Product Specification
The XC6VHX380T-2FFG1154C delivers outstanding performance with its comprehensive feature set designed for complex digital signal processing and high-speed communication applications.
Core Architecture:
- Logic Cells: 380,160 logic cells providing extensive programmable resources
- System Gates: Approximately 5.7 million system gates for complex design implementation
- CLB Slices: 59,400 configurable logic block slices with advanced routing capabilities
- Block RAM: 1,344 blocks of 36Kb each, totaling 48.384 Mb of embedded memory
DSP and Processing:
- DSP48E1 Slices: 864 dedicated DSP slices for high-performance arithmetic operations
- Maximum operating frequency optimized for speed grade -2 performance
- Advanced clock management with multiple PLLs and DCMs
I/O and Connectivity:
- Package: FFG1154 Fine-pitch Ball Grid Array with 1154 pins
- User I/O pins: Up to 600 user-configurable I/O pins
- High-speed serial transceivers: 24 GTX transceivers supporting up to 6.6 Gbps
- Memory interface support for DDR3, QDR II+, and RLDRAM II
Power and Thermal:
- Core voltage: 1.0V with multiple power domains
- Operating temperature range: Commercial grade (0ยฐC to +85ยฐC)
- Advanced power management features for optimized energy efficiency
Price
The XC6VHX380T-2FFG1154C pricing varies based on order quantity, distribution channel, and current market conditions. Contact authorized Xilinx distributors for current pricing information and volume discounts. Typical pricing considerations include:
- Unit price decreases with higher volume orders
- Lead times may affect pricing and availability
- Engineering samples available for qualified customers
- Long-term supply agreements available for production quantities
Documents & Media
Technical Documentation:
- Product Data Sheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation guidelines and design recommendations
- Package Information: Mechanical drawings, pin assignments, and thermal data
- Migration Guide: Information for upgrading from previous Virtex generations
Development Resources:
- Reference designs and application notes
- Vivado Design Suite compatibility information
- IP core documentation and licensing details
- Characterization reports and silicon errata
Design Tools:
- ISE Design Suite support files
- Constraint files and pin mapping utilities
- Simulation models for major EDA tools
- Programming and configuration bitstream formats
Related Resources
Development Platforms:
- ML605 Evaluation Board featuring the XC6VHX380T-2FFG1154C
- Custom carrier boards and development modules
- Third-party evaluation platforms and prototyping solutions
Compatible IP Cores:
- High-speed communication protocols (PCIe, Ethernet, InfiniBand)
- Digital signal processing IP (FIR filters, FFT, video processing)
- Memory controllers and interface IP
- Processor cores and embedded systems IP
Design Services:
- Xilinx Alliance Program partners for design consultation
- Training courses and certification programs
- Technical support and design review services
- Migration and optimization consulting
Application Areas:
- Wireless infrastructure and base stations
- High-performance computing and data centers
- Medical imaging and diagnostic equipment
- Aerospace and defense systems
- Test and measurement instrumentation
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (Restriction of Hazardous Substances)
- REACH regulation compliance for European markets
- Halogen-free package options available
- Lead-free soldering compatible with standard reflow profiles
Quality Standards:
- Automotive qualification available (XQR versions)
- Military and aerospace screening options
- Industrial temperature range variants
- Extended reliability testing and qualification data
Export Control:
- ECCN (Export Control Classification Number): Specific classification varies by configuration
- Country of origin marking and documentation provided
- Compliance with international trade regulations
- Export licensing requirements vary by destination and application
Environmental Operating Conditions:
- Operating temperature: 0ยฐC to +85ยฐC (commercial grade)
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity tolerance: Up to 85% non-condensing
- Altitude rating: Up to 2000 meters above sea level
The XC6VHX380T-2FFG1154C represents the pinnacle of FPGA technology for applications demanding maximum performance, flexibility, and reliability. Its combination of high logic density, advanced DSP capabilities, and robust I/O options makes it the ideal choice for next-generation electronic systems requiring cutting-edge programmable logic solutions.
