Product Specifications
The XC6VHX380T-3FFG1923C features robust specifications designed for mission-critical applications:
Core Architecture:
- Logic Cells: 380,000 system gates
- Configurable Logic Blocks (CLBs): Optimized for high-density designs
- Block RAM: Substantial embedded memory resources
- DSP48E1 Slices: Dedicated digital signal processing blocks
Package & Performance:
- Package Type: FFG1923 (Fine-Pitch Ball Grid Array)
- Speed Grade: -3 (highest performance grade)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Pin Count: 1923 pins for maximum I/O flexibility
Advanced Features:
- High-speed transceivers for multi-gigabit communications
- Advanced clock management with multiple PLLs and DCMs
- Low-power design with intelligent power management
- Support for DDR3 memory interfaces
Price Information
Pricing for the XC6VHX380T-3FFG1923C varies based on quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities.
Pricing Factors:
- Unit quantity requirements
- Lead time specifications
- Package and testing options
- Regional availability
Documents & Media
Essential documentation and resources for the XC6VHX380T-3FFG1923C include:
Technical Documentation:
- Product datasheet with complete electrical specifications
- Pin assignment and package mechanical drawings
- Power consumption and thermal management guidelines
- Configuration and programming specifications
Design Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- PCB layout guidelines and recommendations
- Signal integrity design considerations
Software Support:
- ISE Design Suite integration
- IP core compatibility matrix
- Timing analysis and constraint files
- Programming and debugging tools
Related Resources
The XC6VHX380T-3FFG1923C integrates seamlessly with Xilinx’s comprehensive ecosystem:
Development Tools:
- Xilinx Vivado Design Suite
- ISE Design Suite (legacy support)
- ChipScope Pro analyzer for debugging
- System Generator for DSP applications
Compatible Products:
- Virtex-6 HXT family variants
- Supporting memory interfaces (DDR3, QDR-II+)
- High-speed connector solutions
- Power management ICs
Application Areas:
- 400G/1T Ethernet infrastructure
- Radar and electronic warfare systems
- High-frequency trading platforms
- Medical imaging equipment
- Broadcast and professional video
Environmental & Export Classifications
The XC6VHX380T-3FFG1923C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting compliance
- ISO 14001 environmental management standards
Export Classifications:
- Export Control Classification Number (ECCN): Check current regulations
- Country of origin marking requirements
- Anti-dumping duty considerations where applicable
- Technology transfer licensing requirements
Quality Standards:
- Automotive-grade testing available
- Military/aerospace screening options
- Extended temperature range variants
- Enhanced quality and reliability testing
Reliability Specifications:
- MTBF calculations and reliability data
- Qualification test results
- Package stress testing documentation
- Long-term availability commitments
The XC6VHX380T-3FFG1923C represents cutting-edge FPGA technology, combining high performance, reliability, and comprehensive design support to accelerate your most demanding applications. Its advanced architecture and extensive I/O capabilities make it the preferred choice for next-generation system designs requiring maximum processing power and flexibility.
