum flexibility and performance.
