Product Specifications
The XC6VHX380T-2FFG1924I features robust architecture designed for maximum performance:
Core Specifications:
- Logic Cells: 380,000 equivalent logic cells
- CLB Slices: 59,280 configurable logic block slices
- Block RAM: 1,440 Kb total block RAM capacity
- DSP Slices: 864 DSP48E1 slices for high-speed arithmetic operations
- Package Type: FFG1924 (Fine-Pitch Ball Grid Array)
- Speed Grade: -2 (balanced performance and power consumption)
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
I/O and Connectivity:
- User I/O Pins: Up to 600 user I/O pins
- High-Speed Transceivers: 24 GTH transceivers supporting up to 6.6 Gbps
- Memory Interfaces: Support for DDR3, QDR II+, and RLDRAM II
- Package Dimensions: 45mm x 45mm BGA package
Power and Performance:
- Supply Voltage: 1.0V core, 1.8V/2.5V/3.3V I/O
- Maximum System Clock: 600+ MHz performance capability
- Power Efficiency: Optimized for low-power applications
Price
The XC6VHX380T-2FFG1924I is positioned as a premium FPGA solution. Pricing varies based on quantity and supplier:
Typical Pricing Structure:
- Single Unit: Contact authorized distributors for current pricing
- Volume Pricing: Significant discounts available for quantities of 100+ units
- Development Kits: Evaluation boards available separately
- Long-term Availability: Supported through Xilinx’s product longevity program
For the most current XC6VHX380T-2FFG1924I pricing and availability, consult authorized Xilinx distributors or the official Xilinx website.
Documents & Media
Comprehensive documentation supports the XC6VHX380T-2FFG1924I implementation:
Technical Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Virtex-6 FPGA configuration and implementation guide
- Package Information: FFG1924 package drawings and pinout diagrams
- Application Notes: Design guidelines and best practices
- Errata: Known issues and workarounds
Development Resources:
- Vivado Design Suite: Complete FPGA design environment
- IP Catalog: Pre-verified IP cores and reference designs
- Simulation Models: SPICE and behavioral simulation models
- PCB Design Files: Reference designs and layout guidelines
Training Materials:
- Webinars: Technical training sessions and product overviews
- Video Tutorials: Step-by-step implementation guides
- White Papers: Advanced design techniques and optimization strategies
Related Resources
The XC6VHX380T-2FFG1924I ecosystem includes extensive support resources:
Development Tools:
- Vivado Design Suite: Industry-leading FPGA design software
- SDK (Software Development Kit): Embedded software development environment
- ChipScope Pro: Real-time debugging and verification tools
- System Generator: MATLAB/Simulink integration for DSP applications
Evaluation Platforms:
- Virtex-6 HXT Development Boards: Complete evaluation platforms
- FMC (FPGA Mezzanine Card): Modular I/O expansion options
- Reference Designs: Proven implementations for common applications
Community Support:
- Xilinx Forums: Technical community and peer support
- Application Engineering: Direct technical support services
- Training Courses: Comprehensive FPGA design education
- Partner Network: Third-party IP providers and design services
Compatible Products:
- Virtex-6 Family: Other Virtex-6 LXT and SXT variants
- Development Tools: Compatible with current Xilinx tool chain
- IP Cores: Extensive library of verified intellectual property
Environmental & Export Classifications
The XC6VHX380T-2FFG1924I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant: Lead-free and environmentally friendly manufacturing
- REACH Regulation: European chemical safety compliance
- Conflict Minerals: Compliant with conflict minerals regulations
- Green Product: Meets Xilinx environmental sustainability standards
Quality Standards:
- ISO 9001: Quality management system certification
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: Extended operating temperature range
- Reliability Testing: Comprehensive qualification and stress testing
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.2
- Export Restrictions: Subject to U.S. export administration regulations
- International Compliance: Meets global trade compliance requirements
- Documentation: Complete export classification documentation available
Packaging and Shipping:
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level 3)
- ESD Protection: Proper electrostatic discharge handling required
- Storage Requirements: Controlled temperature and humidity storage
- Traceability: Full supply chain traceability and documentation
The XC6VHX380T-2FFG1924I represents cutting-edge FPGA technology, combining high performance with comprehensive development support for demanding applications in aerospace, defense, communications, and high-performance computing markets.
