Product Specification
The XC6VHX380T-3FFG1155C features a robust architecture designed for maximum versatility and performance. This FPGA incorporates 380,000 logic cells with advanced 40nm process technology, providing superior power efficiency and processing capabilities. The device includes 768 DSP48E1 slices for high-performance digital signal processing operations, making it ideal for applications requiring intensive mathematical computations.
Key specifications of the XC6VHX380T-3FFG1155C include a 1155-pin Fine-Pitch Ball Grid Array (FFBGA) package measuring 35mm x 35mm, optimized for high-density board layouts. The device operates with a speed grade of -3, ensuring reliable performance across various operating conditions. With 1,064 user I/Os and support for multiple I/O standards, the XC6VHX380T-3FFG1155C offers exceptional connectivity options for complex system designs.
The FPGA features 19,080 Kb of block RAM, providing ample on-chip memory for data buffering and storage applications. Additionally, the device includes 24 GTX transceivers capable of operating at speeds up to 6.6 Gbps, enabling high-speed serial communication protocols essential for modern networking and communication systems.
Price
Pricing for the XC6VHX380T-3FFG1155C varies based on order quantity, delivery requirements, and current market conditions. As a high-performance FPGA targeting professional and industrial applications, the XC6VHX380T-3FFG1155C is positioned in the premium segment of the market. For current pricing information and volume discounts, contact authorized Xilinx distributors or sales representatives who can provide detailed quotations based on specific project requirements.
The total cost of ownership should consider not only the initial device price but also development tools, support resources, and long-term availability commitments. Xilinx typically provides favorable pricing structures for high-volume applications and multi-year design commitments.
Documents & Media
Comprehensive documentation is available for the XC6VHX380T-3FFG1155C through Xilinx’s official documentation portal. Essential resources include the complete datasheet detailing electrical specifications, timing parameters, and operating conditions. The device packaging information provides mechanical drawings, pin assignments, and thermal characteristics necessary for PCB design and thermal management.
Application notes specific to the XC6VHX380T-3FFG1155C cover implementation guidelines, design optimization techniques, and troubleshooting procedures. The Virtex-6 FPGA User Guide offers comprehensive information about the device architecture, configuration options, and programming methodologies.
Development resources include reference designs, evaluation boards, and software tools compatible with the XC6VHX380T-3FFG1155C. Xilinx provides regular updates to documentation and design files, ensuring developers have access to the latest information and bug fixes.
Related Resources
The XC6VHX380T-3FFG1155C ecosystem includes various development tools and hardware platforms designed to accelerate design cycles and reduce time-to-market. Xilinx ISE Design Suite provides complete development environment support, including synthesis, implementation, and debugging capabilities specifically optimized for Virtex-6 devices.
Evaluation platforms such as the Virtex-6 HXT FPGA Development Kit offer hands-on experience with the XC6VHX380T-3FFG1155C, featuring pre-built examples and demonstration designs. Third-party IP cores and development tools extend the device capabilities, providing specialized functions for communications, signal processing, and embedded processing applications.
Training resources include online courses, webinars, and technical documentation designed to help engineers maximize the potential of the XC6VHX380T-3FFG1155C. Xilinx’s extensive partner network provides additional design services, specialized IP, and application-specific solutions.
Environmental & Export Classifications
The XC6VHX380T-3FFG1155C complies with international environmental standards and regulations, including RoHS (Restriction of Hazardous Substances) directives. The device is manufactured using lead-free processes and materials, meeting European Union environmental requirements for electronic components.
Temperature specifications for the XC6VHX380T-3FFG1155C include commercial (0ยฐC to +85ยฐC) and industrial (-40ยฐC to +100ยฐC) operating ranges, depending on the specific ordering code and package configuration. The device meets JEDEC standards for moisture sensitivity and electrostatic discharge protection.
Export classification information indicates that the XC6VHX380T-3FFG1155C may be subject to export control regulations depending on the destination country and intended application. Users should consult current export control lists and obtain necessary licenses for international shipments or applications involving sensitive technologies.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade qualifications where applicable. The XC6VHX380T-3FFG1155C undergoes comprehensive testing procedures to ensure reliability and performance consistency across production lots, making it suitable for mission-critical applications requiring long-term operational stability.
