Product Specifications
The XC6VHX380T-2FFG1923E delivers outstanding performance with its comprehensive feature set:
Core Architecture:
- Logic Cells: 380,160 logic cells providing extensive programmable resources
- CLB Slices: 59,400 configurable logic blocks for flexible design implementation
- Block RAM: 1,344 blocks (24.2 Mb total) for high-speed data storage
- DSP48E1 Slices: 384 dedicated DSP slices for signal processing applications
Memory and Processing:
- Distributed RAM: 1,548 Kb for fast access memory requirements
- Maximum Operating Frequency: Up to 600 MHz for time-critical applications
- Speed Grade: -2 performance rating ensuring reliable high-speed operation
Package Details:
- Package Type: FFG1923 (Fine-Pitch Ball Grid Array)
- Pin Count: 1,923 pins for extensive I/O connectivity
- Package Size: 45mm x 45mm compact form factor
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
Connectivity Features:
- High-speed serial transceivers for advanced communication protocols
- Multiple I/O standards support including LVDS, SSTL, and HSTL
- PCIe, Ethernet, and other high-speed interface compatibility
Price
The XC6VHX380T-2FFG1923E pricing varies based on quantity, distributor, and current market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. Educational institutions and development programs may qualify for special pricing considerations.
Documents & Media
Technical Documentation:
- Product Data Sheet: Comprehensive specifications and electrical characteristics
- User Guide: Detailed implementation guidelines and best practices
- Application Notes: Design examples and optimization techniques
- Errata Documentation: Known issues and recommended workarounds
Design Resources:
- Reference designs and example projects
- Timing and power estimation tools
- Package and pinout information
- Layout guidelines and PCB design recommendations
Software Support:
- Xilinx Vivado Design Suite compatibility
- ISE Design Suite legacy support
- IP Core library access
- Simulation and verification tools
Related Resources
Development Tools:
- Xilinx development boards featuring the XC6VHX380T-2FFG1923E
- Evaluation kits and demonstration platforms
- Third-party development solutions and accessories
Technical Support:
- Xilinx Answer Database for troubleshooting
- Community forums and user groups
- Application engineering support services
- Training courses and certification programs
Compatible Products:
- Xilinx Zynq SoC alternatives for system-level integration
- Complementary power management solutions
- High-speed connector and cable assemblies
- Debug and programming tools
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (Restriction of Hazardous Substances)
- REACH regulation compliance for chemical safety
- Conflict minerals reporting compliance
- Halogen-free package options available
Export Control:
- Export Control Classification Number (ECCN): 3A991.a.4
- US Export Administration Regulations (EAR) compliance
- International Traffic in Arms Regulations (ITAR) exempt
- Country-specific import/export documentation requirements
Quality Standards:
- ISO 9001:2015 certified manufacturing
- Automotive qualification standards (AEC-Q100) for automotive variants
- Industrial temperature range options (-40ยฐC to +100ยฐC)
- Extended reliability testing and qualification
Packaging and Handling:
- Moisture sensitivity level (MSL) classification
- Electrostatic discharge (ESD) protection requirements
- Proper storage and handling guidelines
- Lead-free solder compatibility
The XC6VHX380T-2FFG1923E represents the pinnacle of FPGA technology, combining exceptional performance, comprehensive features, and reliable operation for the most demanding applications in telecommunications, aerospace, defense, and high-performance computing markets.
